A kind of hollow carbon sphere/epoxy resin composite material with low dielectric constant and preparation method thereof

Abstract

Belonging to the field of composite materials, the invention relates to a low dielectric constant hollow carbon sphere / epoxy resin composite material and a preparation method thereof. The preparation steps include: (1) under nitrogen protection, carbonizing hollow phenolic aldehyde microspheres in a high temperature furnace to obtain hollow carbon spheres; (2) coating the surfaces of the hollow carbon spheres by a polymer; and (3) adding the polymer coated hollow carbon spheres into epoxy resin, stirring the mixture evenly, then mixing the mixture with a curing agent and removing bubbles, and conducting heating curing in a mould to obtain the hollow carbon sphere / epoxy resin composite material. The hollow carbon sphere / epoxy resin composite material has the advantages of light weight, low dielectric constant, good thermal conductivity, dimensional stability and chemical stability, etc. The polymer coated hollow microspheres can be evenly dispersed in epoxy resin to form effective interface bonding with the resin matrix, thus ensuring the safety of dielectric materials. The hollow carbon sphere / epoxy resin composite material can be used in electronic packaging materials, integrated circuits and other fields.

Description

technical field [0001] The invention relates to an epoxy resin composite material, in particular to a low dielectric constant epoxy resin composite material containing hollow carbon spheres and a preparation method thereof, belonging to the field of composite materials. [0002] technical background [0003] With the development of large-scale integrated circuits, electronic devices are developing in the direction of miniaturization, high speed, high integration and low energy consumption. However, due to the signal delay effect caused by interlayer capacitance, metal wire resistance and inter-wire capacitance, the development of VLSI is limited. To reduce the signal delay effect, in addition to reducing the influence of the metal wire itself, it is also necessary to reduce the insulating dielectric layer. Impact. [0004] Epoxy resin is an important thermosetting resin with good thermal stability, dimensional stability and excellent electrical insulation properties. It has ...

AI Technical Summary

Problems solved by technology

Epoxy resin is an important base resin for the manufacture of substrates for printed circuit boards and copper-clad laminates. However, due to its relatively high dielectric constant, it cannot meet the requirements of high-performance laminates and cannot guarantee the reliability of signal transmission. There is an urgent need to reduce the dielectric constant of epoxy resins to meet their application requirements as electronic materials

[0005] There are currently three main ways to reduce the dielectric constant of epoxy resin: the first way is to use the low dielectric constant characteristics of certain organic or inorganic substances to mix them with epoxy resin, but general organic substances are not resistant to high temperatures , the adhesion to the metal is insufficient, and the introduction of inorganic particles will also affect the application of the material system in integrated circuits; the second way is to add special elements, such as fluorine, to the resin, which can effectively weaken the dipole of the material system. sub-polarization, so as to achieve the purpose of reducing the dielectric constant, but this method is complicated to operate and the cost is high; the third way is to create holes in the resin, and use the low dielectric constant of air to reduce the average dielectric constant of the material. Most of the low dielectric constant materials widely studied at present are obtained through the third way.

However, if the material contains a large number of pores, it will lead to poor thermal conductivity, generally only SiO 2 A few tenths of the microelectronic circuit may cause an accident due to a large increase in system temperature

At the same time, since the size and shape of the pores of ordinary foaming materials cannot be precisely controlled, the strength of the material will be greatly reduced, and it is difficult to meet the requirements for the production and use of electronic materials.