Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof

Abstract

The invention discloses a heat-conducting electric-insulating epoxy resin potting adhesive which is composed of an epoxy resin, a curing agent, a toughener, a diluter, a filler, an accelerator and a defoaming agent. The component A is composed the following components in parts by weight: 100 parts of epoxy resin, 10-30 parts of diluter, 5-15 parts of filler, 0.5-1 part of defoaming agent and 3-5 parts of coupling agent. The component B is composed the following components in parts by weight: 78-145 parts of curing agent, 10-40 parts of toughener, 5-10 parts of filler, 0.1-3 parts of accelerator and 0.5-1 part of defoaming agent. The A / B weight ratio is 1:1. The toughener is epoxy hydroxyl-terminated polybutadiene acrylonitrile. The filler is composite powder composed of nano magnesium silicon nitride, nano silicon carbide, nano aluminum nitride, nano boron nitride, high-sphericity nano aluminum oxide and nano silicon nitride with different particle sizes, and the average particle size is 40-60nm. The potting adhesive has the advantages of favorable thermal conductivity and favorable electric insulating property.

Description

technical field [0001] The invention relates to the technical field of adhesive preparation, in particular to a thermally conductive and insulating epoxy resin potting adhesive and a preparation method thereof. Background technique [0002] Epoxy resin potting glue is a kind of thermosetting polymer composite material with good adhesion, corrosion resistance, electrical insulation, high strength and other properties. Indispensable basic material in many industrial fields. [0003] With the development of microelectronics and integrated circuits in the direction of high speed, high density, miniaturization, and light weight, the volume of electronic components and logic circuits is continuously compressed, and the heat generated per unit volume of electronic equipment increases sharply, so the thermal conductivity will decrease. Affect the life and reliability of electronic components and electronic equipment. In order to ensure the normal operation of electronic components...

AI Technical Summary

Problems solved by technology

Although metal materials have high thermal conductivity, they can also be used as fillers for thermally conductive polymer composite materials. However, due to the electrical conductivity of metal materials, the finished products have poor insulation and are easy to break down, which affects the efficiency and life of electronic components.

The thermal conductivity of silica micropowder commonly used in inorganic thermally conductive fillers is low, and the thermal conductivity of potting materials filled with silica micropowder is also low, less than 0.6W / (m K), which is not conducive to the heat dissipation of electrical components

Non-spherical alumina, boron nitride, aluminum nitride and other inorganic fillers have high thermal conductivity, but the particle size is large (generally 400 mesh), poor affinity with resin, uneven distribution, easy to precipitate

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