Modified epoxy stone back mesh adhesive and preparation method thereof
A technology of backing glue and modification, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of unstable aging resistance, unsatisfactory bonding strength, and large curing shrinkage, and achieve curing Small shrinkage, small internal stress, and moderate rheological state
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Embodiment 1
[0030] In another reaction kettle, add 29 parts of phenalkamine curing agent kingcure305, start stirring, and add in sequence, 6 parts of modified alicyclic amine curing agent kingcure285, 2 parts of benzyl alcohol, 1.5 parts of DMP-30, 0.3 parts of dispersant BYK-P104S Parts, 0.2 parts of wetting agent SP-978, 1 part of coupling agent KH-550, after adding the materials, continue to stir for 1.0 hours, then add 30 parts of airflow quartz powder, 20 parts of silicon micropowder, 10 parts of ultrafine transparent powder , a total of 100 parts by mass. After adding the powder, heat up to 80°C, keep warm for 1.5 hours, then cool down to 32°C, stop stirring, discharge, filter through a 120-mesh filter cloth, seal and pack, and obtain component B of the present invention.
[0031] The two components of A and B are mixed evenly according to the mass ratio of 2:1, and the samples are made for tensile shear strength (steel / steel) test, compressive shear strength (cement / cement, stone / st...
Embodiment 2
[0034] Example 3
Embodiment 3
[0036] When preparing the B component, the powder material selects 24 parts of silicon micropowder, 16 parts of air-flow quartz powder, 20 parts of superfine transparent powder, and the rest are used in Example 1.
[0037] Attached table, embodiment sample test method standard and test result
[0038]
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