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Tough epoxy resin curing system and preparation method thereof

A tough epoxy resin and epoxy resin technology, applied in the field of polymer materials, can solve the problems of complex preparation process, sharp increase in viscosity, poor dispersion, etc.

Inactive Publication Date: 2015-01-14
SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Thermoplastic engineering plastics with high toughness and high heat resistance are toughened and high-performance epoxy resins are the direction of industrial development today, but the viscosity of thermoplastic engineering plastics increases sharply when added to the resin system, which makes molding and processing difficult, and the dispersion is also poor. Thermoplastic engineering plastics The preparation process of plastic particles or solvent film is complicated, and there is still a big gap with the actual application of industrialization

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) Dissolve 5 parts of thermoplastic engineering plastic polyether ketone (PEK) in N,N-dimethylformamide solvent to make a 0.5wt% solution, and then add 55 parts of epoxy resin E-44, 20 Add 1 part of epoxy resin F-44, 25 parts of epoxy resin E-20, 8 parts of curing agent dicyandiamide and 0.5 part of accelerator 2-methylimidazole into the above solution, and mix well;

[0032] (2) Remove the solvent from the solution in (1) at 120°C under normal pressure for 15 minutes, then remove the solvent at 120°C under vacuum for 10 minutes, pour the solvent-free resin system into the mold, and then heat it at 120°C / 2h+160 Curing reaction at ℃ / 2h; cool the cured epoxy resin to room temperature, take it out, and measure its mechanical properties, as shown in Table 1.

Embodiment 2

[0034] (1) Dissolve 8 parts of thermoplastic engineering plastic polyetherimide (PEI) in N,N-dimethylacetamide solvent to make a 1.0wt% solution, and then add 60 parts of epoxy resin E-31 , 15 parts of epoxy resin E-51, 25 parts of epoxy resin F-51 and 22.2 parts of curing agent boron trifluoride monoethylamine are added to the above solution and mixed evenly;

[0035] (2) Remove the solvent from the solution in (1) at a certain 130°C under normal pressure for 20 minutes, then remove the solvent at 130°C under vacuum for 15 minutes, pour the solvent-free resin system into the mold, and then heat it at 130°C / 2h Curing reaction at +170°C / 2h; cool the cured epoxy resin to room temperature, take it out, and measure its mechanical properties, as shown in Table 1.

Embodiment 3

[0037] (1) Dissolve 12 parts of thermoplastic engineering plastics polysulfone (PSF) in N-methyl-2-pyrrolidone solvent to make a 2.0wt% solution, then mix 50 parts of epoxy resin E-51, 50 parts of ring Add epoxy resin E-20 and 22.2 parts of curing agent 4,4'-diaminodiphenylsulfone to the above solution, and mix well;

[0038] (2) Remove the solvent from the solution in (1) at 140°C under normal pressure for 30 minutes, then remove the solvent at 140°C under vacuum for 20 minutes, pour the solvent-free resin system into the mold, and then heat it at 140°C / 2h+160 Curing reaction at ℃ / 2h+180℃ / 2h; cool the cured epoxy resin to room temperature, take it out, and measure its mechanical properties, as shown in Table 1.

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PUM

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Abstract

The invention belongs to the technical field of high-molecular materials, and relates to a tough epoxy resin curing system and a preparation method thereof. The high-molecular material is prepared from the following compositions in parts by weight: 100 parts of epoxy resin, 8-120 parts of a curing agent, 0-1.5 parts of a promoter and 5-55 parts of thermoplastic. High-toughness high-heat-resistance thermoplastic engineering plastic toughened epoxy resin is selected in the epoxy resin cure system, and curing and toughening of epoxy resin can be realized under the premise of not reducing or slightly reducing mechanical properties and thermal properties.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and relates to a tough epoxy resin curing system and a preparation method thereof. Background technique [0002] Carbon fiber reinforced epoxy resin composite material is a high-performance composite material with epoxy resin as the matrix and carbon fiber as the reinforcement. It is mainly used in aerospace, transportation, medical, energy, sports and leisure and other fields. With the continuous advancement of science and technology such as aerospace, carbon fiber reinforced epoxy resin composites have attracted increasing attention, but the weakness of poor impact toughness has also affected its wide application. Therefore, the epoxy resin matrix and its composite materials are increasingly developing in the direction of high toughness. [0003] The general-purpose epoxy resin is brittle after curing, and its impact toughness, flexural strength and heat resistance are poor. The toug...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/08C08L81/06C08L61/16C08L71/10C08G59/50C08G59/42C08G59/20
Inventor 杨桂生刘明昌
Owner SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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