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Film-like circuit connection material and circuit connection structure

A circuit connection material and electrical connection technology, applied in the direction of structural connection, conductive connection, and electrical component connection of printed circuits, can solve the problems of reduced adhesion and peeling of film-like circuit connection materials, to ensure visibility, reduce Effect of connecting resistors

Inactive Publication Date: 2017-05-24
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When insulating particles are dispersed in the adhesive component, the adhesive force of the film-like circuit connecting material decreases, and peeling at the interface between the substrate and the circuit connection part tends to become a problem.

Method used

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  • Film-like circuit connection material and circuit connection structure
  • Film-like circuit connection material and circuit connection structure
  • Film-like circuit connection material and circuit connection structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0127] 400 parts by mass of polycaprolactone diol with a weight average molecular weight of 800, 131 parts by mass of 2-hydroxypropyl acrylate, 0.5 parts by mass of dibutyltin dilaurate as a catalyst, and 1.0 parts by mass of hydroquinone monomethyl ether as a polymerization inhibitor The parts were mixed by heating to 50°C with stirring. Next, 222 parts by mass of isophorone diisocyanate was dripped, and it heated up to 80 degreeC, stirring further, and performed polyurethane reaction. After confirming that the reaction rate of the isocyanate group was 99% or more, the reaction temperature was lowered to obtain urethane acrylate.

[0128] Using terephthalic acid as dicarboxylic acid, propylene glycol as diol, and 4,4'-diphenylmethane diisocyanate as isocyanate, prepare terephthalic acid / propylene glycol / 4,4'-diphenylmethane diisocyanate Polyester polyurethane resin A in which the molar ratio of isocyanate is 1.0 / 1.3 / 0.25.

[0129] Next, the polyester polyurethane resin A wa...

Embodiment 2～16）

[0133] Such as Figure 5 The film-form circuit-connecting material was produced in the same manner as in Example 1, except that the average particle diameter of the conductive particles, the number of conductive particles, the type of dye, the amount of dye, and the thickness of the film-form circuit-connecting material were changed.

Embodiment 17、18）

[0135] 25 parts by mass of the above-mentioned urethane acrylate, 20 parts by mass of isocyanurate type acrylate (product name: M-325, manufactured by Toagosei Co., Ltd.), 2-methacryloxyethyl 1 part by mass of base acid phosphate (product name: P-2M), 4 parts by mass of benzoyl peroxide (product name: Nyper-BMT-K40) as a free radical generator, and 4 parts by mass as a film-forming polymer 55 parts by mass of a 20% by mass methyl ethyl ketone solution of the polyester polyurethane resin A was mixed, and 0.5 parts by mass of a black dye (product name: NUBIAN BLACK, manufactured by ORIENT Industry Co., Ltd.) was further dispersed and stirred to obtain an adhesive Components of the binder resin solution.

[0136] Furthermore, conductive particles (average particle diameter: 3 μm) having polystyrene particles as nuclei and coating nuclei, an outermost layer containing Ni, and protrusions formed on the surface of the outermost layer were prepared. With respect to the solution of t...

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Abstract

The invention discloses a film-shaped circuit connecting material, which has an adhesive layer interposed between opposite circuit electrodes and used to electrically connect the circuit electrodes to each other, the adhesive layer Contains an adhesive component containing (a) a thermoplastic resin, (b) a curable substance, (c) a curing agent and (d) a dye, and conductive particles having a plastic core and a coating The metal layer of the plastic core body, the outermost layer of the metal layer is a layer formed by plating containing at least one selected from the group consisting of Ni, Ni alloy and Ni oxide, and the conductive particles are The average particle size is 2.0-3.5 μm.

Description

technical field [0001] The present invention relates to a film-like circuit connection material and a circuit connection structure. Background technique [0002] Conventionally, an anisotropic conductive adhesive film is known as a film-shaped circuit connecting material interposed between opposing circuit electrodes and used for electrically connecting electrodes in a direction of application of heat and pressure. For example, an anisotropic conductive adhesive film obtained by dispersing conductive particles in an epoxy-based adhesive or an acrylic adhesive is known. Such an anisotropic conductive adhesive film is mainly used for electrically connecting TCP (Tape Carrier Package) or COF (Chip On Flex) mounted with a semiconductor that drives a liquid crystal display (hereinafter referred to as "LCD") to an LCD panel, Alternatively, TCP or COF is electrically connected to a printed wiring board. [0003] Recently, when semiconductors are mounted face-down directly on LCD ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R11/01C09J9/02C09J175/04C09J201/00H01B5/16H05K1/14H05K3/32
CPCH01R4/04H05K3/323H05K3/361H05K2201/0221C08G18/672C08G18/755C08G18/7671C08G18/4213C09J175/06C09J9/02C09J11/00C08K9/02C08J2363/00C08J2425/08C08J2433/24C08L75/16C08G18/4277H01R11/01H01B5/16H05K1/14C08K3/00
Inventor 立泽贵藤绳贡松田和也小林隆伸久米雅英工藤直
Owner RESONAC CORPORATION
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