Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for encapsulating CZT pixel detector

A packaging method and detector technology, applied in radiation control devices and other directions, can solve problems such as poor practicability, and achieve the effects of strong practicability, uniform size, and good electrical conductivity

Inactive Publication Date: 2014-07-09
NORTHWESTERN POLYTECHNICAL UNIV
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of poor practicability of the existing detector packaging methods, the present invention provides a packaging method for CdZnTe pixel detectors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for encapsulating CZT pixel detector
  • Method for encapsulating CZT pixel detector
  • Method for encapsulating CZT pixel detector

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The following examples refer to Figure 1-5 .

[0021] The crystal used in the CZT pixel detector is a CZT crystal ingot grown by the vertical Bridgman method, cut into 10×10×2㎜ 3 single crystal, and prepared 8×8 pixel electrodes. Subsequently, the CZT pixel detector and the PCB board flip are connected by screen printing through conductive silver glue. The thickness of the stainless steel mesh used for screen printing is 100 μm, the diameter of the round hole is 200 μm, and the leakage current test system is used for I-V testing.

[0022] The first step: use the CZT crystal ingot grown by the vertical Bridgman method, cut the single crystal part into 10×10×2㎜3 wafers, polish all sides of the wafer on 5000# sandpaper, and then use MgO to suspend The silicon sol is used for rough polishing, the silica sol is used for mechanical chemical polishing, the processed wafer is carefully cleaned with acetone, and it is etched with bromomethanol to remove the mechanical damage ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for encapsulating a CZT pixel detector. The method is used for solving the technical problem that an existing encapsulating method of the detector is poor in practicality. According to the technical scheme, a polymer conductive silver colloid which is good in connection performance and can guarantee that a CZT wafer is not damaged is adopted for connection. The conductive silver colloid is prepared with micron-size sheet silver powder serving as conductive filler and epoxy resin and a curing agent as matrix resin, has certain tensile property and can be well dispersed. Meanwhile, the silver filler has good conductive performance, can effectively bind the CZT wafer and a substrate after being hardened or dried at a certain temperature and has good conductive performance. Meanwhile, in order to meet the requirements that a pixel array CZT detector is large in electrode density and one-shot accurate connection is needed, the conductive silver colloid is coated on pixel electrodes of a PCB, then the wafer is invertedly buckled for accurate attachment, and accordingly precise connection of a single pixel is achieved. Meanwhile, the fragile CZT wafer can not be damaged and practicality is high.

Description

technical field [0001] The invention relates to a packaging method of a detector, in particular to a packaging method of a CdZnTe pixel detector. Background technique [0002] In the manufacture of microelectronic components and the assembly of electronic equipment, micro-connection technology is a key link that determines the final quality of the product. In a large-scale integrated circuit, there are dozens of solder joints at least, and there are hundreds of solder joints at most. The main function of these solder joints is to realize the electrical connection between the chip and the external circuit and between components. In CdZnTe (referred to as CZT) detectors, due to the special properties of CdZnTe itself, it is particularly difficult to perform micro-welding on its electrodes. [0003] The connection technology of microelectronics generally includes two kinds of wire connection and inverted chip technology. Combining the characteristics of CdZnTe itself, the ul...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L27/146
Inventor 査钢强王闯齐阳赵清华杨波李利娜介万奇
Owner NORTHWESTERN POLYTECHNICAL UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com