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Thermal conductive resin composition

A technology of resin composition and thermal conductivity, which is applied in the field of thermal conductive resin composition to achieve the effect of suppressing warpage

Inactive Publication Date: 2014-05-07
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, phase transition exothermic components that were non-fluid at room temperature but became low in viscosity, softened, or melted in the high temperature range were proposed, but since they fluidized in the high temperature range, it was not aimed at suppressing the warpage of the semiconductor package ( Patent No. 4054986: Patent Document 12)

Method used

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  • Thermal conductive resin composition
  • Thermal conductive resin composition
  • Thermal conductive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0107] Synthesis examples, examples, and comparative examples are shown below to specifically describe the present invention, but the present invention is not limited by the following examples. In addition, the test regarding the effect related to this invention was performed as follows.

[0108] [viscosity]

[0109] The absolute viscosity of the oil and fat composition was measured at 25° C. using a Malcom viscometer (PC-1T type).

[0110] [Thermal conductivity]

[0111] Each composition was wrapped in a kitchen wrap, and measured with TPA-501 manufactured by Kyoto Denshi Kogyo Co., Ltd.

[0112] [hardness]

[0113] The composition was cured at 150° C. for 60 minutes, and measured with a Durometer A-type hardness meter manufactured by Shimadzu Corporation.

[0114] [softening temperature]

[0115] Cure the composition for 60 minutes at 150°C with TMA / SDTA841 from METTLER TOLEDO e Determination.

[0116] [Warpage test]

[0117] Each composition was sandwiched between a...

Synthetic example 1

[0120] [Synthesis Example 1] Preparation of Component (A)

[0121] Vinyl norbornene (trade name: V0062, manufactured by Tokyo Chemical Industry Co., Ltd.; 5-vinylbicyclo[2.2.1] Hept-2-ene and approximately equimolar isomer mixture of 6-vinylbicyclo[2.2.1]hept-2-ene) 1,785 g (14.88 moles) and toluene 455 g, using an oil bath, heated to 85°C . 3.6 g of carbon powder supporting 5% by mass of platinum metal was added thereto, and 1,4-bis(dimethylsilyl)benzene 1,698 g (8.75 mol) was added dropwise over 180 minutes while stirring. After completion|finish of dripping, it cooled to room temperature after heating and stirring at 110 degreeC for 24 hours more. Then, the platinum metal-supported carbon was removed by filtration, and the toluene and excess vinylnorbornene were distilled off under reduced pressure to obtain 3,362 g of a colorless and transparent oily reaction product (viscosity at 25° C.: 12,820 mPa·s). Using FT-IR, NMR, GPC, etc. to analyze the results of the reaction ...

Embodiment 1～6、 comparative example 1～5

[0148] (A) - (F) components were mixed as follows, and the compositions of Examples 1-6 and Comparative Examples 1-5 were obtained.

[0149] That is, Components (A), (B) and (E) were added to 5 L Planetarium Mikisa (manufactured by Inoue Seisakusho Co., Ltd.) in the amounts shown in Tables 1 and 2, and mixed at room temperature for 1 hour. Next, add (C), (D), and (F) components, and mix uniformly. The measurement results of the viscosity, thermal conductivity, hardness, and softening temperature of the obtained composition and the results of the warpage test are shown in Tables 1 and 2 together.

[0150] 【Table 1】

[0151]

[0152] H / Vi=(the total number of hydrogen atoms bonded to silicon atoms in the component (C)) / (the total number of addition-reactive carbon-carbon double bonds in the component (A))

[0153] 【Table 2】

[0154]

[0155] H / Vi=(the total number of hydrogen atoms bonded to silicon atoms in the component (C)) / (the total number of addition-reactive carbon...

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Abstract

A thermal conductive resin composition comprises an additive reaction product (A) of a compound (a) presented by a formula (1) having two SiH groups in one molecule and a polycyclic hydrocarbon (b) having two addition reactive carbon-carbon double bonds in one molecule, wherein the additive reaction product (A) is an additive reaction product having two addition reactive carbon-carbon double bonds, and R is two-valent hydrocarbyl or alkoxy; an inorganic filler (B) selected from allotropes of metal, metal oxide, metal nitride, metal carbide and carbon; an organic hydrogen polysiloxane; and a platinum or platinum compound (D). The thermal conductive resin composition has excellent hardness and strength to inhibit the warping degree of a semiconductor packaging piece, and also can be softened within a range of high working temperature to be warpped accordingly, thereby preventing warping.

Description

technical field [0001] The present invention relates to a thermally conductive resin composition capable of suppressing warping of electronic components such as semiconductor chips. Background technique [0002] It is well known that electronic components such as semiconductor packages generate heat during use and that the performance thereof deteriorates, and various heat release techniques are used as means for solving the problem. As a general method, it is possible to efficiently remove heat from the cooling member by arranging a cooling member such as a radiator near the heat-generating portion and connecting them closely. At this time, if there is a gap between the heat-generating component and the cooling component, heat conduction is not efficient because there is air with poor thermal conductivity in between, so the temperature of the heat-generating component does not drop sufficiently. In order to prevent such a phenomenon, in order to prevent the existence of ai...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K13/02C08K3/08C08K3/22C08K5/5419C08K5/549C08K5/05
Inventor 北泽启太山田邦弘池野正行田部井荣一
Owner SHIN ETSU CHEM IND CO LTD
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