Functional graphene-doped epoxy resin conductive adhesive and preparation method thereof

A technology of epoxy resin and graphene, applied in the field of conductive adhesive, can solve problems such as the decline of electrical conductivity, achieve the effects of not easy to fall off and migrate, improve utilization rate, and low silver content

Active Publication Date: 2014-03-05
道尔化成电子材料(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The present invention aims at the disadvantages of the existing epoxy resin conductive adhesives that rely solely on filling flake silver powder to obtain electrical conductivity, and the silver powder is easily oxidized during the curing process, resulting in a decrease in electrical conductivity, and provides a simple method for preparing graphene-silver nanowires. Conductive filler and applied to epoxy resin conduct

Method used

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  • Functional graphene-doped epoxy resin conductive adhesive and preparation method thereof

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Comparison scheme
Effect test

Embodiment 1

[0035] (1) Prepare 1ml of 0.1M silver nitrate aqueous solution and 1ml of 0.1M sodium citrate aqueous solution respectively, then mix and shake well. Add 10ml of deionized water and sonicate for 30 minutes. It was then dropped into 20ml of graphene oxide aqueous solution with a concentration of 1.08mg / ml, ultrasonicated for 30 minutes, poured into a 250ml single-necked flask, and then magnetically stirred for 12 hours at normal temperature with an aluminum film.

[0036] (2) Then heat to 130°C in an oil bath for 3 hours. Afterwards, 0.216 g of sodium citrate was added and the temperature was maintained at 90° C. for 10 hours. Move the product to the platform to cool down to room temperature, and then centrifuge and wash thoroughly with deionized water and ethanol solution. Prepared into 2mg / ml ethanol solution.

[0037] (3) Put 28.8021g of bisphenol A type E-51 epoxy resin, 1.089g of curing agent dicyandiamide and 0.1089g of curing accelerator 2,4,6-tris(dimethylaminomethyl...

Embodiment 2

[0040] (1) Prepare 1ml of silver nitrate aqueous solution with concentration of 0.1M and 1ml of sodium citrate aqueous solution with concentration of 0.05M respectively, then mix and shake well. Add 10ml of deionized water and sonicate for 30 minutes. It was then dropped into 50ml of graphene oxide aqueous solution with a concentration of 1.08mg / ml, ultrasonicated for 30 minutes, poured into a 250ml single-necked flask, and then magnetically stirred for 15 hours at normal temperature with an aluminum film.

[0041] (2) Then heat in an oil bath to 130°C for 3 hours. Afterwards, 1.08 g of sodium citrate was added and the temperature was maintained at 90° C. for 10 hours. Move the product to the platform to cool down to room temperature, and then centrifuge and wash thoroughly with deionized water and ethanol solution. Prepared into 5mg / ml ethanol solution.

[0042] (3) Put 29.1g of bisphenol F type epoxy resin, 0.816g of curing agent dicyandiamide and 0.084g of curing acceler...

Embodiment 3

[0045] (1) Prepare 1ml of 0.1M silver nitrate aqueous solution and 1ml of 0.1M sodium citrate aqueous solution respectively, then mix and shake well. Add 10ml of deionized water and sonicate for 30 minutes. It was then dropped into 50ml of graphene oxide aqueous solution with a concentration of 1.08mg / ml, ultrasonicated for 30 minutes, poured into a 250ml single-necked flask, and then magnetically stirred for 14 hours at normal temperature with an aluminum film.

[0046] (2) Then heat to 130°C in an oil bath for 3 hours. Afterwards, 1.08 g of sodium citrate was added to maintain 90° C. for 10 hours. Move the product to the platform to cool down to room temperature, and then centrifuge and wash thoroughly with deionized water and ethanol solution. Prepared into 5mg / ml ethanol solution.

[0047] (3) Put 30.3125g of bisphenol A type E-51 epoxy resin, 0.8525g of curing agent dicyandiamide and 0.085g of curing accelerator 2,4,6-tris(dimethylaminomethyl)phenol into the The solut...

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Abstract

The invention relates to a functional graphene-doped epoxy resin conductive adhesive and a preparation method thereof, belonging to the technical field of conductive adhesives. The preparation method comprises the following steps: preparing a stably-dispersed graphene oxide colloid (GO) by a Hummers process, and inducing the growth of silver nanowires in situ on the GO laminae to prepare the silver nanowire/graphene nano hybrid material. The in-situ assembly of the silver nanowires and graphene generates a synergistic effect, so that the prepared nano composite material has very high conductivity and processing stability, avoids the phenomenon of aggregation of graphene in the epoxy resin, and can be uniformly dispersed as a filler in the epoxy resin to prepare the conductive adhesive with excellent conductivity. On the basis of the high conductivity of the graphene and silver nanowires, the conductivity and bonding strength of the adhesive are enhanced under given technological conditions; and the adhesive is especially suitable for conductive packaging and bonding of high-end refined electronic and electric apparatus components, and has wide application prospects.

Description

[0001] technical field [0002] The invention relates to a preparation method of high-conductivity silver nanowire functionalized graphene-doped epoxy resin conductive adhesive, belongs to the technical field of conductive adhesive, is an improvement on the prior art, and specifically relates to the raw material of graphene-silver nanowire Bit preparation and its application in epoxy resin. [0003] Background technique [0004] Low electrical and thermal conductivity, poor reliability and high price are the bottlenecks restricting the development of conductive adhesives. Graphene, which has attracted much attention internationally, has ultra-high and unusually stable electrical and thermal conductivity and mechanical strength, and is one of the most promising conductive filling materials. However, the application of graphene in conductive adhesives faces the problem that it is difficult to Large-scale preparation of defect-free single-layer graphene, graphene is easy to a...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J11/04C09J11/06
Inventor 王标兵王玉鹏
Owner 道尔化成电子材料(上海)有限公司
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