Method for preparing silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding

Abstract

The invention relates to a method for preparing a silicon-aluminum alloy electronic packaging material by virtue of rapid injection molding. The silicon-aluminum alloy comprises the following components in percentage by weight: 10%-60% of Si and the balance of Al. The method comprises the following steps of preparing according to the components of the alloy, mixing the prepared silicon-aluminum alloy powder and a binder at a certain ratio in an internal mixer to obtain a uniform compound feedstock, carrying out injection molding on the feedstock to obtain a green body, removing the binder from the green body and sintering to obtain the silicon-aluminum alloy electronic packaging material of which the relative density is greater than 99%. The silicon-aluminum alloy material has the advantages of uniform alloy components and uniform and dense microstructures and can be prepared into the silicon-aluminum alloy electronic packaging material which has continuously adjustable thermal expansion coefficient range of (6-12)*10<-6>/K, the thermal conductivity range of 110-150W/mK and the specific gravity of 1.7-2.6g/cm<3> and complex and diversiform structure, the complicated machining processes such as lathing, milling, planing and grinding are avoided and the method has the advantages of high production efficiency, simple process, low cost, excellent product performance and the like.

Description

technical field [0001] The invention relates to the field of silicon aluminum alloy electronic packaging materials, in particular to a method for preparing silicon aluminum alloy electronic packaging materials by rapid injection molding. Background technique [0002] The development of science and technology in the 21st century is particularly prominent in the development of electronic science and technology. With the development of electronic components in the direction of smaller size, lighter weight and faster operation speed and the rapid development of large-scale integrated circuit technology, the integration level and packaging density of IC chips have doubled, and the electronic packaging materials are also correspondingly put forward higher requirements. Electronic packaging directly affects the electrical, thermal, optical and mechanical properties of integrated circuits and devices, and plays a key role in the miniaturization of the system. Therefore, electronic ...

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Problems solved by technology

[0004] At present, the conventional preparation methods of silicon aluminum alloy electronic packaging materials include smelting casting method, infiltration method, powder metallurgy method, spray forming method and rapid hot pressing method, etc., but these methods have high equipment cost and process time to varying degrees. Long length, difficult forming, difficult process control and difficult industrial production, etc., and some methods also have defects such as incomplete penetration of prefabricated parts, uneven microstructure, chemical reaction at the interface, and single structure of the obtained material.

In the patent CN102094142A, a method for preparing high-silicon aluminum alloy electronic packaging materials by rapid hot pressing is disclosed. The method is to put the powder into the mold under the protection of an inert gas, heat it while pressurizing, and undergo hot pressing. Forming a product requires high equipment requirements and high cost, and the product

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