Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

PTMG (polyoxytetramethylene glycol) modifying moisture curing polyurethane melt adhesive and preparation method thereof

A polyurethane hot-melt adhesive, moisture-curing technology, used in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of poor hydrolysis resistance, low peel strength, and poor flexibility, and achieve hydrolysis resistance. Good performance, overcoming the effects of low peel strength and low cost

Active Publication Date: 2015-03-25
SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD +2
View PDF2 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyether-type moisture-curing polyurethane hot-melt adhesives have the advantages of low melt viscosity, good melt viscosity stability, good hydrolysis resistance, good flexibility, and low cost, but low peel strength; while polyester-type moisture-curing polyurethane heat Melt adhesives have good initial and final bond strengths, but poor hydrolysis resistance and poor flexibility; therefore, how to prepare and develop a PUR product so that it has both polyether-type moisture-curing polyurethane hot-melt adhesives have good hydrolysis resistance, The advantages of good flexibility and low cost, and the advantages of high peel strength of polyester-based moisture-curing polyurethane hot-melt adhesives are also a problem currently facing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PTMG (polyoxytetramethylene glycol) modifying moisture curing polyurethane melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A PTMG modified moisture-curing polyurethane hot-melt adhesive, the following components are taken in parts by mass: 35 parts of polypropylene glycol, 15 parts of polytetrahydrofuran diol, 8 parts of polyadipate-1,6-hexanediol ester diol, 0.5 parts of antioxidant, 15.99 parts of tackifying resin, 25 parts of 4,4'-diphenylmethane diisocyanate (MDI), 0.01 part of catalyst, and 0.5 part of white carbon black.

[0044] The preparation steps are as follows:

[0045] (1) Selection of raw materials;

[0046] (2) Stir and mix polypropylene glycol, polytetrahydrofuran diol, polyhexamethylene adipate diol, and antioxidant, heat up to about 120°C, and dehydrate at a vacuum degree of less than 100Pa at 0.5 h;

[0047] (3) Add tackifying resin, continue to heat up to 135-140°C, and dehydrate for 1.5h at a vacuum degree of less than 100Pa;

[0048](4) Cool down to 87°C, add 4,4'-diphenylmethane diisocyanate (MDI) and catalyst, stir, and react for 2 hours at a vacuum degree of less...

Embodiment 2

[0053] A PTMG modified moisture-curing polyurethane hot-melt adhesive, the following components are taken in parts by mass: 30 parts of polypropylene glycol, 20 parts of polytetrahydrofuran diol, 8 parts of polyadipate-1,6-hexanediol ester diol, 0.5 parts of antioxidant, 15 parts of tackifying resin, 24 parts of 4,4'-diphenylmethane diisocyanate (MDI), 0.01 part of catalyst, 2 parts of silane coupling agent, and 0.49 parts of white carbon black.

[0054] The preparation steps are as follows:

[0055] (1) Selection of raw materials;

[0056] (2) Stir and mix polypropylene glycol, polytetrahydrofuran diol, polyhexamethylene adipate diol, and antioxidant, heat up to about 120°C, and dehydrate at a vacuum degree of less than 100Pa at 0.5 h;

[0057] (3) Add tackifying resin, continue to heat up to 135-140°C, and dehydrate for 1.5h at a vacuum degree of less than 100Pa;

[0058] (4) Cool down to 87°C, add 4,4'-diphenylmethane diisocyanate (MDI) and catalyst, stir, and react for ...

Embodiment 3

[0064] A PTMG modified moisture-curing polyurethane hot-melt adhesive, the following components are taken in parts by mass: 18.99 parts of polypropylene glycol, 30 parts of polytetrahydrofuran diol, 8 parts of poly-1,6-hexanediol adipate, 0.5 parts of antioxidant, 15 parts of tackifying resin, 25 parts of 4,4'-diphenylmethane diisocyanate (MDI), 0.01 part of catalyst, 2 parts of silane coupling agent, and 0.5 parts of white carbon black.

[0065] The preparation steps are as follows:

[0066] (1) Selection of raw materials;

[0067] (2) Stir and mix polypropylene glycol, polytetrahydrofuran diol, polyhexamethylene adipate diol, and antioxidant, heat up to about 120°C, and dehydrate at a vacuum degree of less than 100Pa at 0.5 h;

[0068] (3) Add tackifying resin, continue to heat up to 135-140°C, and dehydrate for 1.5h at a vacuum degree of less than 100Pa;

[0069] (4) Cool down to 87°C, add 4,4'-diphenylmethane diisocyanate (MDI) and catalyst, stir, and react for 2 hours ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a PTMG (polyoxytetramethylene glycol) modifying moisture curing polyurethane melt adhesive and a preparation method thereof. The melt adhesive product comprises the following raw materials in parts by weight: 18-35 parts of polypropylene glycol, 15-30 parts of polytetrahydrofuran glycol, 8 parts of poly adipic acid-1, 6 hexanediol esterdiol, 0.5 part of an antioxidant, 15-20 parts of tackifying resin, 24-25 parts of 4, 4'- ditan diisocyanate, 0.01 part of a catalyst, 0-0.5 part of a chain extender, 0-2 parts of a silane coupler, and 0-0.5 part of white carbon black. The PTMG modifying moisture curing polyurethane melt adhesive prepared by the preparation method disclosed by the invention has the advantages of high stripping strength, good washing resistant performance, good flexibility, environmental protection and the like.

Description

technical field [0001] The invention relates to a PTMG modified moisture-curing polyurethane hot melt adhesive and a preparation method thereof. Background technique [0002] Moisture-curing polyurethane hot melt adhesive (hereinafter referred to as PUR) is a type of polyurethane adhesive containing terminal-NCO groups. When in use, heat, melt and sizing, and after the adhesive layer is cooled and physically solidified to produce preliminary adhesive force, the terminal NCO in the adhesive layer will react with the moisture in the air or the active hydrogen compound on the surface of the adherend to produce chemical crosslinking solidify. Moisture-curing polyurethane hot-melt adhesive not only has the advantages of fast bonding and positioning of traditional thermoplastic hot-melt adhesives and high initial bonding strength, but also can be further cured and cross-linked, so that the adhesive force and cohesive strength of the adhesive layer can be significantly improved. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J175/08C09J11/08C09J11/04C09J11/06C08G18/76C08G18/48C08G18/42
Inventor 李哲龙朱万育肖虎鹏曾作祥
Owner SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com