Metal-doped amorphous carbon piezoresistive sensing element, its preparation method and control method
A technology of metal doping and sensing elements, which is applied in the direction of using electric/magnetic devices to transfer sensing components, metal material coating process, ion implantation plating, etc., can solve problems such as sensitivity limitation, unfavorable practical application, high TCR, etc.
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Embodiment 1
[0036] In this embodiment, the piezoresistive sensing element consists of a PET substrate, a tungsten-doped amorphous carbon film and a metal Cr electrode. The tungsten-doped amorphous carbon film is located on the surface of the PET substrate, and the metal Cr electrode is located on the tungsten-doped amorphous carbon film surface.
[0037] The preparation method of the piezoresistive sensing element comprises the following steps:
[0038] (1) The PET substrate was ultrasonically cleaned with ethanol, dried and placed in a vacuum chamber, and pre-vacuumized to 2.5×10 -3 Pa; Pass argon gas into the coating chamber through the ion source of the anode layer to maintain the air pressure at 0.37Pa, apply a DC pulse bias voltage of -100V on the substrate, turn on the ion source of the anode layer, and use the ionization current of 0.2A to Argon ions etch the surface of the substrate, and this process lasts for 5 minutes;
[0039] (2) Pass C into the coating cavity through the anod...
Embodiment 2
[0048] In this embodiment, the structure of the piezoresistive sensing element is completely the same as that in Embodiment 1.
[0049] In this embodiment, the preparation method of the piezoresistive sensing element is basically the same as that in Embodiment 1, except that the sputtering target current in step (2) is 1.8A.
[0050] A piezoresistive effect test is performed on the piezoresistive sensing element prepared above, that is, the piezoresistive sensing element is stretched to observe the change of its resistance. The piezoresistive sensing element is deformed by the micro-stretching device and the semiconductor parameter instrument; the I-V curve of the piezoresistive sensing element at room temperature is tested by the semiconductor parameter instrument, and the linear contact area is calculated. The resistance value R is obtained, and the relationship between the resistance change rate and the strain change is obtained through the following formula:
[0051]
...
Embodiment 3
[0057] In this embodiment, the piezoresistive sensing element is made of Al 2 o 3 Substrate, tungsten-doped amorphous carbon film and metal Al electrode, tungsten-doped amorphous carbon film on Al 2 o 3 On the surface of the substrate, the metal Al electrode is located on the surface of the tungsten-doped amorphous carbon film.
[0058] The preparation method of the piezoresistive sensing element comprises the following steps:
[0059] (1)Al 2 o 3 The substrate was ultrasonically cleaned with ethanol, dried and placed in a vacuum chamber, pre-evacuated to 2.0×10 -3 Pa; Introduce argon gas into the coating chamber to maintain the air pressure at 1Pa, apply a pulse bias voltage of -50V on the substrate, and use ionized argon ions to etch the substrate surface, and this process lasts for 20 minutes;
[0060] (2) Pass C into the coating cavity through the anode layer ion source 2 h 2 The carbon source is provided by the gas, and the magnetron sputtering source is turned on...
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