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Fixed abrasive wire saw and preparation method thereof

A technology for abrasives and wire saws, which is applied in the field of fixed abrasive wire saws and its preparation, which can solve problems such as reduced bonding strength and chip clogging, and achieve the effects of not falling off easily, prolonging service life, and improving cutting flatness

Active Publication Date: 2014-10-01
FUNDANT JIANGSU ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is: in order to solve the problem of the decrease of the bonding strength of abrasive particles with the loss of the surface layer, the clogging of chips during the cutting process, and the circulation of cooling liquid / lubricating liquid, the present invention provides a fixed abrasive wire saw and Its preparation method prolongs the service life of the wire saw while improving the cutting efficiency

Method used

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  • Fixed abrasive wire saw and preparation method thereof
  • Fixed abrasive wire saw and preparation method thereof
  • Fixed abrasive wire saw and preparation method thereof

Examples

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Embodiment 1

[0059] Such as figure 2 The first specific embodiment of the fixed abrasive wire saw shown in the present invention includes a wire 1, which is a copper-plated steel wire; a bonding layer 2 is formed on the surface of the wire 1, and the bonding layer 2 includes The electroplating layer 2-1 on the surface and several abrasive particles 2-2 embedded and fixed in the electroplating layer, the material of the electroplating layer is zinc, and the abrasive particles are diamond outer layer completely wrapped in the metal compound layer, the main body of the metal compound layer The material is copper-chromium alloy; and the surface layer 3, the surface layer 3 is one layer, the surface layer 3 covers the surface of the bonding layer 2, and the material of the surface layer 3 is epoxy resin.

[0060] Such as figure 1 and 2 As shown, the preparation method of the abrasive particles in the first embodiment of the fixed abrasive wire saw of the present invention is:

[0061] 1) Pr...

Embodiment 2

[0071] Such as Figure 4 The second specific embodiment of the fixed abrasive wire saw of the present invention shown includes a wire 1, and the wire 1 is a stainless steel wire; a bonding layer 2 is formed on the surface of the wire 1, and the bonding layer 2 includes a The electroplating layer 2-1 and several abrasive particles 2-2 embedded and fixed in the electroplating layer, the material of the electroplating layer is a tin-copper alloy, the abrasive particles are a silicon carbide outer layer partially wrapped with a metal compound layer, and the metal compound layer The main material is copper-nickel alloy; and the surface layer 3, the surface layer 3 is one layer, the surface layer 3 covers the surface of the bonding layer 2, the material of the surface layer 3 is epoxy resin, and the epoxy resin is filled with filler abrasives 3-1 carbonization silicon. The outer surface of the surface layer 3 is formed with grooves 3-2.

[0072] Such as image 3 and 4 As shown, ...

Embodiment 3

[0083] Such as Figure 6 The third specific embodiment of the fixed abrasive wire saw shown in the present invention includes a wire 1, which is a copper-plated steel wire; a bonding layer 2 is formed on the surface of the wire 1, and the bonding layer 2 includes a The electroplating layer 2-1 on the surface and several abrasive particles 2-2 embedded and fixed in the electroplating layer, the material of the electroplating layer is nickel-copper alloy, and the abrasive particles are bare silicon carbide particles. The abrasive particles in this embodiment are also It can be diamond, cubic boron nitride, aluminum oxide or a combination thereof; and a surface layer 3, the surface layer 3 is one layer, the surface layer 3 covers the surface of the bonding layer 2, the material of the surface layer 3 is nickel, and the nickel metal is filled with Filled abrasive 3-1, the filled abrasive 3-1 is a mixed filler of silicon carbide and graphite.

[0084] Such as Figure 5 and Figu...

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Abstract

The invention relates to the technical field of a fixed abrasive wire saw and a preparation method thereof. The fixed abrasive wire saw comprises a wire material, a bonding layer and a surface layer, wherein the bonding layer is positioned on the surface of the wire material, and comprises a metal or alloy layer formed on the surface of the wire material and a plurality of grinding particles fixedly inlaid in the metal or alloy layer; the surface layer is a one-layer or multi-layer composite layer, and is covered on the surface of the bonding layer; and the surface layer consists of an organic material and a metal and / or alloy material, and can include a filling abrasive filled therebetween. The fixed abrasive wire saw can solve the problems of reduction of the bonding strength of the grinding particles along with the loss of the surface layer, the blockage of chips in the cutting process and the circulation of cooling liquid or lubricant; the service life of the wire saw is prolonged when the cutting efficiency is improved; and the workpiece cutting flatness can be enhanced through adjusting the surface configuration.

Description

technical field [0001] The invention relates to the technical field of a wire saw and a preparation method thereof, in particular to a fixed abrasive wire saw and a preparation method thereof. Background technique [0002] Wire saw cutting is a processing method for cutting semiconductors, crystals, various single crystals, magnetic materials, precision ceramics, and other hard and brittle materials. Free abrasive wire saws have been widely used in the slicing process of semiconductor wafers and solar silicon wafers. It uses steel wires to drive free abrasives (abrasive + liquid) to remove materials. It is easy to pollute the environment, lead to industrial waste, and its processing efficiency is low, so the development of fixed abrasive wire saws has become an inevitable trend in the industry. Compared with the free abrasive wire saw, the advantage of the fixed abrasive wire saw is that the material removal rate can be improved and the processing abrasive can be fully util...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B23D65/00B05D1/18B05D3/00B05D3/02
Inventor 励征
Owner FUNDANT JIANGSU ADVANCED MATERIALS CO LTD