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Conductive adhesive preparation method and conductive adhesive

A technology of conductive adhesive and conductive particles, applied in conductive materials, conductive adhesives, adhesives and other directions dispersed in non-conductive inorganic materials, can solve the problem of poor electrical conductivity and mechanical properties, graphene cannot be dispersed, electroplating Process environment pollution and other problems, to achieve the effect of improving conductivity, improving dispersion and uniformity, and excellent electrical conductivity

Inactive Publication Date: 2014-10-15
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

However, conductive gold balls have these defects: (1) The interface force between the plastic layer and the metal layer is poor, resulting in poor conductivity and mechanical properties after long-term use; (2) The electroplating process in the production process of gold balls pollutes the environment Serious; (3) Gold is a precious and rare metal
These resins all contain polar groups, but the surface of graphene does not have any functional groups, and its ultra-high specific surface area prevents graphene from being dispersed in the conductive matrix.

Method used

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  • Conductive adhesive preparation method and conductive adhesive
  • Conductive adhesive preparation method and conductive adhesive
  • Conductive adhesive preparation method and conductive adhesive

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Embodiment Construction

[0034] see figure 1 , the invention provides a kind of preparation method of conductive glue, comprises the following steps:

[0035] Step 1, preparing graphene oxide;

[0036] The method for preparing graphene oxide in the step 1 is the Hummers method.

[0037] Step 2, providing a functionalized reagent, and reacting with the graphene oxide to prepare functionalized graphene;

[0038] see figure 2 , in the step 2, the functionalization reagent reacts with the functional groups on the surface of graphene oxide, introduces functionalized molecules on the surface of graphene oxide, and reduces other oxygen-containing functional groups on the surface of graphene oxide to obtain functional Graphene; by introducing functionalized molecules containing polar groups on the surface of the functionalized graphene, the dispersion of the functionalized graphene in the binder resin is improved.

[0039] The general structural formula of the functionalized reagent is: Wherein the str...

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Abstract

The invention provides a conductive adhesive preparation method and a conductive adhesive. The preparation method comprises the steps as follows: step one, graphene oxide is prepared; step two, a functional reagent is provided and reacts with graphene oxide to prepare functional graphene; step three, a curing agent and an organic solvent are provided and mixed with a certain quantity of conductive particles to prepare a conductive particle dispersion liquid through ultrasonic treatment, and the conductive particles adopt functional graphene or mixtures of functional graphene and other conductive particles; step four, adhesive resin is provided and diluted by the organic solvent provided in the step three; and step five, the adhesive resin diluted in the step four is mixed with the conductive particle dispersion liquid to prepare a conductive adhesive pre-mixture, the conductive adhesive pre-mixture is stirred repeatedly and uniformly and further subjected to ultrasonic dispersion, the organic solvent is removed, and the conductive adhesive is prepared.

Description

technical field [0001] The invention relates to the technical field of liquid crystal displays, in particular to a method for preparing conductive adhesive and the conductive adhesive. Background technique [0002] At present, commonly used conductive adhesives are mainly composed of a polymer bonding matrix and metal conductive fillers. Through the bonding effect of the matrix resin, the conductive particles are combined to form a conductive path and realize the conductive connection of the adhered materials. The conductive particles commonly used in conductive adhesives include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni) and other metal powders. Cu, Al, and Ni are cheap and have good conductivity, but when the temperature rises, they are easily oxidized in the air, which deteriorates the conductivity and limits the stability and reliability of use. Silver powder has excellent electrical conductivity and chemical stability, and hardly oxidizes in the ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C09J7/10
CPCC09J9/02C09J11/04C08K9/04C08K2201/001C08K3/042C09J7/10H01B1/24C09J2301/314C09J2301/408
Inventor 李泳锐李吉陈雅惠
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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