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Preparation method of novel KH-560 modified phenolic foam

A KH-560, phenolic foam technology, applied in the chemical industry, can solve the problems of high brittleness, poor toughness and low mechanical strength of phenolic foam

Inactive Publication Date: 2014-08-27
CHANGCHUN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, phenolic foam also has the disadvantages of high brittleness, poor toughness, and low mechanical strength, which seriously restrict its application range and service life.

Method used

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  • Preparation method of novel KH-560 modified phenolic foam
  • Preparation method of novel KH-560 modified phenolic foam
  • Preparation method of novel KH-560 modified phenolic foam

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1 Novel KH-560 modified phenolic foam

[0020] 1. Preparation of modified phenolic resin

[0021] 1) Add formaldehyde / phenol molar ratio of 1.8:1 to a 2000ml three-necked round-bottomed flask equipped with a stirrer, condenser, and thermometer. Formaldehyde is 270ML, phenol is 180ML, and the water bath is heated to 40°C under stirring at 200rpm. Add Adjust the pH to 9-10 with about 20ML of 20% (wt) NaOH, continue to heat up to 60°C, and react for 30 minutes;

[0022] 2) Add mass fractions of 1%, 3%, 5%, 7%, 9%, and 11% silane coupling agent KH-560 (mass fraction is relative to the mass of phenol participating in the reaction, the mass of phenol is 190g, and the relative density is 1.0576 ), and then heated up to 95°C at a heating rate of 2°C / min, and reacted for 50 minutes; after the reaction was completed, it was cooled rapidly; the pH was neutralized to about 7 with 6mol / L hydrochloric acid. Then use a rotary evaporator to distill under reduced pressure t...

Embodiment 2

[0025] Example 2 Effect of different silane coupling agent KH-560 content on phenolic foam performance

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Abstract

The invention discloses a preparation method of novel KH-560 modified phenolic foam. The preparation method comprises the steps that the mole ratio of formaldehyde to phenol is 1.8:1, the temperature rises to 40 DEG C while a water bath is carried out in the 200rpm stirring state, pH is adjusted to range from 9 to 10, temperature continues to rise to 60 DEG C, and reaction is carried out for 30 min; a 7% silane coupling agent is added, a Tween-80, n-pentane and 50wt% sulfuric acid are then added, and foaming curing is carried out at the 70 DEG C. Medical strength and toughness of the obtained modified phenolic foam are remarkably improved. Compared with pure phenolic foam, compression strength of the modified phenolic foam is improved by 37%, impact strength of the modified phenolic foam is improved by 68%, the pulverization rate of the modified phenolic foam is reduced to 1.6%, and mechanical strength and toughness of the modified phenolic foam are remarkably improved. Meanwhile, according to thermogravimetric analysis, heat stability of the modified phenolic foam is only slightly reduced, the thermal weight loss rate of the modified phenolic foam is reduced by 1% to 3% compared with pure phenolic foam at the same temperature, and excellent heat stability and good fire resistance of the modified phenolic foam are still kept.

Description

technical field [0001] The invention belongs to the field of chemical industry, and in particular relates to a preparation method of novel KH-560 modified phenolic foam. Background technique [0002] Phenolic foam is a new type of foam developed in recent years. Compared with polyurethane foam and polystyrene foam, phenolic foam has obvious advantages in high temperature resistance. Phenolic foam can be used for a long time in the temperature range of -196 ~ 200 ℃ without deformation and degradation. Phenolic foam also has the advantages of light weight, heat insulation, low smoke when burning, low toxicity, no obvious flame, no dripping, low thermal conductivity, good heat insulation performance, excellent electrical insulation performance, and chemical corrosion resistance. It has broad application prospects in building insulation, petrochemical industry, and aerospace vehicle insulation. However, phenolic foam also has the disadvantages of high brittleness, poor toughne...

Claims

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Application Information

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IPC IPC(8): C08J9/14C08L61/14C08G8/28
Inventor 李东风崔旭
Owner CHANGCHUN UNIV OF TECH
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