Phase change temperature control device for intermittent high-power LED (light-emitting diode)

Abstract

The invention discloses a phase change temperature control device for an intermittent high-power LED (light-emitting diode). The device is characterized by comprising a heat sink, wherein LED packaging parts are arranged at the bottom of the heat sink; the heat sink adopts a heat sink cavity or a heat sink solid with N cavities; if the heat sink adopts the heat sink cavity, a metal dot matrix is arranged in the heat sink cavity, the heat sink cavity is filled with a phase change material of which the melting point is lower than the normal working temperature of the LED packaging parts, and a plurality of radiating fins are arranged at the top of the heat sink cavity; if the heat sink adopts the heat sink solid, each cavity is filled with the phase change material of which the melting point is lower than the normal working temperature of the LED packaging parts, and a plurality of radiating fins are arranged on the outer wall of the heat sink solid. According to the device, the intermittent high-power LED can be radiated, the temperature of the intermittent high-power LED can be controlled, and meanwhile, the temperature of an LED semiconductor node can be lowered; the device is low in power consumption and simple in structure.

Description

technical field [0001] The invention relates to the lighting field, in particular to an intermittent high-power LED phase change temperature control device. technical background [0002] Semiconductor light-emitting diode (Light Emitting Diode) is called the fourth-generation lighting source or green light source because of its advantages of high luminous efficiency, long life, safety and environmental protection. In recent years, LED lighting has been widely used in special-purpose lighting systems such as mobile phone flashlights, display backlights, signs and signal lights, and miner's lamps. In view of the advantages of LEDs, it will be used in household lighting, automotive headlights, stage lighting and construction site lighting. And other high-power lighting fields show great potential and prospects. However, LED luminescence belongs to solid luminescence. Its principle is to excite electrons and make electrons jump in energy level to realize light emission; the spe...

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Problems solved by technology

Literature [1][Document 1: S.L.Lee, Z.H.Yang, Y.Hsyua, Cooling of a heated surface by mist flow, Journal of Heat Transfer, 1994,116(1):167.] and patent CN2735548 through air and silicon oil respectively The forced convection cooling to reduce the temperature of the LED chip, the disadvantage is that the active cooling system used requires additional energy consumption and poor reliability

Patent CN1828956A discloses a high-power LED heat dissipation package. Its principle is to use low boiling point liquid droplets to impact the heat dissipation device to reduce the temperature of the LED package body. The disadvantages are that the temperature of the temperature control surface is uneven, the pressure difference is large, and the cooling surface is easy. produce corrosion

Patent CN101315927A discloses a high-power LED phase-change cooling device. Its principle is to use the liquid-gas phase change of the working medium to realize the thermal isothermal effect of the heat sink body to reduce the temperature of the LED chip. The disadvantage is that the volume change of the liquid-gas phase change is large. The heat sink has a large volume and uses metal foam as the boiling structure to suppress the natural convection of the phase change material

Patent US20090322229A1 discloses a new type of LED lighting device. Its principle is to transfer the heat of the LED chip to the phase-change material buried in the ground through the heat pipe to reduce the temperature of the LED chip. The disadvantage is that the application of this structure is limited. Not conducive to promotion

Patent WO2009110987A1 discloses a heat storage system using phase-change materials for LED lamps. Its structure is to replace the traditional metal heat sink with a heat sink with a cavity. When the change material melts, it absorbs heat and stores energy to reduce the temperature of the LED chip. The disadvantage is that the thermal conductivity of the phase change material is low and the heat transfer capacity is limited.

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