Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for selective deposition of metals through interfacial adsorption and application thereof

A technology of depositing metal and interface adsorption, which is applied in the direction of improving the metal adhesion of insulating substrates and secondary treatment of printed circuits, etc. It can solve the problems of high product cost, expensive laser equipment, and many processing procedures, and achieve simple operation and low cost. , the effect of wide practicability

Inactive Publication Date: 2014-04-23
KINGFA SCI & TECH CO LTD
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Despite the rapid development of three-dimensional circuit technology, the production speed of molded interconnect devices is faster, the process is more simplified, and the application fields are wider. For example, antennas manufactured using three-dimensional circuit technology are widely used in mobile terminals such as smart phones and notebook computers. Above: The sensor manufactured by three-dimensional circuit technology has a minimum wire width of 150 μm and a minimum wire width of 150 μm, which achieves the purpose of saving space and reducing weight, and is suitable for miniaturization, light weight, and thin-walled electronic products. However, in the whole process, because of the many processing processes, especially the laser equipment with three-dimensional processing capability is more expensive, resulting in high cost of final products, which limits the rapid development of the industry

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] (1) Preparation of resin mixture

[0033] Take 90wt% resin (PC) and 10wt% porous alumina, add it into a high-speed mixer and mix evenly, then feed it from the main feeding hopper of the extruder, extrude, cool and pelletize to obtain a resin mixture.

[0034] (2) Using the above resin mixture to achieve selective metal deposition

[0035] The above resin mixture pellets are dried and injection molded to obtain a product. Put the product under the Nd:YAG laser, the wavelength of the laser is 1064nm, use the high energy of the laser to vaporize the PC resin matrix on the surface of the product, and expose the porous alumina with a porous structure, that is, with the assistance of the computer, the target metal conductor Graphics are transferred to the article. Then put the gasified product into the colloidal palladium solution tank, the porous alumina adsorbs the colloidal palladium through the interface adsorption, and then hangs the product after the adsorption of the...

Embodiment 2

[0037] (1) Preparation of resin mixture

[0038] Take 95wt% resin (PA66), 5wt% molecular sieve, the main chemical component is calcium oxide, add it to a high-speed mixer and mix evenly, then feed from the main feeding hopper of the extruder, extrude, cool and pelletize to obtain a resin mixture .

[0039] (2) Using the above resin mixture to achieve selective metal deposition

[0040] The above resin mixture pellets are dried and injection molded to obtain a product. Put the product under the Nd:YAG laser, the wavelength of the laser is 1064nm, use the high energy of the laser to vaporize the resin matrix on the surface of the product, and leave a molecular sieve with a porous structure, that is, transfer the target metal conductor pattern to the products. Then put the gasified product into the colloidal palladium solution tank, the molecular sieve absorbs the colloidal palladium through the interface adsorption, and then hangs the product after the adsorption of the collo...

Embodiment 3

[0042] (1) Preparation of resin mixture

[0043] Take 85wt% resin (ABS) and 15wt% diatomaceous earth, add it to a high-speed mixer and mix evenly, then feed from the main feeding hopper of the extruder, extrude, cool and cut into pellets to obtain a resin mixture.

[0044] (2) Using the above resin mixture to achieve selective metal deposition

[0045] The above resin mixture pellets are dried and injection molded to obtain a product. Put the product under the Nd:YAG laser, the wavelength of the laser is 1064nm, and use the high energy of the laser to vaporize the resin matrix on the surface of the product, leaving porous diatomite with a porous structure, that is, with the assistance of the computer, the target metal conductor Graphics are transferred to the article. Then put the gasified product into the copper complex solution tank, diatomaceous earth adsorbs the copper complex through interface adsorption, and then hangs the product after the copper complex is absorbed i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of selective deposition of metals on the surface, and discloses a method for selective deposition of metals through interfacial adsorption on the surface of a resin material containing a porous structure and an application thereof. According to the method, micro metal particles and complex ions or colloids are deposited by utilizing the laser radiation of the resin material and then through the interfacial adsorption; the resin material after adsorption is used for depositing the metals through chemical plating technology. The porous structure of the resin material is exposed through the laser radiation of the resin material containing porous inorganic additives, the adsorption for the micro metal particles and complex ions or colloids with catalytic characteristic is realized through the method of physical adsorption, and then the selective deposition of copper, nickel and gold can be realized through a conventional chemical planting method by taking the micro metal particles and complex ions or colloids as catalytic centers. The method disclosed by the invention avoids the defects of high chemical planting solution activity, short service life, more side reactions and the like in the prior art, is free of requirements on matrix resin and simple and convenient to operate, and is suitable for being used in the fields of automobiles, wireless communication mobile terminals, electronic equipment and the like.

Description

technical field [0001] The invention belongs to the technical field of surface selective deposition of metal, in particular to a method and application of selective deposition of metal through interface adsorption on the surface of a resin material containing a porous structure. Background technique [0002] Three-dimensional circuit technology is a method of using laser to process resin composition and selectively deposit metal on the resin composition. Resin compositions suitable for this technique usually contain laser-sensitive additives. When a laser is irradiated onto this special resin matrix, the laser-sensitive additive releases metal nuclei that cause metallization by subsequent chemical reduction in the irradiated surface region. [0003] Chinese patent 02812609 discloses a similar method in which metal nuclei are formed by the fracture of a non-conductive metal compound finely distributed in the carrier material by electromagnetic radiation, and in the area wher...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38
Inventor 严峡姜苏俊关勋宁袁志敏蔡彤旻曾祥斌
Owner KINGFA SCI & TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com