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A kind of high thermal conductivity insulating layered composite material and its preparation method

A composite material and high thermal conductivity technology, which is applied in the electronic field to achieve the effect of high thermal conductivity, high strength and low dielectric constant

Active Publication Date: 2015-11-18
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the requirement that the existing high thermal conductivity composite material cannot meet the requirements of specific application occasions with low dielectric coefficient and good electrical insulation, the present invention provides a high thermal conductivity insulating layered composite material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The preparation method of the layered composite material with high thermal conductivity and insulation comprises the following steps:

[0019] Step 1: Prepare a diamond / copper composite material sample, the volume fraction of diamond is 60%, and process it into a cylinder of ?50mm×5mm. Generally speaking, the shape of the composite material sample is not limited, and is not limited to any thickness , but the preferred thickness is above 3mm;

[0020] Step 2: Prepare CVD diamond material with a thickness of 2mm;

[0021] Step 3: Coarse grinding and fine grinding of diamond / copper composite material and CVD diamond material samples;

[0022] Step 4: Carry out metallized Ni plating on the diamond / copper composite material sample by electroless plating, and the thickness of the Ni plating layer is 20 μm;

[0023] Step 5: Vacuum brazing method is used to weld the Ni-plated diamond / copper composite material sample and CVD diamond material, the thickness of the welding layer...

Embodiment 2

[0025] The preparation method of the layered composite material with high thermal conductivity and insulation comprises the following steps:

[0026] Step 1: Prepare a diamond / copper composite material sample, the volume fraction of diamond is 65%, and process it into a cylinder of ?30mm×3mm;

[0027] Step 2: Prepare an aluminum nitride material with a thickness of 2 mm by chemical vapor deposition;

[0028] Step 3: Coarse grinding and fine grinding of the diamond / copper composite material sample and the aluminum nitride material;

[0029] Step 4: Carry out metallized Ni plating on the diamond / copper composite material sample by electroless plating, and the thickness of the Ni plating layer is 10 μm;

[0030] Step 5: Use the vacuum brazing method to weld the Ni-plated diamond / copper composite material sample and the aluminum nitride material. The thickness of the welding layer is 0.1mm. The dielectric constant of the layered composite material after welding is 5.3, and the di...

Embodiment 3

[0032] The preparation method of the layered composite material with high thermal conductivity and insulation comprises the following steps:

[0033] Step 1: Prepare a diamond / aluminum composite material sample, the volume fraction of diamond is 60%, and process it into a cylinder of ?50mm×5mm;

[0034] Step 2: Prepare CVD diamond material with a thickness of 3 mm;

[0035] Step 3: Coarse grinding and fine grinding of diamond / aluminum composite material and CVD diamond material samples;

[0036] Step 4: Carry out metallized Ni plating on the diamond / aluminum composite material sample by electroless plating, and the thickness of the Ni plating layer is 20 μm;

[0037] Step 5: Vacuum brazing method is used to weld the Ni-plated diamond / aluminum composite material sample and CVD diamond, the thickness of the welding layer is 0.2mm, the dielectric constant of the layered composite material after welding is 5.5, and the dielectric loss Tanδ≦ 2×10 -4 (35GHz), thermal conductivity...

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Abstract

The invention belongs to the technical field of electronics, and in particular relates to a high thermal conductive insulation layered composite material and a preparation method thereof. The high thermal conductive insulation layered composite material provided by the invention is welded from a high thermal conductive material and a dielectric material. In addition to excellent performances of low density, high strength, wear resistance and corrosion resistance, the composite material has high thermal conductivity of a high thermal conductive material to quickly emit heat in electronic devices, and has good electrical insulation and low dielectric coefficient of a dielectric material. According to the invention, a welding method is employed to connect the high thermal conductive material with the dielectric material, so that the high thermal conductive insulation layered composite material can be applied to occasions simultaneously requiring high thermal conductivity, low dielectric constant and electrical insulation.

Description

technical field [0001] The invention belongs to the technical field of electronics, and in particular relates to a layered composite material with high thermal conductivity and insulation and a preparation method thereof. Background technique [0002] In the electronics industry, the production of substrates is an important component. The substrate has the following functions in electronic equipment: (1) It provides mechanical manufacturing of various electronic components such as integrated circuits for fixing and assembling, and can realize automatic installation of components; (2) It realizes various electronic components such as integrated circuits The electrical connection or electrical insulation between them provides the required electrical characteristics, such as characteristic impedance, etc. With the development of electronic products in the direction of high integration and high reliability, the requirements for the insulation and heat dissipation performance of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/04B32B18/00B32B38/18
Inventor 韩媛媛郭宏张习敏尹法章范叶明徐骏
Owner GRIMAT ENG INST CO LTD
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