Multifunctional organic silicon thermal interface material

A thermal interface material, silicone technology, applied in the field of heat dissipation materials, can solve the problems of low heat dissipation efficiency of ceramic radiators, failure to meet insulation safety requirements, failure to meet heat dissipation requirements, etc., to achieve lower temperature, easy implementation, and high flame retardancy Effect

Inactive Publication Date: 2015-04-08
SHENZHEN BORNSUN INDAL
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ceramic radiators cannot meet the heat dissipation requirements due to low heat dissipation efficiency, and ordinary heat-resistant and heat-conducting composite materials cannot work at a high temperature of 280°C for a long time. After a period of use, the material will degrade, resulting in failure to meet the safety requirements of insulation

Method used

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  • Multifunctional organic silicon thermal interface material
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Take 10kg of boron nitride powder, 30kg of silicon nitride powder, 50kg of aluminum oxide powder, 5kg of iron oxide powder, 3kg of aluminum hydroxide powder, and 20kg of methyl vinyl silicone rubber, and stir them in a stirrer Mix for 30 minutes, then place the mixture in a two-roller mill, add 2Kg of double-two-fourth vulcanizing agent in the two-roller mill and open for 20 minutes, and the formed composite material is calendered on a glass fiber with a thickness of 0.1mm After the thickness reaches 0.5mm, it is dried at a temperature of 120°C and vulcanized to form the multifunctional organic silicon thermal interface material of the present invention.

[0019] According to the measurement, the thermal conductivity of the multifunctional silicone thermal interface material is 1.23W / m·K, the breakdown voltage is 7KV, and the flame retardancy is UL 94V-0.

[0020] After baking at 280°C for 1000 hours, the thermal conductivity of the silicone thermal interface material i...

Embodiment 2

[0022] Take 20kg of boron nitride powder, 30kg of silicon nitride powder, 70kg of aluminum oxide powder, 2kg of iron oxide powder, 2kg of cerium oxide powder, 2kg of aluminum hydroxide powder, and 20kg of methyl vinyl silicone rubber , stirred and mixed in the agitator for 30 minutes, then put the mixture in a two-roll mill, add 2kg of bis-two-four vulcanizing agent in the two-roll mill and knead for 20 minutes, and the formed composite material is calendered to a thickness of After the thickness reaches 0.4mm, it is dried and vulcanized at a temperature of 120° C. to form the multifunctional organic silicon thermal interface material of the present invention.

[0023] After measurement, the thermal conductivity of the multifunctional silicone thermal interface material is 1.75W / m·K, the breakdown voltage is 8.5KV, and the flame retardancy is UL 94V-0.

[0024] After baking at 280°C for 1000 hours, the thermal conductivity of the multifunctional silicone thermal interface mate...

Embodiment 3

[0026] Take 40kg of boron nitride powder, 10kg of silicon nitride powder, 30kg of aluminum oxide powder, 5kg of iron oxide powder, 5kg of aluminum hydroxide powder, and 20kg of methyl vinyl silicone rubber, and stir in the mixer Mix for 30 minutes, then place the mixture in a two-roller mill, add 2kg of double-two-fourth vulcanizing agent in the two-roller mill and open for 20 minutes, and the formed composite material is rolled on the polyimide of 0.05mm On the film, after the thickness reaches 0.3mm, it is dried at a temperature of 120° C., and vulcanized. The multifunctional organic silicon thermal interface material of the present invention.

[0027] After measurement, the thermal conductivity of the multifunctional silicone thermal interface material is 0.85W / m·K, the breakdown voltage is 8KV, and the flame retardancy is UL 94V-0.

[0028] After baking at 280°C for 1000 hours, the thermal conductivity of the multifunctional silicone thermal interface material is 0.82W / m·K...

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Abstract

The invention relates to a multifunctional organic silicon thermal interface material. The thermal interface material is formed by compounding the following components in percentage by weight: 10-40% of silicone rubber, 1-10% of a heat resistant agent, 1-20% of a flame retardant, 1-10% of a sulfurizing agent and 55-85% of a functional filler. The thermal interface material is a flaky material formed by mixing the silicone rubber, the heat resistant agent, the flame retardant, the sulfurizing agent and the functional filler according to the proportion, and coating or calendering a mixture on glass fiber cloth or a polyimide film. The organic silicon thermal interface material provided by the invention has high temperature resistance and good heat conduction, insulation and flame retardance, thereby effectively ensuring normal working of electronic equipment.

Description

【Technical field】 [0001] The invention relates to heat dissipation materials for heat dissipation electronic devices and equipment, in particular to a multifunctional organic silicon thermal interface material for heat dissipation of vehicle electronic devices. 【Background technique】 [0002] With the rapid development of contemporary electronic technology, the integration level and assembly density of electronic components have been continuously improved. While realizing powerful functions, it has also led to a sharp increase in power consumption and heat generation of electronic equipment. The high temperature generated during the operation of electronic devices will have a harmful effect on the stability, reliability and life of electronic components. Therefore, ensuring that the heat generated by the heating electronic components can be discharged in time has become an important aspect of the system assembly of microelectronic products. At present, cars have widely ente...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07C08L83/08C08L83/05C08K13/02C08K3/22C08K5/14C08K3/38C08K3/34
Inventor 刘治林唐正阳王勇
Owner SHENZHEN BORNSUN INDAL
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