Thermosetting resin composition and applications thereof

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of poor dielectric properties, high melt viscosity, poor stability, etc., to achieve low melt viscosity, The effect of excellent dielectric properties and stable dielectric properties

Active Publication Date: 2014-04-09
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the first aspect of the embodiment of the present invention provides a thermosetting resin composition to solve the problem

Method used

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  • Thermosetting resin composition and applications thereof
  • Thermosetting resin composition and applications thereof
  • Thermosetting resin composition and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0082] Example 1

[0083] Use 55 parts of SA9000 polyphenylene ether, 12 parts of diethyl etherified diallyl bisphenol A, 3 parts of dicumyl peroxide, 13 parts of BT93 (ethylene bistetrabromophthalimide), 17 parts of SC2050MB, use toluene to dissolve the above compound, and prepare a glue of suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample with a resin content of 54%. The sum of the parts by weight of SA9000, diethyl etherified diallyl bisphenol A, dicumyl peroxide, BT93 and SC2050MB is 100 parts.

[0084] Eight pieces of the prepreg prepared above and two pieces of one-ounce electrolytic copper foil are laminated together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: the lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; 2....

Example Embodiment

[0085] Example 2

[0086] 15 parts of SA9000 polyphenylene ether, 45 parts of diethyl etherified diallyl bisphenol A, 2 parts of dicumyl peroxide, 15 parts of decabromodiphenyl ethane, 23 parts of SC2050MB, and toluene Dissolve it and prepare it into glue of suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample. The sum of the parts by weight of SA9000, diethyl etherified diallyl bisphenol A, dicumyl peroxide, decabromodiphenylethane and SC2050MB is 100 parts.

[0087] Eight pieces of the prepreg prepared above and two pieces of one-ounce electrolytic copper foil are laminated together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are the same as in Example 1, and the corresponding properties are shown in Table 1.

Example Embodiment

[0088] Example 3

[0089] Use 35 parts of SA9000 polyphenylene ether, 25 parts of diethyl etherified diallyl bisphenol A, 2 parts of dicumyl peroxide, 18 parts of BT93 (ethylene bistetrabromophthalimide), 20 parts of SC2050MB, use toluene to dissolve the above compound, and prepare a glue of suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample. The sum of the parts by weight of SA9000, diethyl etherified diallyl bisphenol A, dicumyl peroxide, BT93 and SC2050MB is 100 parts.

[0090] Laminate eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil together, and laminate them through a hot press to obtain a double-sided copper clad laminate. The lamination conditions are the same as in Example 1, and the corresponding properties are shown in Table 1.

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PUM

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Abstract

The invention provides a thermosetting resin composition, comprising a diallyl compound, wherein the structural formula of the diallyl compound is as shown in formula (1), wherein R1 is -C(CH3)2, -C(CF3)2, -SO2, -CH(CH3), -CH2 or oxygen atom; R2 and R3 are the same or different aliphatic chain alkyls or aromatic alkyls; and R2 and R3 contain no allyl group. The thermosetting resin composition are excellent in heat stability and humidity resistance, low in dielectric constant and dielectric loss angle tangent, and excellent in processability. The embodiment of the invention also provides applications of the thermosetting resin composition in a resin sheet, a resin compound metal foil, a prepreg, a laminated board, a metal foil covered laminated board and a printed circuit board.

Description

technical field [0001] The present invention relates to a resin composition, in particular to a thermosetting resin composition and its application in resin sheets, resin composite metal foils, prepregs, laminates, metal foil-clad laminates and printed circuit boards . Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operation signal tends to be high-frequency. At the same time, in order to meet the development trend requirements of various electronic products , the circuit board is developing towards the direction of high multi-layer and high wiring density, which requires the substrate material not only to have good dielectric properties (low dielectric constant and low dielectric loss tangent) to meet the needs of high-frequency signal transmission, but also requires It has goo...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08K5/06C08K5/14C08K5/3415C08K5/03C08F283/06C08F212/34C08J5/24B32B15/08B32B27/04H05K1/03
Inventor 苏民社
Owner HONOR DEVICE CO LTD
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