Mixed additive for electrolytic profile-free copper foil

A mixed additive, contourless technology, applied in the electrolysis process, electroforming, etc., can solve the problems of low elongation, large side effects, poor bright effect, etc., and achieve the effect of easy-to-obtain raw materials, simple components, and easy control

Active Publication Date: 2014-10-15
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For electrolytic copper foil, the temperature is usually above 50°C, and the current density can be as high as 80A / dm 2 , the sulfonate crystal refiner in the non-dye additive will accelerate the decomposition, and the small molecular compound formed has a great side effect on the electroplating process, which is manifested by a decrease in brightness, an increase in roughness, an increase in brittleness, and a very low elongation; And dye-type brighteners, common phenazine dyes, triphenylmethane dyes, triphenylmethane dyes, diphenylmethane dyes, thiazine dyes, phthalocyanine dyes, phenol red dyes, etc., when the temperature exceeds 50 ° C, the dye and copper ions Very low complexing ability, poor brightening effect

Method used

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  • Mixed additive for electrolytic profile-free copper foil
  • Mixed additive for electrolytic profile-free copper foil
  • Mixed additive for electrolytic profile-free copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A mixed additive for electrolytic contourless copper foil, containing 25 mg of Glue, 8 mg of 9PAX, 6.5 mg of AESS, 15 mg of SPS, 4 mg of P(6000), 10.3 mg of H, 50 g of sulfuric acid and 20 g of copper sulfate pentahydrate in each liter of the aqueous solution of the mixed additive.

[0029] Wherein, the molecular structure of the 9-phenylacridine substituent is:

[0030] R 1-3 : H, Cl, CH 3 、C 2 h 5 or phenyl.

[0031] In Cu 2+ 80±2g / L, H 2 SO 4 110±5g / L, Cl-20-60mg / L, electrolytic current density 69A / dm 2, into a solution with a voltage of 4.0V and a temperature of 54±2°C, add the above-mentioned mixed additives at a speed of 100ml / min, use a titanium roller as the cathode, and titanium-coated nano-active materials as the anode, electrodeposit and continuously peel off, by controlling the cathode A 12μm-thick contourless copper foil was obtained at a rotational speed of

[0032] The matte surface (crystal growth surface) of the copper foil obtained in this e...

Embodiment 2

[0034] The difference between this embodiment and embodiment 1 is:

[0035] The aqueous solution of mixed additives per liter contains: Glue 20mg, 9PAX 6mg, AESS 10mg, MPS 20mg, P(6000) 5mg, H 10.4mg, sulfuric acid 50g and copper sulfate pentahydrate 20g. The matte surface of the obtained copper foil (crystal growth surface) Rz0.7μm, gloss (60°) 720, normal temperature tensile strength 664MPa, normal temperature elongation 14%, high temperature (180 ℃) tensile strength greater than 284MPa, high temperature elongation 12 %.

Embodiment 3

[0037] The difference between this embodiment and embodiment 1 is:

[0038] The aqueous solution of mixed additives per liter contains: Glue28mg, 9PAX10mg, AESS8mg, DPS18mg, P(10000)6mg, H10.5mg, sulfuric acid 50g and copper sulfate pentahydrate 20g. The matte surface of the obtained copper foil (crystal growth surface) Rz0.9μm, gloss (60°) 715, normal temperature tensile strength 618MPa, normal temperature elongation 12.4%, high temperature (180°C) tensile strength 271MPa, high temperature elongation 11.2% .

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Abstract

The invention belongs to the technical field of electrolytic copper foil processing, and relates to a mixed additive for electrolytic profile-free copper foil. An aqueous mixed additive solution per liter comprises 15-30 mg of hydrolyzed collagen, 2-20 mg of 9-phenyl-acridine substitute, 4-10 mg of wliphatic amine oxyethylate sulfonate, 10-30 mg of sulfonate, 2-15 mg of polyethylene glycol, 0.2-0.8 mg of tetrahydrothiazolyl thione, 50 g of sulfuric acid and 20 g of copper sulfate pentahydrate. According to the mixed additive, the components are simple, and raw materials are easy to obtain; and according to the profile-free copper foil obtained by adopting the mixed additive, the thickness of the profile-free copper foil is 12-15 mu m, the rough surface namely the crystal growth surface Rz is smaller than 1.0 mu m, the typical value is 0.7 mu m, the glossiness at 60 degrees is 720, the tensile strength at the normal temperature is larger than or equal to 600 MPa, the tensile elongation at the normal temperature is larger than or equal to 12%, the tensile strength at the high temperature of 180 DEG C is larger than or equal to 260 MPa, and the tensile elongation at the high temperature is larger than or equal to 10%.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil processing, in particular to a mixed additive for electrolytic contourless copper foil. Background technique [0002] With the continuous improvement of the informatization level of society, people's daily information processing volume is increasing day by day, which puts forward higher and higher requirements for the information processing ability of electronic products. Today, electronic products are getting shorter, smaller, lighter and thinner. The rapid progress of the communication industry has made the original civilian communication frequency bands very crowded. Some high-frequency communications used for military purposes have gradually given up some frequency bands to civilian use since the beginning of the 21st century, making civilian high-frequency communications obtain extraordinary speeds. develop. The high confidentiality and high transmission quality requirement...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04
Inventor 刘建广杨祥魁徐策宋淑平徐树民王天堂赵东王学江王其伶
Owner SHANDONG JINBAO ELECTRONICS
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