Multi-physical measurement sensor chip and production method thereof

Abstract

The invention discloses a multi-physical measurement sensor chip and a production method thereof. The chip comprises a substrate as well as at least two kinds of sensors of a temperature sensor, a humidity sensor and a pressure sensor which are integrated on the substrate. The pressure sensor is formed by electrically-connected resistor elements; the humidity sensor can be of a capacitive type or a resistance type; thermistor wires are arranged on the periphery of the pressure sensor and the humidity sensor to form a temperature sensor; the temperature sensor is provided with a resistance trimming circuit; a micro chamber is etched in the back of the substrate, which corresponds to the pressure sensor; the micro chamber can be sealed or not sealed. The invention also discloses a production process of the sensor chip. According to the production process, firstly, depositing an elastic film on the surface of the substrate, and then using processes such as magnetron sputtering and patterning (including photoetching, peeling and etching) to obtain the final sensor chip. The sensor chip has the advantages of being low in cost and power consumption, easy to produce, wide in applicability and capable of achieving multi-physical measurement of a single chip and the like.

Description

technical field [0001] The invention relates to a sensor chip and a preparation method thereof, in particular to a sensor chip for multi-physical quantity measurement and a preparation method thereof. Background technique [0002] Temperature, humidity and pressure are important physical quantities in environmental and atmospheric monitoring, and separate sensors are usually used to measure these physical quantities. The disadvantages of separate sensors are their large size and high power consumption, which cannot meet the requirements of the current rapidly developing microsystems for small size, low power consumption, and integration of sensors. [0003] At present, there are three main ways to integrate sensors: (1) Integrate multiple sensors with the same or similar functions into a one-dimensional or two-dimensional sensor array; (2) Integrate sensors and integrated circuits on the same chip; (3) Integrate different types of sensors, such as sensors integrating sensit...

AI Technical Summary

Problems solved by technology

Although the sensor chips disclosed in the above two patents can simultaneously measure temperature, humidity and pressure, the preparation process is relatively complicated. Different films are used to make components for measuring temperature, humidity and pressure, and the thickness of the film is not thin enough.

For these metal thin film resistive sensors, due to the limitations of thin film technology and other aspects, in order to reduce defects, the film is generally made thicker (>1μm), resulting in a relatively low resistance change rate ΔR / R, so compared with other types of sensors, the sensitivity relatively low, which limits its application

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