Preparation method and application of trifluoroethyleneoxyphenyl-containing silicone resin

Abstract

The invention provides a preparation method and application of trifluoroethyleneoxyphenyl-containing silicone resin. In the process of preparing the organic silicone resin, a trifluoroethyleneoxyphenyl-containing alkoxy silane monomer and various alkoxy silane monomers are hydrolyzed to be subjected to copolymerization to obtain the novel high-temperature cured silicone resin with a high refractive index, good heat resistance and excellent dielectric properties. The silicone resin can be applied to the fields of microelectronic industry, electrical appliances and aerospace as a high-performance resin matrix or packaging material.

Description

technical field

[0001] The invention belongs to the field of high-performance polymer production, and in particular relates to a production method and application of a high-temperature-cured organic silicon resin material containing trifluoroethyleneoxyphenyl. Background technique

[0002] In the development of science and technology, the development of construction, automation, electrical appliances, microelectronics, aerospace and other fields has an increasing demand for new materials, especially high-performance polymer materials, such as adhesives in the high-temperature field, which can be scaled down High-performance low-dielectric materials, composite materials, etc. for electronic components. In the field of microelectronics industry, the manufacture of 65nm chips based on copper interconnection technology urgently needs heat-resistant materials with low dielectric constant. Commonly used polyimide materials have good thermal stability and mechanical properties, but...

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