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A kind of preparation method of ultrathin silicon carbide material

An ultra-thin silicon carbide and two-dimensional material technology, which is applied in the field of preparation of ultra-thin silicon carbide materials, can solve the problems such as no one has obtained a single-layer silicon carbide structure, and achieves the effect of a simple preparation process.

Active Publication Date: 2016-08-17
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, no one in the world has obtained ultra-thin or even single-layer silicon carbide structures.

Method used

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  • A kind of preparation method of ultrathin silicon carbide material
  • A kind of preparation method of ultrathin silicon carbide material
  • A kind of preparation method of ultrathin silicon carbide material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] 1) Mix silicon powder and graphene powder and place them in the reaction furnace tube, the molar ratio of silicon powder and graphene powder is 100:1;

[0018] 2) Raise the temperature to 600°C at a rate of 1°C / min, and evacuate the reaction furnace tube to a vacuum degree of 10 -5 Pa, then feed argon, and react for 10 minutes under an argon atmosphere;

[0019] 3) Cool down to room temperature at a rate of 1°C / min, and take out the sample to obtain an ultra-thin silicon carbide material. The morphology of the obtained ultra-thin silicon carbide under the electron microscope is as follows figure 1 As shown, its Raman spectrum is shown in figure 2 As shown, the atomic force microscope image is given by image 3 shown by figure 2 It can be seen that there is an obvious 796cm in the Raman spectrum of the reaction product -1 The peak position of , corresponding to the Raman peak position of silicon carbide, is given by image 3 It can be seen that the thickness of ul...

Embodiment 2

[0021] 1) Place silica powder and graphene powder in the reaction furnace tube, the molar ratio of silica powder and graphene powder is 1:10, and the distance between them is 10cm;

[0022] 2) Raise the temperature to 1200°C at a rate of 100°C / min, and evacuate the reactor tube to a vacuum degree of 10 -2 Pa, then pass into nitrogen, react 200min under nitrogen atmosphere;

[0023] 3) Cool down to room temperature at a rate of 100°C / min, take out the sample, and obtain an ultra-thin silicon carbide material with a thickness of 0.4nm.

Embodiment 3

[0025] 1) Place silicon monoxide powder and graphite in the reaction furnace tube, the molar ratio of silicon monoxide powder and graphite is 1:60, and the distance between them is 60cm;

[0026] 2) Raise the temperature to 1600°C at a rate of 300°C / min, and evacuate the reactor tube to a vacuum degree of 10 -5 Pa, then feed argon and hydrogen mixed gas, the mixing volume ratio is 9:1; react under argon and hydrogen atmosphere for 1880min;

[0027] 3) Cool to room temperature at a rate of 400°C / min, take out the sample, and obtain an ultra-thin silicon carbide material with a thickness of 1.2nm.

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Abstract

The invention relates to a preparation method of an ultra-thin silicon carbide material. The preparation method comprises the following steps: placing a silicon source and a carbon source in a reaction furnace tube in a manner that the silicon source is 0-100cm away from the carbon source; raising the temperature to 600 DEG C -2300 DEG C at a speed of 1 DEG C / min-300 DEG C / min, vacuumizing the reaction furnace tube until the vacuum degree is 10<-5>-10<5>Pa and reacting for 1-2880 minutes under a protective atmosphere; and then cooling to room temperature at a speed of 1 DEG C / min-500 DEG C / min to obtain the ultra-thin silicon carbide material. The preparation method disclosed by the invention is simple, the prepared ultra-thin silicon carbide (of which the thickness is below 5nm) is a two-dimensional material which has wide band gap and can maintain stable and the production of the ultra-thin silicon carbide material overcomes the disadvantages that graphene is free of band gap and the single-layer disulfide molybdenum cannot maintain stable. The ultra-thin silicon carbide material can be widely applied in the technical fields of quantum light sources, photoelectricity, semiconductor prototype devices, microelectronic circuits, RF devices, integrated circuits, photocatalysis, desalination of seawater, nanometer energy, composite materials and the like.

Description

technical field [0001] The invention relates to a method for preparing an ultra-thin silicon carbide material, belonging to the technical field of silicon carbide material preparation. Background technique [0002] Graphene is a monoatomic layer carbon crystal material. Its discovery confirms the stable existence of two-dimensional materials and opens up a new stage of research on two-dimensional materials. In particular, its excellent photoelectric properties have aroused the interest of scientists, such as its Carrier mobility can reach 200,000 cm 2 / V.s, which provides a basis for its ability to manufacture high-frequency electrons. The light absorption of single-layer graphene is 2.3%, which makes it an important material for optoelectronic device research. However, while graphene has excellent photoelectric properties, it has a very serious defect, that is, the band gap is zero, which limits its application in micro-nano optoelectronic devices. Usually, methods such a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B31/36
Inventor 林时胜章盛娇李晓强吴志乾
Owner ZHEJIANG UNIV