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Method for improving service life of parts through ion chamber automatic cleaning through ion injection device

An ion implantation equipment and ion implantation technology are applied in the field of automatic cleaning of ion chambers of ion implantation equipment, which can solve the problems of rising maintenance costs and labor costs and occupying working time, so as to reduce maintenance costs and labor costs, increase working time, The effect of reducing maintenance frequency

Inactive Publication Date: 2014-05-14
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it takes up a lot of equipment operation time, and also causes an increase in maintenance costs and labor costs.

Method used

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  • Method for improving service life of parts through ion chamber automatic cleaning through ion injection device

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Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0018] Principle of the present invention is as follows:

[0019] 1. Pass a large amount of fluoride gas (such as sulfur hexafluoride or dicarbon hexafluoride, which is stable, non-toxic and harmless) into the ion implantation chamber through the gas pipeline.

[0020] 2. The electrons emitted by the filament heating of the ion source are accelerated by the voltage and then bombard the fluoride gas to generate fluoride ions. Fluoride ions and doping residues (such as arsenic, phosphorus, boron, antimony, etc.) will undergo redox chemical reactions. The reaction products are arsenic trifluoride, phosphorus trifluoride, boron trifluoride and antimony pentafluoride.

[0021] 3. The reaction product is pumped away with a vacuum pump.

[0022] The reason why fluorine is chosen is because of its active chemical properties and strong oxidizing pro...

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Abstract

The invention discloses a method for improving the service life of parts through ion chamber automatic cleaning through an ion injection device. The method comprises step 1, guiding the fluoride gas serving as the cleaning gas into an iron injection chamber; step 2, controlling the chamber pressure during reaction to maintain sufficient plasmas; step 3, performing heating and fluorine ionization through ion source lamp filaments and performing the chemical reaction on ion injection doped residual materials which are accumulated in fluorine ions and the ion injection chamber; step 4, removing the reactant gas after the reaction through a vacuum pump. According to the method for improving the service life of the parts through the ion chamber automatic cleaning through the ion injection device, the fluorine ions are guided in to be reacted with the residual materials to achieve the automatic cleaning effect and accordingly the machine utilization rate can be increased, the cost can be saved, and the machine granular level can be reduced.

Description

technical field [0001] The invention belongs to a semiconductor process method in a semiconductor integrated circuit, in particular to a method for automatic cleaning of ion implantation equipment, in particular to a method for automatic cleaning of ion chambers of ion implantation equipment to improve component life. Background technique [0002] Ion implantation equipment is a kind of equipment that uses energy to accelerate and screen after ionization of the source, so as to control the implantation of the required dopant impurities into the predetermined depth of the silicon wafer. Commonly used doping sources are arsenic, phosphorus, boron, and antimony. Because only 5% of the ions will be implanted into the silicon wafer after ionization of the dopant source, and 95% of the dopant will remain in the chamber, which will cause poor high voltage insulation and particle problems. In order to avoid the above problems, the ion implantation equipment must be regularly mainta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00
CPCB08B7/00
Inventor 孙建军
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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