Method for preparing flexible circuit board by applying flexure-resistant conductive silver paste

A technology of flexible circuit boards and conductive silver paste, which is applied to printed circuits, conductive materials dispersed in non-conductive inorganic materials, and printed circuit manufacturing, which can solve the problems of reduced service life, insufficient printability, and reduced conductive lines. Stability and other issues, to achieve the effect of improving conductive stability, increasing service life, and improving printability

Inactive Publication Date: 2016-11-30
DONGGUAN TAIYANG RUBBER PLASTIC INDAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing flexible circuit boards are not high enough in printability, and the adhesion of the conductive silver paste is not high enough, which increases the migration of silver ions, reduces the conductive stability of the conductive circuit, is prone to short circuit, and reduces the service life

Method used

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Embodiment Construction

[0019] The present invention will be further described below in combination with embodiments.

[0020] The method for preparing a flexible circuit board using a flexure-resistant conductive silver paste according to the present invention, the method for preparing a flexible circuit board using a flexure-resistant conductive silver paste, comprises the following steps:

[0021] Step 1, preparing ultra-fine high-conductivity silver powder: using liquid phase chemical deposition and high-energy ball milling combined method, using polyvinylpyrrolidone as surfactant, hydrazine hydrate and ammonia water to compound and reduce silver nitrate to prepare flake, needle or Petal-shaped ultra-fine and highly conductive silver powder with different morphology and structure, and the surface is modified by electron-rich five-membered and six-membered heterocyclic polyurethane oligomers, so that the ultra-fine and highly conductive silver powder has good dispersibility;

[0022] Step 2, synth...

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Abstract

The invention relates to the technical field of flexible circuit board preparation, in particular to a method for using bending-resistant conductive silver paste to prepare a flexible circuit board. The method includes the steps of firstly, preparing ultrathin conductive silver; secondly, synthesizing polyurethane resin with high toughness, high adhesive force and high contraction rate; thirdly, preparing bending-resistant conductive silver paste high in performance; fourthly, using high-voltage corona treatment in combination with surface coating to process the surface of a flexible circuit board substrate. By the method, the printability of the flexible circuit board can be increased, the conductive silver paste of the circuit board is allowed to be high in adhesive force, silver ion migration is reduced, conducting stability of conductive circuits is increased, short circuit is prevented effectively, and the service life of the circuit board is prolonged.

Description

technical field [0001] The invention relates to the technical field of preparation technology of flexible circuit boards, in particular to a method for preparing flexible circuit boards by applying flexure-resistant conductive silver paste. Background technique [0002] Flexible circuit boards, also known as "soft boards", are printed circuits made of flexible insulating substrates. Flexible circuits provide excellent electrical performance, can meet the design needs of smaller and higher density mounting, and also help reduce assembly processes and enhance reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products. It can be bent, wound, and folded freely, and can withstand millions of dynamic bendings without damaging the wires. It can be arranged arbitrarily according to the spatial layout requirements, and can be moved and stretched in three-dimensional space, so as to achieve the integration o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H05K3/00
Inventor 黄佳莉
Owner DONGGUAN TAIYANG RUBBER PLASTIC INDAL
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