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A metal and heat-conducting plastic composite micro-heat exchanger structure

A technology of heat-conducting plastics and micro-heat exchangers, which is applied in heat exchange equipment, lighting and heating equipment, cooling/ventilation/heating transformation, etc. It can solve the problems of harsh thermal environment, unsatisfactory heat exchange devices, and low processing costs. Achieve the effect of fast heat transfer efficiency, good market prospect and low processing cost

Active Publication Date: 2016-04-27
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat generated during the operation of multifunctional and complex systems has greatly increased, and the thermal environment has become increasingly harsh. Traditional heat exchange devices can no longer meet the basic requirements of high efficiency, stable heat exchange, and low processing costs.
Metal microstructure heat exchangers, modified composite polymer heat exchangers, etc. have improved the heat transfer efficiency to a certain extent, but have not been widely used so far. The reason is that the processing is difficult, the heat transfer efficiency is low, and the processing cost is high.

Method used

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  • A metal and heat-conducting plastic composite micro-heat exchanger structure
  • A metal and heat-conducting plastic composite micro-heat exchanger structure
  • A metal and heat-conducting plastic composite micro-heat exchanger structure

Examples

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specific Embodiment approach 1

[0027] The present invention is applied to the heat dissipation application of LED patch lamps, wherein the designed length X width is 121 mm X 35 mm, the metal layer material is Al, the thermal conductivity is 237 W / m·k, and the thickness is set at 1 mm. The thickness of the plastic layer is PPS, the thermal conductivity is set at 20W / m·k, and the thickness of the plastic layer is set at 0.2mm. The metal layer and the plastic layer are connected by a cylinder, and the plastic layer is directly injected into the metal layer. The way of molding, the microstructure of the plastic layer is a hemisphere, such as Figure 4 As shown, the arrangement of the hemispheres is a regular hexagonal structure, and the radius of the hemispheres is 100 μm.

specific Embodiment approach 2

[0028] Applying the invention to the heat dissipation application of large-scale integrated circuits, the material of the metal layer is Al, the thermal conductivity is 237W / m·k, and the thickness is set at 0.2mm. The thickness of the plastic layer is PPS, the thermal conductivity is set at 20W / m·k, and the thickness of the plastic layer is set at 0.2mm. The metal layer and the plastic layer are connected by a dovetail groove. Composite with the metal layer, the microstructure of the plastic layer is a hemisphere, such as Figure 5 As shown, the arrangement of the hemispheres is a regular quadrilateral structure, and the radius of the hemispheres is 100 μm.

specific Embodiment approach 3

[0029] The invention is applied to the thermal heating equipment, and the plastic with the microstructure is compounded on the surface of the heating equipment by molding. The thickness of the plastic layer is set at 0.2mm, such as Figure 6 As shown, the microstructure adopts an ellipsoidal microstructure arranged in an equilateral triangle, and the characteristic size is 100 μm. The material is a modified polymer-based composite material with high thermal conductivity, and the thermal conductivity is between 30-50W / m·k. .

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Abstract

The invention discloses a metal and thermal conductive plastic composite micro heat exchanger structure, and belongs to the technical field of micro heat exchangers. The metal and thermal conductive plastic composite micro heat exchanger structure comprises a substrate metal layer and a thermal conductive plastic layer, wherein the substrate metal layer is used for transmitting heat rapidly, and the thermal conductive plastic layer is used for dissipating the heat sufficiently. The metal and thermal conductive plastic composite micro heat exchanger structure is characterized in that the metal layer serving as a substrate is optimally made of aluminum or nickel or copper or steel or alloy of aluminum, nickel, copper and steel or the like, and the thermal conductive plastic layer is made of polymers and modified polymer matrix composites. The metal and thermal conductive plastic composite micro heat exchanger structure has the advantages of being low in processing difficulty and processing cost, high in heat transfer efficiency and heat dissipation efficiency and the like, can be widely applied to heat dissipation of electronic devices in multifunctional, complex and large-scale integrated circuits, and has good market prospects.

Description

technical field [0001] The invention relates to a novel micro-heat exchanger structure composited with metal and heat-conducting plastic, and belongs to the technical field of micro-heat exchangers. Background technique [0002] With the development of microelectromechanical systems (MEMS) and microchemical mechanical systems, especially the rapid progress of the semiconductor industry and microelectromechanical system industries, people have developed large-scale and ultra-large-scale integrated circuits. As the integration of electronic devices becomes higher and higher, the power consumption and calorific value are also continuously increased, while the physical size is getting smaller and smaller, and the heat flux density of electronic devices is greatly increased. The heat generated during the operation of multifunctional and complex systems has greatly increased, and the thermal environment has become increasingly harsh. Traditional heat exchange devices can no longer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28F21/06F28F21/08H05K7/20
Inventor 吴大鸣姜辉刘颖庄俭张亚军许红
Owner BEIJING UNIV OF CHEM TECH