Blocking thin film used for encapsulation of flexible electronic product and preparation method for blocking thin film

A barrier film and electronic product technology, applied in the field of barrier film and its preparation, can solve the problems of poor bending resistance of barrier film, failure of flexible electronic products, insufficient water vapor barrier performance, etc., to achieve good barrier performance, reinforcement and protection Inorganic coating, less defects

Active Publication Date: 2015-03-04
FSPG HI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] It can be seen that the barrier film in the above-mentioned prior art has either poor bending resistance or insufficient water vapor barrier performance. When it is used for the packaging of flexible electronic products such as liquid crystal display panels, EL display panels, and electronic paper, it is easy to cause Flexible electronic products fail due to oxidation, passivation

Method used

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  • Blocking thin film used for encapsulation of flexible electronic product and preparation method for blocking thin film
  • Blocking thin film used for encapsulation of flexible electronic product and preparation method for blocking thin film
  • Blocking thin film used for encapsulation of flexible electronic product and preparation method for blocking thin film

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Effect test

Embodiment 1

[0058] The barrier film in this embodiment includes in turn a 38 micron thick PET base material layer, a 20 nanometer thick silicon oxide coating, an 800 nanometer thick high toughness flexible organic coating and a 600 nanometer thick titanium oxide coating. Its preparation method is as follows:

[0059] A, on one side of 38 micron thick PET base material layer, deposit one deck of 20 nanometer thick silicon oxide with PECVD, structure is SiOx (x=1-2);

[0060] b. Coat an organic composition with a proper thickness on the surface of the silicon oxide coating with a wire bar, and use a concentrated high-pressure mercury lamp (80W / cm) at 600mJ / cm 2 It is irradiated with high irradiation energy to obtain a highly tough and flexible organic coating with a thickness of 800 nanometers;

[0061] c. Deposit a layer of titanium oxide with a thickness of 600 nanometers on the surface of the flexible organic coating by PECVD to obtain a barrier film Z-1#. Measure its performance.

[...

Embodiment 2

[0072] The barrier film in this embodiment includes a 38 micron thick PET base material layer, a 200 nanometer thick silicon oxide coating, a 1000 nanometer thick high toughness flexible organic coating and a 600 nanometer thick silicon oxide coating. Its preparation method is as follows:

[0073] A, on one side of 38 micron thick PET base material layer, deposit a layer of 200 nanometer thick silicon oxide with PECVD, structure is SiOx (x=1-2);

[0074] b. Coat an organic composition with a proper thickness on the surface of the silicon oxide coating with a wire bar, and use a concentrated high-pressure mercury lamp (80W / cm) at 600mJ / cm 2 It is irradiated with high irradiation energy to obtain a highly tough and flexible organic coating with a thickness of 1000 nanometers;

[0075] c. Deposit a layer of silicon oxide with a thickness of 600 nanometers on the surface of the flexible organic coating by PECVD to obtain the barrier film Z-2#. Measure its performance.

[0076] Wh...

Embodiment 3

[0086] The barrier film in this embodiment includes a 125 micron thick PET base material layer, a 50 nanometer thick silicon nitride coating, a 400 nanometer thick high toughness flexible organic coating and a 300 nanometer thick silicon nitride coating. Its preparation method is as follows:

[0087] a. On one side of the 125 micron thick PET base material layer, a layer of 50 nanometer thick silicon nitride is deposited by PECVD, and the structure is Si 3 Nx(x=3-4);

[0088] b. Use a wire bar to coat an organic composition of appropriate thickness on the surface of the silicon nitride coating, and use a concentrated high-pressure mercury lamp (80W / cm) at 600mJ / cm 2 It is irradiated with high irradiation energy to obtain a highly tough and flexible organic coating with a thickness of 400 nanometers;

[0089] c. Deposit a layer of silicon nitride with a thickness of 300 nm on the surface of the flexible organic coating by PECVD to obtain a barrier film Z-3#. Measure its perf...

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Abstract

The invention provides a blocking thin film used for encapsulation of a flexible electronic product and a preparation method for the blocking thin film. The blocking thin film comprises a basis material layer and a blocking composite layer formed on at least one surface of the basis material layer; the blocking composite layer comprises at least a first inorganic cladding, a flexible organic coating and a second inorganic cladding in sequence in the direction far away from the basis material layer; the flexible organic coating is formed through solidification of organic composition comprising acrylate compound, and hydroxy and aminocontianed oligomer; the thickness of the flexible organic coating is controlled within 200-2000 nanometers; the material of the first inorganic cladding and the second inorganic cladding is formed by oxide, nitride or carbonide of silicon, aluminum, magnesium, zinc, tin, nickel and titanium; the thickness of the first inorganic cladding and the second inorganic cladding is controlled within 5-600 nanometers respectively. The blocking thin film has not only favorable blocking effect, but also excellent bending resisting property, and can be used as a gas blocking element for various flexible electronic products of flexible display element, flexible organic solar battery, flexible organic electroluminescence element, and the like.

Description

technical field [0001] The invention relates to a barrier film and a preparation method thereof; more specifically, the invention relates to a barrier film used for packaging flexible electronic products and a preparation method thereof. Background technique [0002] Barrier films are derived from packaging films and are used as gas barrier components for packaging electronic products. Packaging film is used to block oxygen and water vapor from entering food and pharmaceutical packaging, and prevent the quality and quality of food and pharmaceuticals from being affected by the entry of oxygen and water vapor. With the development of electronic products, many electronic products use active metals. In order to avoid the performance degradation of electronic products caused by contact with oxygen and water vapor, barrier films have begun to be used in electronic products, and the requirements for their barrier properties are also increasing. . For example, barrier films for l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06C08J7/04C23C14/02
CPCB32B27/06B32B2255/102B32B2255/205B32B2255/28
Inventor 植满溪周锰何嘉杰
Owner FSPG HI TECH
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