Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermosetting resin composition and applications thereof

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of poor dielectric properties, high melt viscosity, poor stability, etc., to achieve low melt viscosity, The effect of excellent dielectric properties and stable dielectric properties

Active Publication Date: 2014-04-09
HONOR DEVICE CO LTD
View PDF4 Cites 30 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the first aspect of the embodiment of the present invention provides a thermosetting resin composition to solve the problems of poor dielectric properties, poor stability, high melt viscosity, and poor processability of thermosetting resin compositions in the prior art.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermosetting resin composition and applications thereof
  • Thermosetting resin composition and applications thereof
  • Thermosetting resin composition and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] Use 55 parts of SA9000 polyphenylene ether, 12 parts of diethyl etherified diallyl bisphenol A, 3 parts of dicumyl peroxide, 13 parts of BT93 (ethylene bis-tetrabromophthalimide), 17 parts of SC2050MB, use toluene to dissolve the above compounds, and prepare a glue with a suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of SA9000, diethyl etherified diallyl bisphenol A, dicumyl peroxide, BT93 and SC2050MB is 100 parts.

[0084] Eight pieces of prepreg prepared above and two pieces of one-ounce electrolytic copper foil were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; 2. The pressure ...

Embodiment 2

[0086] Use 15 parts of SA9000 polyphenylene ether, 45 parts of diethyl etherified diallyl bisphenol A, 2 parts of dicumyl peroxide, 15 parts of decabromodiphenylethane, 23 parts of SC2050MB, and use toluene to dissolve the above compound Dissolved and adjusted to a suitable viscosity glue. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample. The sum of the parts by weight of SA9000, diethyl etherified diallyl bisphenol A, dicumyl peroxide, decabromodiphenylethane and SC2050MB is 100 parts.

[0087] Eight pieces of prepreg prepared above and two pieces of one-ounce electrolytic copper foil were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are the same as in Example 1, and the corresponding properties are shown in Table 1.

Embodiment 3

[0089] Use 35 parts of SA9000 polyphenylene ether, 25 parts of diethyl etherified diallyl bisphenol A, 2 parts of dicumyl peroxide, 18 parts of BT93 (ethylene bis-tetrabromophthalimide), 20 parts of SC2050MB, use toluene to dissolve the above compound, and prepare a glue with a suitable viscosity. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample. The sum of the parts by weight of SA9000, diethyl etherified diallyl bisphenol A, dicumyl peroxide, BT93 and SC2050MB is 100 parts.

[0090] Eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil are stacked together and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are the same as in Example 1, and the corresponding properties are shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a thermosetting resin composition, comprising a diallyl compound, wherein the structural formula of the diallyl compound is as shown in formula (1), wherein R1 is -C(CH3)2, -C(CF3)2, -SO2, -CH(CH3), -CH2 or oxygen atom; R2 and R3 are the same or different aliphatic chain alkyls or aromatic alkyls; and R2 and R3 contain no allyl group. The thermosetting resin composition are excellent in heat stability and humidity resistance, low in dielectric constant and dielectric loss angle tangent, and excellent in processability. The embodiment of the invention also provides applications of the thermosetting resin composition in a resin sheet, a resin compound metal foil, a prepreg, a laminated board, a metal foil covered laminated board and a printed circuit board.

Description

technical field [0001] The present invention relates to a resin composition, in particular to a thermosetting resin composition and its application in resin sheets, resin composite metal foils, prepregs, laminates, metal foil-clad laminates and printed circuit boards . Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operation signal tends to be high-frequency. At the same time, in order to meet the development trend requirements of various electronic products , the circuit board is developing towards the direction of high multi-layer and high wiring density, which requires the substrate material not only to have good dielectric properties (low dielectric constant and low dielectric loss tangent) to meet the needs of high-frequency signal transmission, but also requires It has goo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L71/12C08K5/06C08K5/14C08K5/3415C08K5/03C08F283/06C08F212/34C08J5/24B32B15/08B32B27/04H05K1/03
Inventor 苏民社
Owner HONOR DEVICE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com