Photoelectric printed board and manufacturing method thereof

Abstract

The invention discloses a photoelectric printed board and a manufacturing method of the photoelectric printed board. The photoelectric printed board comprises optical wave guide layers, first metal layers, PPs, second thick-copper layers, upper outer copper layers, lower outer copper layers and metal protecting layers, a reflector is arranged inside each optical wave guide layer, each first metal layer is provided with a pattern RDL1 communicated with the corresponding reflector, the PPs are provided with blind buried holes, and each second thick-copper layer is provided with a pattern RDL2; through holes penetrate through the optical wave guide layers, the first metal layers, the PPs and the second thick-copper layers and are stopped between the metal protecting layers. Welded balls are embedded into the outer copper layers, a photonic device is arranged at the position, corresponding to the lower side of the corresponding reflector, of each lower outer copper layer, and the position, on the periphery of the corresponding photonic device, of each lower outer copper layer is provided with a photonic device connection circuit and a photonic device protecting device. The photoelectric printed board is simple in technology, a PCB technology or a carrier technology is used, complex, high-speed and multi-IO connection among chips is achieved, mutual connection density is high, and the photoelectric printed board and the manufacturing method of the photoelectric printed board are suitable for batch production.

Description

technical field [0001] The invention relates to the technical field of integrated electronics, in particular to a hybrid integrated packaging device and a manufacturing method thereof. Background technique [0002] Most of the existing integrated circuits are two-dimensional integrated circuits, and two-dimensional integrated circuits refer to the distribution of various components of the integrated circuit on a plane one by one. With the continuous improvement of integration, the number of device units on each chip increases sharply, the chip area increases, and the growth of inter-unit connections not only affects the working speed of the circuit but also takes up a lot of area, which seriously affects the further improvement of integration and working speed of integrated circuits. Thus, a new technical idea of ​​3D integration is generated. The overlapping structure of three-dimensional integrated circuit multilayer devices can double the integration of the chip. The ove...

AI Technical Summary

Problems solved by technology

The overlapping structure of three-dimensional integrated circuit multilayer devices can double the integration of the chip. The overlapping structure shortens the unit connection and makes parallel signal processing possible, thereby realizing the high-speed operation of the circuit, which has many advantages; however, due to the design of the multilayer circuit , there is a relatively complex electrical interconnection conduction, and there will inevitably be insurmountable technical problems in terms of bandwidth limitation, electromagnetic interference, delay, and energy consumption, so that the growth rate of information input and output cannot match the processing speed of information

At present, the lower cladding layer, waveguide layer and upper cladding layer of the optical waveguide layer are processed separately. Whether it is a rigid optical PCB board or a flexible optical PCB board, the preparation methods of the organic optical waveguide part are roughly divided into two types: one is The method of lamination plus photolithography, the other is the method of hard mold imprinting, the cost is high, and the assembly is complicated

There are certain problems in the compatibility between the above two preparation methods and the PCB board process, especially the development of high heat-resistant polymers as optical waveguide line materials is very difficult

Moreover, the organic optical waveguide materials used are far from mature and mass-produced

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