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High-thermal conductivity polyamide composite material and preparation method thereof

A technology of composite materials and heat-conducting materials, which is applied in the field of high-thermal-conductivity polyamide composite materials and their preparation, can solve the problems of low thermal conductivity, reduced mechanical properties, and high cost, and achieve high thermal conductivity, reduce dosage, and prevent hydrolysis.

Inactive Publication Date: 2015-03-04
惠州市沃特新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a high thermal conductivity polyamide composite material and its preparation method to solve the problems of low thermal conductivity, instability, decreased mechanical properties and high cost of the existing thermal conductivity composite material. question

Method used

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  • High-thermal conductivity polyamide composite material and preparation method thereof

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[0033] Correspondingly, on the basis of the high thermal conductivity polyamide composite material provided above, the embodiment of the present invention also provides a material preparation method of the high thermal conductivity polyamide composite material. The method comprises the steps of:

[0034] Step S01. Melt-blending the dispersant and the heat-conducting material to prepare the heat-conducting masterbatch:

[0035] Melt-blending the thermally conductive material and the dispersant to form a thermally conductive masterbatch; wherein, the dispersant accounts for 30-40% of the total mass of the thermally conductive material and the dispersant; the thermally conductive material includes a mass ratio of (50 -60): (5-10): (5-10): (5-10): (1-5) nano aluminum nitride, micron aluminum nitride, micron boron nitride, micron silicon nitride and carbon-based material mixtures;

[0036] Step S02. Melting and extruding the thermally conductive masterbatch and polyamide resin: ...

Embodiment 1

[0050] A high thermal conductivity polyamide composite material and a preparation method thereof. The preparation method of the high thermal conductivity polyamide composite material is as follows:

[0051] Mix 600 grams of nano-aluminum nitride, 50 grams of micro-aluminum nitride, 50 grams of micro-boron nitride, 50 grams of micro-silicon nitride, and 10 grams of multi-walled carbon nanotubes at room temperature for 5 minutes at high speed, and then add molten 300 grams of EBS was mixed mechanically for 10 minutes at a rotational speed of 1000 rpm, and then the material was cooled and pulverized into granules to obtain a thermally conductive filler masterbatch. After mixing the obtained thermally conductive filler masterbatch with 1000g of nylon 6, extrude and granulate in a twin-screw extruder, the aspect ratio of the extruder is 44:1, and the processing temperature is 100-280°C.

Embodiment 2

[0053] A high thermal conductivity polyamide composite material and a preparation method thereof. The preparation method of the high thermal conductivity polyamide composite material is as follows:

[0054] Mix 600 grams of nano-aluminum nitride, 50 grams of micro-aluminum nitride, 50 grams of micro-boron nitride, 50 grams of micro-silicon nitride, and 10 grams of multi-walled carbon nanotubes at room temperature for 5 minutes at high speed, and then add molten 300 grams of EBS was mixed mechanically for 10 minutes at a rotational speed of 1000 rpm, and then the material was cooled and pulverized into granules to obtain a thermally conductive filler masterbatch. After mixing the obtained thermally conductive filler masterbatch with 1000g of nylon 66, extrude and pelletize in a twin-screw extruder, the aspect ratio of the extruder is 44:1, and the processing temperature is 100-330°C.

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Abstract

The invention discloses a high-thermal conductivity polyamide composite material and a preparation method thereof. The composite material comprises a polyamide resin, a dispersing agent and a heat-conducting material, wherein the heat-conducting material forms a heat-conducting network in the polyamide resin and comprises nanometer aluminum nitride, micron-order aluminum nitride, micron-order boron nitride, micron-order silicon nitride and a carbon-based material according to a mass ratio of (50-60):(5-10):(5-10):(5-10):(1-5); the dispersing agent accounts for 30-40 percent of the total mass of the heat-conducting material and the dispersing agent; and the polyamide resin accounts for 30-70 percent of the total mass of the heat-conducting material, the dispersing agent and the polyamide resin. The method for preparing the high-thermal conductivity polyamide composite material comprises the following steps: performing melt blending on the dispersing agent and the heat-conducting material so as to prepare a heat-conducting master batch, performing melt extrusion on the heat-conducting master batch and the polyamide resin, and the like. The high-thermal conductivity polyamide composite material is high in heat conductivity coefficient and excellent in mechanical property.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a high thermal conductivity polyamide composite material and a preparation method thereof. Background technique [0002] Thermally conductive materials are widely used in various fields of national defense industry and national economy. Traditional thermal conductive materials are mostly metals such as Au, Ag, Cu, Al, Mg, etc., and metal oxides such as Al 2 o 3 , MgO, BeO, ZnO, NiO, etc., metal nitrides such as AlN, Si 3 N 4 , BN, etc. and other non-metallic materials such as graphite, carbon black, etc. The rapid development of industrial production and science and technology has put forward newer and higher requirements for thermal conductive materials. In addition to thermal conductivity, it is hoped that the material has excellent comprehensive properties such as light weight, easy processing and molding, good mechanical properties, and chemical corr...

Claims

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Application Information

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IPC IPC(8): C08L77/02C08L77/06C08L51/06C08L23/30C08K13/06C08K9/06C08K3/28C08K3/38C08K3/34C08K7/24C08K7/06C08K5/20B29C47/92B29C48/92
CPCC08K13/06B29C48/92B29C2948/9258B29C2948/92704C08K3/28C08K3/34C08K3/38C08K5/20C08K7/06C08K7/24C08K9/06C08K2003/282C08K2003/385C08K2201/003C08K2201/011C08K2201/014C08L77/02C08L77/06C08L51/06
Inventor 段景宽吴宪何征张尊昌
Owner 惠州市沃特新材料有限公司
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