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Ag-Cu-Ti/Sn nano-particle soldering paste and preparation method thereof

A technology of ag-cu-ti and nanoparticles, applied in welding equipment, welding medium, manufacturing tools, etc., to achieve the effect of simple process, less agglomeration and low cost

Inactive Publication Date: 2015-05-06
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation of Ag-Cu-Ti / Sn nano-solder paste and its application in the field of connection are rarely reported at home and abroad

Method used

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  • Ag-Cu-Ti/Sn nano-particle soldering paste and preparation method thereof

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specific Embodiment approach 1

[0019] Embodiment 1: This embodiment provides a method for preparing 72Ag-28Cu eutectic nano-solder paste, which is specifically implemented according to the following steps:

[0020] Take Ag and Cu nano-powders of a certain quality, the mass percentages of the two are 72% and 28% respectively, and the Ag and Cu nano-powder particle sizes are selected to be 30±10nm and 50±10nm respectively, and the weighed Ag and Cu nano-powders are weighed Mix the two kinds of nano powders; add the dispersant polyacrylamide, the binder terpineol, the diluent alcohol and terpineol in sequence according to the mass ratio of 5:5:5:5 (alcohol and terpineol can be mixed according to 1: 1), flux rosin, so that the modifier system accounts for 20% of the overall mass percentage; the above system is uniformly mixed in acetone solvent by ultrasonic vibration method, and then the excess solvent is volatilized to make 72Ag- 28Cu nano-solder paste, the solid content of which is more than 80%; put the pre...

specific Embodiment approach 2

[0022] Specific embodiment two: This embodiment provides a method for preparing 68.4Ag-26.6Cu-5Ti nano-solder paste, which is specifically implemented according to the following steps:

[0023] Weigh a certain amount of Ag, Cu, and Ti nano-powders. The mass percentages of the three are 68.4%, 26.6%, and 5% respectively. ±10nm, mix the weighed Ag, Cu, Ti three kinds of nano-powders; according to the mass ratio of 3:4:5:6, add dispersant fish oil, binder terpineol, diluent alcohol and terpineol, Soldering flux rosin, so that the modifier system accounts for 18% of the overall mass percentage; the above system is uniformly mixed in acetone solvent by ultrasonic vibration, and then the excess solvent is volatilized to make 68.4Ag-26.6Cu-5Ti Nano-solder paste, wherein the solid content is above 82%; the prepared 68.4Ag-26.6Cu-5Ti nano-solder paste is put into a needle tube for sealed storage, and the storage temperature is 0-10°C.

[0024] The 68.4Ag-26.6Cu-5Ti nano-solder paste p...

specific Embodiment approach 3

[0025] Specific embodiment three: This embodiment provides a method for preparing 64Ag-34.5Cu-1.5Ti nano-solder paste, which is specifically implemented according to the following steps:

[0026] Weigh a certain mass of Ag, Cu, and Ti nano-powders. The mass percentages of the three are 64%, 34.5%, and 1.5% respectively. ±10nm, mix the weighed Ag, Cu, and Ti nano-powders; add dispersant fish oil, binder terpineol, diluent terpineol, and flux in sequence according to the mass ratio of 3:4:5:6 Rosin, so that the modifier system accounts for 18% of the overall mass percentage; the above-mentioned system is uniformly mixed in acetone solvent by means of ultrasonic vibration, and then the excess solvent is volatilized to make 64Ag-34.5Cu-1.5Ti nano-welding Paste, the solid content of which is above 82%; put the prepared 64Ag-34.5Cu-1.5Ti nano-solder paste into a needle tube for sealed storage, and the storage temperature is 0-10°C.

[0027] The 64Ag-34.5Cu-1.5Ti nano-solder paste pre...

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Abstract

The invention discloses Ag-Cu-Ti / Sn nano-particle soldering paste and a preparation method thereof. The soldering paste is prepared from, by mass, 80-90% of nano-particle solid components and 10-20% of modifying agent, wherein the modifying agent comprises, by mass, 2-8 parts of dispersing agent, 2-8 parts of binding agent, 2-10 parts of diluent and 2-10 parts of soldering flux; the nano-particle solid components are formed by mixing Ag, Cu and Ti or Sn, the Cu accounts for 20-50% of the total mass of the nano-particle solid components, and the Ti or Sn accounts for 0-20% of the nano-particle solid components. The method comprises the following preparation steps: 1, weighing the nano-particle solid components; 2, adding the modifying agent sequentially; 3, evenly and uniformly mixing the system in an organic solvent, then evaporating the excessive solvent out, and forming the Ag-Cu-Ti / Sn nano-particle soldering paste; 4, placing the Ag-Cu-Ti / Sn nano-particle soldering paste obtained through preparation into a needle tube to be sealed and stored. The Ag-Cu-Ti / Sn nano-particle soldering paste has the advantages that the ratios of any components are controllable, the process is simple, and the cost is low.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials, and relates to an Ag-Cu-Ti / Sn nano-particle solder paste and a preparation method thereof, which can be used as an electronic packaging interconnection for low-temperature connection and high-temperature service of wide-bandgap semiconductor SiC high-power devices Material. Background technique [0002] With the requirements of multifunctional, high performance and high density of power electronic devices, since the performance of Si-based power devices has approached or even reached the intrinsic limit of its materials, researchers have turned their attention to the following since the 1980s. Wide bandgap semiconductor devices represented by SiC and GaN. Wide bandgap semiconductor devices have excellent characteristics such as high breakdown electric field, high thermal conductivity, high temperature resistance, and radiation resistance. In addition to being widely used i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/363B23K35/40
CPCB23K35/3006B23K35/025B23K35/3613B23K35/362
Inventor 王春青刘晓剑孔令超郑振
Owner HARBIN INST OF TECH
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