Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment

Abstract

A copper alloy for electronic equipment comprises between 3.3 at% and 6.9 at% of Mg, with the balance being substantially Cu and inevitable impurities. When the Mg concentration is X at%, the conductivity sigma (% IACS) is within a range of sigma < {1.7241/(-0.0347 X2 + 0.6569 X + 1.7)} 100, and the stress relaxation percentage after 1,000 hours at 150 C is 50% or less.

Description

technical field [0001] The present invention relates to a copper alloy for electronic equipment suitable for components for electronic equipment such as terminals, connectors, relays, and lead frames, a method for manufacturing a copper alloy for electronic equipment, a rolled copper alloy material for electronic equipment, and components for electronic equipment . [0002] This application claims priority based on Japanese Patent Application No. 2011-237800 for which it applied in Japan on October 28, 2011, and uses the content for this specification. Background technique [0003] Conventionally, along with miniaturization of electronic equipment and electric equipment, components for electronic equipment such as terminals, connectors, relays, and lead frames used in these electronic equipment and electric equipment have been required to be miniaturized and thinned. Therefore, copper alloys excellent in elasticity, strength, and electrical conductivity are required as mate...

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Problems solved by technology

Among them, in a connector with a structure in which the tab pushes up the spring contact part of the female terminal and is inserted, if the tensile modulus of the material constituting the connector is high, there may be a sharp change in the contact pressure during insertion. , and it is easy to deform plastically beyond the elastic limit, so it is not preferred

[0014] In addition, in the Cu-Mg alloys described in Non-Patent Document 2 and Patent Document 3, intermetallic compounds are precipitated in the same way as Corson copper-nickel-silicon alloys, so there is a tendency for the tensile modulus to be high. Connectors are not preferred

[0015] In addition, in the Cu-Mg alloy, many coarse intermetallic compounds are dispersed in the parent phase, so these intermetallic compounds are likely to become starting points during bending, causing cracks, etc., so there is a problem that components for electronic devices with complex shapes cannot be molded. question

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