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Cyanide-free silver-electroplating solution and electroplating method thereof

A technology of electroplating silver and solution, applied in the field of electroplating chemistry, can solve the problems of narrow current density range and poor stability of plating solution, etc., and achieve the effect of smooth and consistent coating, low cost and strong binding force

Inactive Publication Date: 2014-06-18
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the above problems existing in the prior art, provide a cyanide-free electroplating silver plating solution and its electroplating method, and solve the technical problems of poor stability of the plating solution and narrow current density range of the existing cyanide-free electroplating silver plating system

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The formula of the cyanide-free silver plating solution is composed of: silver nitrate 40 g / L, sodium thiosulfate 230 g / L, anhydrous sodium sulfite 80 g / L, ammonium acetate 30 g / L, potassium acetate 30 g / L, boric acid 20 g / L, niacin 1 g / L. The pH value of the plating solution is 5-6.

[0020] Use the silver plate (99.99% purity) as the anode and the piece to be plated as the cathode, apply a direct current between the anode and the cathode at room temperature, and control the cathode current density to 0.1-1.4A / dm 2 . The plating solution is stirred by magnetic force, and the plating is performed for 5-30 minutes, and then the surface is cleaned with deionized water and dried to complete the electroplating.

Embodiment 2

[0022] The formula composition of the cyanide-free silver plating solution is: silver nitrate 50 g / L, sodium thiosulfate 260 g / L, anhydrous sodium sulfite 90 g / L, ammonium acetate 40 g / L, potassium acetate 40 g / L, boric acid 30 g / L, niacin 2 g / L. The pH value of the plating solution is 5-6.

[0023] Use the silver plate (99.99% purity) as the anode and the piece to be plated as the cathode, apply a direct current between the anode and the cathode at room temperature, and control the cathode current density to 0.1-1.4A / dm 2 . The plating solution is stirred by magnetic force, and the plating is performed for 5-30 minutes, and then the surface is cleaned with deionized water and dried to complete the electroplating.

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Abstract

The invention discloses a cyanide-free silver-electroplating solution mainly prepared from silver nitrate, sodium thiosulfate, anhydrous sodium sulfite, ammonium acetate, potassium acetate, boric acid, nicotinic acid and deionized water. The electroplating solution disclosed by the invention contains no extremely toxic substances in components and is prepared according to a cyanide-free formula so as to reduce environment hazards. The electroplating solution contains the simply and easily obtained components so as to be relatively low in cost. The electroplating solution is relatively good in stability and free of phenomena such as sedimentation, discoloration and the like after being placed for a long term; in addition, the electroplating effect of the electroplating solution placed for a long term is same as that of a new prepared electroplating solution. The electroplating solution is also relatively good in dispersing power and throwing power, relatively wide in allowed current density range and capable of obtaining a silver electroplating layer with favorable performance within the allowed current density range. The obtained silver electroplating layer is consistent in smoothness, fine and dense in crystal, relatively strong in binding force with a matrix, smooth and bright in appearance, free of discoloration after being placed in the air for a long term, and excellent in discoloration resistance.

Description

technical field [0001] The invention relates to the technical field of electroplating chemistry, in particular to a cyanide-free electroplating silver solution and an electroplating method thereof. Background technique [0002] Silver coating has good conductivity, low contact potential and high reflection coefficient, so it is widely used in the fields of electrical appliances, electronics, communication equipment and instrumentation manufacturing. At present, most silver plating solutions are mainly cyanide systems, which seriously endanger the ecological environment and are gradually being replaced by cyanide-free silver plating. The cyanide-free silver plating solution uses cyanide-free ions to complex with silver ions, and the plating layer is obtained by electrochemical reaction deposition. However, the currently used cyanide-free silver plating system generally has problems such as poor stability of the plating solution, large stress on the silver plating layer, poor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46
Inventor 袁丹丹高立军
Owner SUZHOU UNIV
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