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Environment-friendly flame-retardant heat-conducting glue and preparation method thereof

A heat-conducting adhesive, environmentally friendly technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of high cost, achieve good mechanical properties, good uniformity, and ensure the effect of bonding performance

Active Publication Date: 2015-04-29
中山沃硅化工科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems of insufficient existing technology and high cost, the present invention provides a low-cost, environmentally friendly, flame-retardant and thermally conductive adhesive preparation method

Method used

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  • Environment-friendly flame-retardant heat-conducting glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A method for preparing an environmentally friendly flame-retardant heat-conducting adhesive, comprising the steps of:

[0037] 1) Add 250g of KH-560 to 100L of absolute ethanol solution, slowly add 50g of concentrated ammonia water to adjust the solution to be weakly alkaline (pH value is 7.5), add 12kg of 1μm aluminum nitride, mechanically stir at 60°C for 5h, and rotate at 120r / min. Centrifuge, rinse with absolute ethanol three times, and dry in a vacuum oven at 110°C for 12 hours to obtain component A.

[0038] 2) Send 100kg of epoxy resin E-51, 90kg of methyl hexahydrophthalic anhydride, and 2kg of DMP-30 into a high-speed disperser and mix evenly to obtain low-viscosity component B.

[0039] 3) Mix component A, component B, triphenyl phosphate, and aluminum hydroxide on a three-roll mill in a mass ratio of 50:100:35:15. Under the condition of lower than 60°C, vacuumize for 1h, and the vacuum degree is controlled at 0.05Mpa.

[0040] 4) The mixture after vacuumi...

Embodiment 2

[0042] A method for preparing an environmentally friendly flame-retardant heat-conducting adhesive, comprising the steps of:

[0043] 1) Add 250g KR‐38S to 100L absolute ethanol solution, slowly add 49g concentrated ammonia water to adjust the solution to be weakly alkaline (pH value is 7.3), add 12kg 1μm aluminum nitride, mechanically stir at 60°C for 5h, and rotate at 120r / min. Centrifuge, rinse with absolute ethanol three times, and dry in a vacuum oven at 110°C for 12 hours to obtain component A.

[0044] 2) Send 100kg of epoxy resin E-51, 90kg of methyl hexahydrophthalic anhydride, and 2kg of DMP-30 into a high-speed disperser and mix evenly to obtain low-viscosity component B.

[0045] 3) Mix component A, component B, triphenyl phosphate, and aluminum hydroxide on a three-roll mill in a mass ratio of 50:100:35:15. Under the condition of lower than 60°C, vacuumize for 1h, and the vacuum degree is controlled at 0.05Mpa.

[0046] 4) The mixture after vacuuming is heated...

Embodiment 3

[0048] A method for preparing an environmentally friendly flame-retardant heat-conducting adhesive, comprising the steps of:

[0049] 1) Add 250g KH-560 to 100L absolute ethanol solution, slowly add 51g concentrated ammonia water to adjust the solution to be weakly alkaline (pH value is 8), add 12kg 1μm aluminum nitride, mechanically stir at 60°C for 5h, and rotate at 120r / min. Centrifuge, rinse with absolute ethanol three times, and dry in a vacuum oven at 110°C for 12 hours to obtain component A.

[0050] 2) Send 100kg of epoxy resin E-51, 90kg of methyl hexahydrophthalic anhydride, and 2kg of DMP-30 into a high-speed disperser and mix evenly to obtain low-viscosity component B.

[0051]3) Mix component A, component B, cresyl diphenyl phosphate, and aluminum hydroxide on a three-roll mill in a mass ratio of 50:100:35:15. Under the condition of lower than 60°C, vacuumize for 1h, and the vacuum degree is controlled at 0.05Mpa.

[0052] 4) The mixture after vacuuming is hea...

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Abstract

The invention discloses environment-friendly flame-retardant heat-conducting glue and a preparation method thereof. The preparation method comprises the following steps: diluting a coupling agent by using absolute ethyl alcohol, regulating the pH value of the diluted solution, adding a heat-conducting filler, and mechanically stirring; centrifuging, washing, and drying, thereby obtaining a component A; uniformly mixing an epoxy resin, a curing agent and a curing accelerator by using a high-speed dispersion machine, thereby obtaining a low-viscosity component B; and uniformly grinding and mixing the component A, the component B, an organic phosphorus flame retardant and aluminum hydroxide, vacuumizing, heating the mixture at the temperature of 80-90 DEG C, and heating at the temperature of 130-150 DEG C, thereby obtaining the environment-friendly flame-retardant heat-conducting glue. The environment-friendly flame-retardant heat-conducting glue is low in viscosity, high in heat conductivity coefficient, good in mechanical property and high in acid-base resistance and corrosion resistance, the flame-retardant level reaches UL94V-0, the heat dissipation problem of a general electronic component can be solved; because the heat-conducting glue has good flame-retardant property, when the heat-conducting glue is applied to high-voltage and high-temperature electrical equipment, the on-fire potential safety hazard of the electronic component is effectively reduced.

Description

technical field [0001] The invention relates to an adhesive, in particular to an environmentally friendly flame-retardant thermally conductive adhesive and a preparation method thereof. The environmentally friendly flame-retardant thermally conductive adhesive can be used for heat dissipation of common electronic products and large electronic devices. Background technique [0002] With the development of science and technology, people's demand and requirements for electronic products are getting higher and higher, and electronic products are developing in the direction of integration, miniaturization, high performance, energy saving, environmental protection and safety. With the high integration of electronic products, the heat generated per unit volume continues to increase, and heat dissipation will inevitably become a factor that limits its development. Therefore, the development of heat dissipation materials with appropriate viscosity, strong adaptability, low price and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04
Inventor 袁文辉肖强强李莉
Owner 中山沃硅化工科技有限公司
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