Thermosetting resin composition and applications thereof
A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of poor dielectric properties, high melt viscosity, poor stability, etc., to achieve low melt viscosity, The effect of excellent dielectric properties and stable dielectric properties
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Embodiment 1
[0083] Use 55 parts of SA9000 polyphenylene ether, 12 parts of diethyl etherified diallyl bisphenol A, 3 parts of dicumyl peroxide, 13 parts of BT93 (ethylene bis-tetrabromophthalimide), 17 parts of SC2050MB, use toluene to dissolve the above compounds, and prepare a glue with a suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of SA9000, diethyl etherified diallyl bisphenol A, dicumyl peroxide, BT93 and SC2050MB is 100 parts.
[0084] Eight pieces of prepreg prepared above and two pieces of one-ounce electrolytic copper foil were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; 2. The pressure ...
Embodiment 2
[0086] Use 15 parts of SA9000 polyphenylene ether, 45 parts of diethyl etherified diallyl bisphenol A, 2 parts of dicumyl peroxide, 15 parts of decabromodiphenylethane, 23 parts of SC2050MB, and use toluene to dissolve the above compound Dissolved and adjusted to a suitable viscosity glue. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample. The sum of the parts by weight of SA9000, diethyl etherified diallyl bisphenol A, dicumyl peroxide, decabromodiphenylethane and SC2050MB is 100 parts.
[0087] Eight pieces of prepreg prepared above and two pieces of one-ounce electrolytic copper foil were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are the same as in Example 1, and the corresponding properties are shown in Table 1.
Embodiment 3
[0089] Use 35 parts of SA9000 polyphenylene ether, 25 parts of diethyl etherified diallyl bisphenol A, 2 parts of dicumyl peroxide, 18 parts of BT93 (ethylene bis-tetrabromophthalimide), 20 parts of SC2050MB, use toluene to dissolve the above compound, and prepare a glue with a suitable viscosity. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample. The sum of the parts by weight of SA9000, diethyl etherified diallyl bisphenol A, dicumyl peroxide, BT93 and SC2050MB is 100 parts.
[0090] Eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil are stacked together and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are the same as in Example 1, and the corresponding properties are shown in Table 1.
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