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Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED

A high-power, high-performance technology, applied in the direction of metal layered products, non-polymer adhesive additives, epoxy resin glue, etc., can solve the gap in mechanical properties and electrical insulation performance, and has not entered the stage of substantive in-depth research and other problems, to achieve low expansion coefficient, high moisture resistance, good effect of integrated development

Inactive Publication Date: 2015-05-13
广东全宝科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]The selection of thermally conductive fillers used in aluminum substrates, the pretreatment of thermally conductive fillers, the formulation research of thermally conductive fillers and modified epoxy resins, and how to ensure the uniformity of thermally conductive fillers are distributed in the insulating layer, and have not yet entered the stage of substantive in-depth research
[0005] (2) The gap in electrical insulation performance
[0006]Under the same thickness condition, the insulation strength of domestic aluminum substrate can only reach 1 / 3~1 / 4 breakdown strength of foreign products under the same thickness condition
[0007] (3) The gap in mechanical properties

Method used

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  • Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED
  • Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED
  • Metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to high-power LED

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A metal-based copper-clad laminate for high-power LEDs made of high-performance RCC, including an epoxy resin composition, wherein the mass fraction of the solid component of the epoxy resin composition is: (A) bisphenol A type epoxy 5 parts of resin, 5 parts of dicyclopentadiene phenol epoxy resin; (B) 5 parts of rubber; (C) 50 parts of filler; (D) 1 part of dicyandiamide; (E) 0.1 part of 2-methylimidazole,

[0036] Wherein, the epoxy equivalent of bisphenol A type epoxy resin is 430, and the Mooney viscosity of nitrile rubber is 30, and wherein filler is the mixture of aluminum oxide, aluminum hydroxide and magnesium hydroxide, and wherein aluminum oxide accounts for the total weight of filler 60%, aluminum hydroxide accounts for 20% of filler gross weight, and magnesium hydroxide accounts for 20% of filler gross weight; Wherein said phenoxy resin structural formula is:

[0037]

[0038] The number average molecular weight is 10000;

[0039] Described dicyclopenta...

Embodiment 2

[0045] A metal-based copper-clad laminate for high-power LEDs made of high-performance RCC, including an epoxy resin composition, wherein the mass fraction of solid components of the epoxy resin composition is: (A) bisphenol A epoxy resin 25 parts, 5 parts of phenoxy resin, 20 parts of dicyclopentadiene phenol epoxy resin; (B) 25 parts of rubber; (C) 70 parts of filler; (D) 5 parts of m-phenylenediamine; Base-4-methylimidazole 1 part, wherein the amine curing agent is dicyandiamide, the accelerator is 2-methylimidazole, the epoxy equivalent of bisphenol A epoxy resin is 450, and the Mooney viscosity of nitrile rubber 40, wherein the filler is a mixture of alumina, aluminum hydroxide and magnesium hydroxide, wherein alumina accounts for 80% of the total weight of the filler, aluminum hydroxide accounts for 10% of the total weight of the filler, and magnesium hydroxide accounts for 10% of the total weight of the filler %; wherein the phenoxy resin structural formula is:

[0046...

Embodiment 3

[0053] A metal-based copper-clad laminate for high-power LEDs made of high-performance RCC, including an epoxy resin composition, wherein the mass fraction of solid components of the epoxy resin composition is: (A) bisphenol A epoxy resin 35 parts, 10 parts of phenoxy resin, 30 parts of dicyclopentadiene phenol epoxy resin; (B) 35 parts of rubber; (C) 80 parts of filler; (D) 10 parts of dicyandiamide and diaminodiphenylmethane mixture; (E) 2 parts of a mixture of 2-ethyl-4-methylimidazole and 2-phenylimidazole, wherein the epoxy equivalent of bisphenol A epoxy resin is 450, and the Mooney viscosity of nitrile rubber is 40, wherein The filler is a mixture of alumina, aluminum hydroxide and magnesium hydroxide, wherein alumina accounts for 80% of the total weight of the filler, aluminum hydroxide accounts for 10% of the total weight of the filler, and magnesium hydroxide accounts for 10% of the total weight of the filler; Described phenoxy resin structural formula is:

[0054] ...

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Abstract

The invention relates to a metal-base copper clad laminate manufactured through high-performance RCC (resin coated copper foil) and applied to a high-power LED. The metal-base copper clad laminate comprises epoxy resin composition, wherein solid components of the epoxy resin composition comprise, in parts by mass, as follows: (A) 5-35 parts of bisphenol A type epoxy resin, 0-10 parts of phenoxy resin and 5-30 parts of dicyclopentadiene phenol epoxy resin; (B) 5-35 parts of nitrile rubber; (C) 50-80 parts of filler; (D) 1-10 parts of an amine curing agent; (E) 0.1-2 parts of an accelerant. The metal-base copper clad laminate has good flame retardancy, heat conduction, impact resistance and environmental protection property.

Description

technical field [0001] The invention relates to a metal-based copper-clad laminate for high-power LEDs manufactured by high-performance RCC. Background technique [0002] At present, the existing problems of domestic aluminum substrates: [0003] (1) The gap in thermal conductivity [0004] In China, the selection of thermally conductive fillers used in aluminum substrates, the pretreatment of thermally conductive fillers, the research on the formulation of thermally conductive fillers and modified epoxy resins, and how to ensure that thermally conductive fillers are evenly distributed in the insulating layer have not yet entered into substantial depth. research stage. [0005] (2) The gap in electrical insulation performance [0006] Under the condition of the same thickness, the insulation strength of domestic aluminum substrates can only reach 1 / 3~1 / 4 of the breakdown strength of foreign products. [0007] (3) The gap in mechanical properties [0008] The coefficient...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L63/00C08L9/02C08K3/22C08G59/50C09J163/02C09J163/00C09J109/02C09J11/04B32B15/092B32B15/20B32B37/06B32B37/10B32B37/12
Inventor 罗君林晨
Owner 广东全宝科技股份有限公司
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