Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED

A high-power, high-performance technology, applied in the direction of metal layered products, non-polymer adhesive additives, epoxy resin glue, etc., can solve the gap in mechanical properties and electrical insulation performance, and has not entered the stage of substantive in-depth research and other problems, to achieve low expansion coefficient, high moisture resistance, good effect of integrated development

Inactive Publication Date: 2015-05-13
广东全宝科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]The selection of thermally conductive fillers used in aluminum substrates, the pretreatment of thermally conductive fillers, the formulation research of thermally conductive fillers and modified epoxy resins, and how to ensure the uniformity of thermally conductive fillers are distributed in the insulating layer, and have not yet e

Method used

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  • Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED
  • Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED
  • Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED

Examples

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Example Embodiment

[0034] Example 1

[0035] A metal-based copper clad laminate for high-power LEDs manufactured by using high-performance RCC, comprising an epoxy resin composition, wherein the solid component of the epoxy resin composition has the following mass fractions: (A) Bisphenol A epoxy 5 parts of resin, 5 parts of dicyclopentadiene phenol epoxy resin; (B) 5 parts of rubber; (C) 50 parts of filler; (D) 1 part of dicyandiamide; (E) 0.1 part of 2-methylimidazole,

[0036] Among them, the epoxy equivalent of bisphenol A epoxy resin is 430, and the Mooney viscosity of nitrile rubber is 30. The filler is a mixture of aluminum oxide, aluminum hydroxide and magnesium hydroxide, and aluminum oxide accounts for the total weight of the filler. 60%, aluminum hydroxide accounts for 20% of the total weight of the filler, and magnesium hydroxide accounts for 20% of the total weight of the filler; wherein the structural formula of the phenoxy resin is:

[0037]

[0038] The number average molecular weight ...

Example Embodiment

[0044] Example 2

[0045] A metal-based copper clad laminate for high-power LEDs manufactured by using high-performance RCC, comprising an epoxy resin composition, wherein the solid component mass fraction of the epoxy resin composition is: (A) Bisphenol A epoxy resin 25 parts, 5 parts phenoxy resin, 20 parts dicyclopentadiene phenol epoxy resin; (B) 25 parts rubber; (C) 70 parts filler; (D) 5 parts m-phenylenediamine; (E) 2-ethyl 1 part of 4-methylimidazole, the amine curing agent is dicyandiamide, the accelerator is 2-methylimidazole, the epoxy equivalent of bisphenol A epoxy resin is 450, and the Mooney viscosity of nitrile rubber The filler is a mixture of aluminum oxide, aluminum hydroxide and magnesium hydroxide, where aluminum oxide accounts for 80% of the total weight of the filler, aluminum hydroxide accounts for 10% of the total weight of the filler, and magnesium hydroxide accounts for 10% of the total weight of the filler. %; wherein the phenoxy resin structural for...

Example Embodiment

[0052] Example 3

[0053] A metal-based copper clad laminate for high-power LEDs manufactured by using high-performance RCC, comprising an epoxy resin composition, wherein the solid component mass fraction of the epoxy resin composition is: (A) Bisphenol A epoxy resin 35 parts, 10 parts of phenoxy resin, 30 parts of dicyclopentadiene phenol epoxy resin; (B) 35 parts of rubber; (C) 80 parts of filler; (D) 10 parts of a mixture of dicyandiamide and diaminodiphenylmethane; (E) 2 parts of a mixture of 2-ethyl-4-methylimidazole and 2-phenylimidazole, in which the epoxy equivalent of bisphenol A epoxy resin is 450, and the Mooney viscosity of nitrile rubber is 40. The filler is a mixture of aluminum oxide, aluminum hydroxide and magnesium hydroxide, wherein aluminum oxide accounts for 80% of the total weight of the filler, aluminum hydroxide accounts for 10% of the total weight of the filler, and magnesium hydroxide accounts for 10% of the total weight of the filler; The phenoxy resi...

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Abstract

The invention relates to a metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to a high-power LED. The metal-base copper clad laminate comprises epoxy resin composition, wherein solid components of the epoxy resin composition comprise, in parts by mass, as follows: (A) 5-35 parts of bisphenol A type epoxy resin, 0-10 parts of phenoxy resin and 5-30 parts of dicyclopentadiene phenol epoxy resin; (B) 5-35 parts of nitrile rubber; (C) 50-80 parts of filler; (D) 1-10 parts of an amine curing agent; (E) 0.1-2 parts of an accelerant. The metal-base copper clad laminate has good flame retardancy, heat conduction, impact resistance and environmental protection property.

Description

technical field [0001] The invention relates to a metal-based copper-clad laminate for high-power LEDs manufactured by high-performance RCC. Background technique [0002] At present, the existing problems of domestic aluminum substrates: [0003] (1) The gap in thermal conductivity [0004] In China, the selection of thermally conductive fillers used in aluminum substrates, the pretreatment of thermally conductive fillers, the research on the formulation of thermally conductive fillers and modified epoxy resins, and how to ensure that thermally conductive fillers are evenly distributed in the insulating layer have not yet entered into substantial depth. research stage. [0005] (2) The gap in electrical insulation performance [0006] Under the condition of the same thickness, the insulation strength of domestic aluminum substrates can only reach 1 / 3~1 / 4 of the breakdown strength of foreign products. [0007] (3) The gap in mechanical properties [0008] The coefficient...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L63/00C08L9/02C08K3/22C08G59/50C09J163/02C09J163/00C09J109/02C09J11/04B32B15/092B32B15/20B32B37/06B32B37/10B32B37/12
Inventor 罗君林晨
Owner 广东全宝科技股份有限公司
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