A kind of thermosetting comb structure polyimide resin and preparation method thereof

A polyimide resin and thermosetting technology, which is applied in the field of resin matrix for fiber composite materials and its preparation, can solve the problems of poor toughness of resin cured products, high resin viscosity, and restrictions on wide application, etc., and achieve long storage period and low price , good process performance

Active Publication Date: 2016-08-17
HARBIN ENG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, thermosetting polyimide resins still have problems such as high resin viscosity and poor toughness of cured resins, which limit the wide application of thermosetting polyimide resins.

Method used

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  • A kind of thermosetting comb structure polyimide resin and preparation method thereof
  • A kind of thermosetting comb structure polyimide resin and preparation method thereof
  • A kind of thermosetting comb structure polyimide resin and preparation method thereof

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Experimental program
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Effect test

specific Embodiment approach 1

[0030] The polymerizable acid anhydride described in this embodiment is one of phenylacetylene phthalic anhydride, naphthalene acetylene phthalic anhydride, phenylacetylene naphthalene anhydride, naphthalene acetylene naphthalene anhydride, and the like.

[0031] The triamines described in this embodiment are triaminopyrimidine, triaminopyridine, triaminobenzene, triaminodiphenyl ether, -triaminotriphenylmethane, quinazoline triamine, 2-vinyl-4,6- One of diamino-1,3,5-triazine, etc.

[0032] The dibasic acid anhydride described in this embodiment is one of pyromellitic anhydride, biphenyltetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, diphenyl ether tetracarboxylic dianhydride, and the like.

[0033] The thermosetting comb-structure polyimide resin described in this embodiment solves the disadvantage of poor manufacturability of current polyimide resins.

[0034] The thermosetting comb-shaped polyimide resin described in this embodiment has the advantag...

specific Embodiment approach 2

[0043] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the polymerizable acid anhydride described in step one is one or more of phenylacetylene phthalic anhydride, naphthalene acetylene phthalic anhydride, phenylacetylene naphthalene anhydride, naphthalene acetylene naphthalene anhydride, etc. Several mixtures. Others are the same as the first embodiment.

specific Embodiment approach 3

[0044] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the triamine described in step two is triaminopyrimidine, triaminopyridine, triaminobenzene, triaminodiphenyl ether, -triamino One or more mixtures of triphenylmethane, quinazoline triamine, 2-vinyl-4,6-diamino-1,3,5-triazine, etc. It is the same as the specific embodiment 1 or 2.

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Abstract

The invention provides a thermosetting comb structure polyimide resin and a preparation method thereof. The invention aims to solve the problems of single structure, poor process performance and high price of the existing thermosetting polyimide resin. The preparation method of the thermosetting comb structure polyimide resin of the present invention has mainly been used: 1. mixing and dissolving; 2. synthesis of comb units; 3. polymerization; 4. process of concentration adjustment to obtain a thermosetting comb structure polyimide resin. The invention is mainly used for preparing thermosetting polyimide resin with comb structure. The synthesis process of the present invention is simple, the preparation process performance of the composite material is good, and the storage period is long; the thermosetting comb-shaped structure polyimide resin has relatively high physical and chemical properties, and has broad application prospects in the fields of high-temperature-resistant fiber composite materials and the like; The synthesis route is reasonable, the raw materials are easy to obtain, the price is relatively cheap, and the synthesis process is simple, which has important promotion and application value.

Description

technical field [0001] The invention relates to a resin matrix for fiber composite materials and a preparation method thereof, in particular to a high temperature resistant resin and a preparation method thereof. Background technique [0002] Polyimide (PI) refers to a class of polymers containing imide rings on the main chain. It was reported as early as 1908, but there were some patent documents (US2710853) until the mid-1940s, but it was really developed as a polymer material in the 1950s. At that time, DuPont applied for a series of patents, and in the mid-1960s, it first commercialized polyimide film (Kapton) and varnish (Pyre ML), thus beginning an era of vigorous development of polyimide. The imide structure is: [0003] [0004] Due to its excellent high temperature resistance, high strength, high modulus, high toughness and insulation properties, polyimide has become an important structural material and polymer film material in the fields of aerospace and micro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C07D403/14
Inventor 林再文商伟辉刘永琪石建军
Owner HARBIN ENG UNIV
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