A piezoresistive sensing element and its preparation method
A technology of sensing element and diamond, applied in the field of piezoresistive sensing element and its preparation, to achieve the effect of good chemical inertness
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Embodiment 1
[0033] In this embodiment, the structure of the piezoresistive sensing element is as follows figure 1 As shown, it consists of a PET substrate 1 , an amorphous carbon film 2 , and a metal electrode 3 , the diamond-like carbon film 2 is located on the surface of the substrate 1 , and the metal electrode 3 is located on the surface of the diamond-like carbon film 2 .
[0034] The preparation method of the piezoresistive sensing element comprises the following steps:
[0035] (1) The PET substrate was ultrasonically cleaned with ethanol, dried and placed in a vacuum chamber, and pre-vacuumized to 2.5×10 -3 Pa; Pass argon gas into the cavity through the ion source of the anode layer to maintain the pressure at 0.37Pa, apply a DC pulse bias voltage of -100V on the substrate, turn on the ion source of the anode layer, the current is 0.2A, and use ionized argon Ion etching the substrate surface, this process lasts for 5 minutes;
Embodiment 2
[0046] In this embodiment, the structure of the piezoresistive sensing element is as follows figure 1 shown by Al 2 o 3 Composed of a substrate, an amorphous carbon film and a metal electrode, the diamond-like carbon film is located on the surface of the substrate, and the metal electrode is located on the surface of the diamond-like carbon film.
[0047] The preparation method of the piezoresistive sensing element comprises the following steps:
[0048] (1)Al 2 o 3 The substrate was ultrasonically cleaned with ethanol, dried and placed in a vacuum chamber, pre-evacuated to 2.0×10 -3 Pa; Introduce argon gas into the chamber to maintain the air pressure at 1Pa, apply a pulse bias voltage of -50V on the substrate, and use ionized argon ions to etch the substrate surface, and this process lasts for 20 minutes;
[0049] (2) Pass C through the anode layer ion source into the cavity 2 h 2 The amorphous carbon film is deposited by gas, the chamber pressure is kept at 0.3Pa, th...
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Abstract
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