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Organosilicone composite with main chain containing alkylene group structure and preparation method of organosilicone composite

A technology based on alkylene and silicone, applied in the direction of electrical components, circuits, semiconductor devices, etc., to achieve the effects of good thermal shock resistance, excellent heat resistance, and high transparency

Active Publication Date: 2014-11-12
江苏矽时代材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the research focus of organic silicon materials for LED packaging is mainly to improve the refractive index, thermal conductivity, mechanical strength and reduce the thermal expansion rate of the material, which will also be a very serious challenge to the research and development of organic silicon packaging materials.

Method used

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  • Organosilicone composite with main chain containing alkylene group structure and preparation method of organosilicone composite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] The preparation of embodiment 1 A1 component

[0061] (1) Add 120g (0.43mol) of 1,4-bis(dimethylethoxysilyl)benzene, diphenyl 150g (0.61mol) of dimethoxysilane, 50g (0.42mol) of dimethyldimethoxysilane, 2,5-bis(dimethylethoxysilyl)bicyclo[2.2.1]-heptane Alkane 40g (0.13mol), vinylmethyldimethoxysilane 5g (0.038mol), vinyldimethylmethoxysilane 20g (0.17mol) and cyclohexane 1000g, stir well and heat it to 70 ℃;

[0062] (2) At 70°C, add 700g of NaOH and water mixture dropwise, and the dropping time is controlled within 1 hour;

[0063] (3) After the dropwise addition, the temperature was raised and refluxed for 5 hours;

[0064] (4) Separate the water layer, and wash the polymer and solvent part with water until neutral;

[0065] (5) After removing unreacted raw materials and solvent, the target product A1 component is obtained.

Embodiment 2

[0066] The preparation of embodiment 2 A2 component

[0067] (1) Add 200g (0.82mol) of diphenyldimethoxysilane and 60g (0.5mol) of dimethyldimethoxysilane into a 5L four-neck flask equipped with a stirrer, condenser, thermometer and constant pressure funnel ), 2,5-bis(dimethylethoxysilyl) bicyclo[2.2.1]-heptane 50g (0.17mol), vinylmethyldimethoxysilane 6g (0.045mol), ethylene 27g (0.23mol) of dimethylmethoxysilane and 1000g of cyclohexane, stir well and raise the temperature to 70°C;

[0068] (2) At 70°C, add 600g of NaOH and water mixture dropwise, and the dropping time is controlled within 1 hour;

[0069] (3) After the dropwise addition, the temperature was raised and refluxed for 5 hours;

[0070] (4) Separate the water layer, and wash the polymer and solvent part with water until neutral;

[0071] (5) After removing unreacted raw materials and solvents, the target product A2 component is obtained.

Embodiment 3

[0072] The preparation of embodiment 3 B component

[0073] (1) Add 2,5-bis(dimethylethoxysilyl)bicyclo[2.2.1]-heptane into a 5L four-necked flask equipped with a stirrer, condenser, thermometer and constant pressure funnel 40g (0.19mol), 250g (1.15mol) of diphenyldimethoxysilane, 80g (0.67mol) of dimethyldimethoxysilane, 20g (0.15mol) of dihydrotetramethyldisiloxane and Cyclohexane 1000g, stir well and heat it up to 50°C;

[0074] (2) At 50°C, add 700 g of a mixture of trifluoromethanesulfonic acid and water dropwise, and the dropping time is controlled within 1 hour;

[0075] (3) After the dropwise addition, the temperature was raised and refluxed for 4 hours;

[0076] (4) Separate the water layer, and wash the polymer and solvent part with water until neutral;

[0077] (5) After removing unreacted raw materials and solvents, the target product, component B, is obtained.

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Abstract

The present invention provides an organosilicone composite with main chain containing alkylene group structure. The organosilicone composite comprises four parts, namely, A, B, C and D, wherein A is a compound represented by general formula (1) shown in the specification and B is a compound represented by general formula (2) shown in the specification. A cured product of the composition has the advantages of excellent heat resistance, transparency, relatively high hardness and excellent resistances to heat shock and cold shock and can be used as a packaging material of an optical element.

Description

technical field [0001] The invention relates to the field of organosilicon, more specifically, to an organosilicon composition with a main chain containing an alkylene structure and a preparation method thereof. Background technique [0002] As a new type of green light source product, LED is called the fourth generation lighting source or green light source. With the vigorous development of the LED lighting industry, LED devices with high power, high brightness and long life requirements are constantly emerging, and a high-performance packaging material is needed to meet the requirements of LED packaging. This material mainly plays the role of sealing and protecting the normal operation of the chip. [0003] Silicone materials provide a wide range of potting materials, lens materials, adhesives, sealants and protective coating products for various LED applications due to their excellent high and low temperature resistance and UV radiation resistance. However, with the ...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08G77/20C08G77/12H01L33/56
Inventor 康润华
Owner 江苏矽时代材料科技有限公司
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