Electroconductive particle, electroconductive material, and manufacturing method of electroconductive particle
A technology of conductive particles, manufacturing method, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, conductive adhesives, etc., to achieve high reliability, high conductivity, and suppression of reduction in conductivity Effect
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Embodiment 1
[0098] (1) Step 1
[0099] (1-1) Pretreatment
[0100] A spherical styrenic resin having an average particle diameter of 3.0 μm was used as the core particles. 9 g of the spherical styrene-based resin was added to 400 mL of a conditioning aqueous solution ("cleaner conditioner 231" manufactured by Rohm & Haas Electronic Materials) while stirring. Adjust the concentration of the aqueous solution to 40mL / L. Next, stirring was performed for 30 minutes while applying ultrasonic waves at a liquid temperature of 60° C. to perform surface modification and dispersion treatment of the core particles. The aqueous solution was filtered, and 200 mL of slurry was made into the core material particle washed with repulp water once. 200 mL of a stannous chloride aqueous solution was put into this slurry. The concentration of the aqueous solution is 5×10 -3 mol / L. The mixture was stirred at room temperature for 5 minutes to perform a sensitization treatment for adsorbing tin ions to the ...
Embodiment 2～ Embodiment 14
[0121] Except having adopted the conditions shown in the following Table 1, it carried out similarly to Example 1, and obtained electroconductive particle. Like the electroconductive particle of Example 1, the obtained electroconductive particle had a protrusion part on both a base film and an upper layer film.
[0122] [Table 1]
[0123]
[0124]
Embodiment 15
[0126] (1) Step 1
[0127] (1-1) Pretreatment
[0128] The same operation as in Example 1 was carried out.
[0129] (1-2) Formation of a base film with a substantially uniform thickness
[0130]300 mL each of a 224 g / L nickel sulfate aqueous solution (first aqueous solution) and a mixed aqueous solution (second aqueous solution) containing 210 g / L sodium hypophosphite and 80 g / L sodium hydroxide was used. These solutions were continuously added to the slurry of the pretreated core material particles respectively by a quantitative pump, and the electroless plating step was started. The addition rate was set at 2.5 mL / min. After adding the entire amount of the solution, stirring was continued for 5 minutes while maintaining a temperature of 70°C. Then, the solution was filtered, and the filtrate was washed three times, and then dried in a vacuum dryer at 100° C. to form a base film containing a nickel-phosphorus alloy, thereby obtaining particles covered with the base film. ...
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