Medium density fiberboard employing high-permeability nano water-based resin edge banding

Abstract

The invention relates to a board, and particularly relates to a medium density fiberboard employing high-permeability nano water-based resin edge banding. The medium density fiberboard comprises a medium density fiberboard body, wherein the side surface of the board body is provided with an edge banding coating; thermosetting coatings are arranged on the edge banding coating and the surface of the board body; the thermosetting coatings are obtained by electrostatic spraying and curing treatment of low-temperature curing powder coatings on the edge banding coating and the surface of the board body; the edge banding coating is obtained by edge banding and drying treatment of the high-permeability nano water-based resin on the side surface of the board body; and the high-permeability nano water-based resin is prepared from the following raw materials in percentage by mass: 62%-90% of unsaturated polyester resin, 0-6.7% of a curing agent, 1.5%-30% of nanometer TiO2 particles, and 1.8%-3% of water-soluble transparent glue. The medium density fiberboard is good in edge banding effect; cracks are effectively prevented from being generated on the side surface of the medium density fiberboard; the blocking technology is simple and convenient, and is suitable for edge banding of base material workpieces with various shapes; and the requirements of different medium density fiberboards on the mechanical strength of the edge banding coating can be met.

Description

technical field [0001] The invention relates to a board, in particular to a medium-fiber board edge-sealed with a high-permeability nano water-based resin. Background technique [0002] With the enhancement of environmental awareness and the improvement of environmental regulations, the use of traditional solvent-based coatings is increasingly restricted due to the presence of volatile organic compounds (VOC) and harmful air pollutants, while powder coatings are increasingly being used by people. focus on. Conventional thermosetting powder coatings cannot be directly applied to heat-sensitive substrates (such as wood, fiberboard, plastic, cement board, etc.), so low-temperature curing powder coatings for heat-sensitive substrates have been developed. [0003] Heat-sensitive substrates such as MDF mainly have the following problems in the actual production process: cracks will appear on the side of the substrate during the baking and curing process after spraying of low-temp...

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Problems solved by technology

[0003] Heat-sensitive substrates such as MDF mainly have the following problems in the actual production process: cracks will appear on the side of the substrate during the baking and curing process after spraying of low-temperature curing powder coatings and after curing

[0006] The above technical solutions all use hot-melt powder coating to apply to the side of the substrate to realize the edge sealing of heat-sensitive substrates including plates. Although the generation of cracks on the side of the plate is avoided, the edge sealing process is complicated and is not suitable for complex shapes. The heat-sensitive substrate of the structure is edge-banded, and the penetration of liquid application is poor, and thick coating cannot be achieved, so that the strength and leveling of the edge-sealing coating are limited, and ultimately it is impossib...

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