Table chip double side electrophoresis glass passivation technology

Abstract

The invention relates to the technical field of passivation protection of chips of semiconductor devices, in particular to a table chip double side electrophoresis glass passivation technology. The table chip double side electrophoresis glass passivation technology includes: using a modified electrophoresis frame, directly placing a silicon slice in an anodic metal half ring so as to use the silicon slice as an anodic plate, and placing negative plates on two sides of the anodic plate for electrophoresis. Accordingly, distances from table grooves in two sides of the silicon slice to the negative plates are equal, electric field distribution is even, and glass layers of the same thickness can be formed. Furthermore, an appropriate electrophoresis solution proportion and a glass sintering technology in a wet oxygen atmosphere are used, and therefore consistency of a double face glass passivation layer can be improved, glass is in complete and uniform in modeling, and simultaneously qualified rate and reliability of products can be improved, surge resisting ability of the semiconductor devices is enhanced, and production efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of chip passivation protection for semiconductor devices, in particular to a double-sided electrophoretic glass passivation process for mesa chips. Background technique [0002] At present, mesa chips of some devices in the semiconductor industry, such as discharge tubes, bidirectional TVS diodes, and triacs, generally require double-sided passivation protection. Commonly used glass passivation protection processes include knife scraping, photoresisting, and electrophoresis. The knife scraping method has the disadvantages of uneven glass layer and poor reliability; the photoresist method has the problems of high cost and complicated process; the electrophoresis method has the advantages of simple process and high reliability and is applied to the passivation protection of the mesa chip. However, the commonly used double-sided electrophoresis method is usually the process of electrophoresis on one side and th...

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Problems solved by technology

The knife scraping method has the disadvantages of uneven glass layer and poor reliability; the photoresist method has the problems of high cost and complicated process; the electrophoresis method has the advantages of simple process and high reliability and is applied to the passivation protection of mesa chips

However, the commonly used double-sided electrophoresis method is usually the process of electrophoresis on one side and then on the other side, and there are the following problems: when the second side is electrophoresed, the glass on the part of the first side that has been electrophoresed will fall off; the two electrophoresis will cause The thickness and shape of the glass layer on both sides of the device are inconsistent; the two electrophoresis operations take a long time, which affects production efficiency

Two electrophoresis processes will cause defects such as poor electrical properties, low yield and poor reliability of the device

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