Tungsten copper module for high thermal load part of fusion device as well as preparation method thereof

A tungsten-copper, high-heat technology, applied in the field of tungsten-copper modules and its preparation, can solve the problems of not being able to find the experimental process and parameters, and cannot exceed the recrystallization temperature, and achieve the effects of low cost, high efficiency, and strong reliability

Active Publication Date: 2015-03-18
SOUTHWESTERN INST OF PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the experimental temperature cannot exceed the recrystallization temperature of tungsten. The published literature shows that the temperature of casting pure copper on the surface of tungsten is less than 1200°C, but the specific experimental process and parameters cannot be found.

Method used

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  • Tungsten copper module for high thermal load part of fusion device as well as preparation method thereof
  • Tungsten copper module for high thermal load part of fusion device as well as preparation method thereof

Examples

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Embodiment 1

[0032] A method for preparing a tungsten-copper module used for high thermal load parts of a fusion device, specifically comprising the following steps:

[0033] Step 1. Select suitable sized tungsten, oxygen-free pure copper and chrome-zirconium copper heat sink materials for the preparation of tungsten-copper modules. Among them, tungsten is industrially produced tungsten with a size of 40mm×40mm and a thickness of 5mm; the adaptive layer is made of tungsten with a thickness of 1mm Oxygen-free pure copper; chrome-zirconium-copper alloy heat sink adopts a material with a size of 45mm×45mm and a thickness of 25mm;

[0034] Step 2. Vacuum casting of oxygen-free pure copper on the surface of tungsten;

[0035] Step 2.1, pretreating the surface of tungsten and oxygen-free pure copper;

[0036] Pretreatment of tungsten and oxygen-free pure copper surface to remove impurities, oil stains and oxide film on the surface: put pure tungsten and chromium-zirconium copper alloy into acet...

Embodiment 2

[0048] A method for preparing a tungsten-copper module used for high thermal load parts of a fusion device, specifically comprising the following steps:

[0049] Step 1. Select suitable sized tungsten, oxygen-free pure copper and chrome-zirconium copper heat sink materials to prepare tungsten-copper modules. Among them, the tungsten is industrially produced tungsten with a size of 30mm×30mm and a thickness of 8mm; the adaptive layer is made of tungsten with a thickness of 2mm. Oxygen-free pure copper; chrome-zirconium-copper alloy heat sink adopts a material with a size of 35mm×35mm and a thickness of 25mm;

[0050] Step 2. Vacuum casting of oxygen-free pure copper on the surface of tungsten;

[0051] Step 2.1, pretreating the surface of tungsten and oxygen-free pure copper;

[0052] Pretreatment of tungsten and oxygen-free pure copper surface to remove impurities, oil stains and oxide film on the surface: put pure tungsten and chromium-zirconium copper alloy into acetone sol...

Embodiment 3

[0064] A method for preparing a tungsten-copper module used for high thermal load parts of a fusion device, specifically comprising the following steps:

[0065] Step 1. Select suitable sized tungsten, oxygen-free pure copper and chrome-zirconium copper heat sink materials for the preparation of tungsten-copper modules. Among them, tungsten is selected from industrially produced tungsten with a size of 60mm×60mm and a thickness of 10mm; the adaptive layer is selected from tungsten with a thickness of 3mm Oxygen-free pure copper; chrome-zirconium-copper alloy heat sink adopts a material with a size of 65mm×65mm and a thickness of 30mm;

[0066] Step 2. Vacuum casting oxygen-free pure copper on the surface of tungsten;

[0067] Step 2.1, pretreating the surface of tungsten and oxygen-free pure copper;

[0068] Pretreatment of tungsten and oxygen-free pure copper surface to remove impurities, oil stains and oxide film on the surface: put pure tungsten and chromium-zirconium copp...

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Abstract

The invention relates to the technical field of connection of heterogeneous materials and particularly relates to a tungsten copper module for a high thermal load part of a fusion device as well as a preparation method thereof. The method comprises the following steps: 1) selecting tungsten, anaerobic pure copper and a chromium zirconium copper alloy heat sink material in appropriate size; 2.1) pre-treating surfaces of tungsten and anaerobic pure copper; 2.2) carrying out vacuum-casting on the anaerobic pure copper on the surface of tungsten; 3.1) pre-treating the surface of the anaerobic pure copper in a tungsten/anaerobic pure copper block and a to-be-welded face of a chromium zirconium copper alloy; 3.2) welding the tungsten/anaerobic pure copper block and the chromium zirconium copper alloy in a vacuum hot pressed furnace; and 3.3) machining a welded tungsten/anaerobic pure copper/chromium zirconium copper alloy compound block to form the required tungsten copper module. The preparation method of the tungsten copper module is low in cost, high in efficiency and high in reliability and the tungsten copper module can bear a steady state thermal load which is greater than 5MW/m<2>.

Description

technical field [0001] The invention belongs to the technical field of connection of heterogeneous materials, and in particular relates to a tungsten-copper module used for high heat load components of a fusion device and a preparation method thereof. Background technique [0002] Tungsten is widely considered to be the most promising nuclear fusion device due to its advantages such as high melting point, excellent thermal conductivity, low sputtering yield and high self-sputtering threshold, low vapor pressure and low tritium retention performance. body material. Tungsten is connected with heat sink material copper alloy or structural material to make plasma-facing parts, which can be applied to the first wall and divertor positions of fusion devices. [0003] The biggest problem with the connection between tungsten and heat sink material copper is the large difference in thermal expansion coefficient and elastic modulus between tungsten and copper. The thermal expansion ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/01C22C9/00B22D19/16B23P15/00
CPCB22D19/16B32B15/01B32B15/20B32B38/162B32B38/18B32B2250/03B32B2307/306C22C9/00
Inventor 练友运刘翔封范
Owner SOUTHWESTERN INST OF PHYSICS
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