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Manufacturing method for improving holing yield of high-frequency circuit board

A manufacturing method and high-frequency board technology, which are applied in chemical/electrolytic methods to remove conductive materials, manufacture printed circuits, and form electrical connections for printed components, etc. Production difficulties and other problems, to achieve the effect of improving product quality, work efficiency, and stable performance

Inactive Publication Date: 2015-05-20
周海梅
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, due to the particularity of the board material, it is extremely difficult to produce the metallization of the hole. The traditional process production is prone to excessive PTH rework, resulting in uneven copper thickness, difficult etching, difficult debugging and even scrapping of the product.

Method used

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Embodiment Construction

[0007] The present invention is a production method for improving the yield rate of high-frequency plate hole formation, which includes the following steps: Step 1: Use a high-precision laser photoplotter with a resolution of 20240dpi to produce a black negative film; use a 200-fold magnifying glass to check the negative film, and use a 5KW The exposure machine copies the diazo sheet; when drilling in step 2, the thickness of the composite board is between 2-4PNL, and the pin hole diameter is drilled at the short side of the composite board with a diameter of 3.2mm. The CNC drilling machine uses a 110-degree drill, and the drill The number of holes drilled by the knife is less than 500 holes, and the burrs and burrs on the surface of the high-frequency board after drilling are treated with sandpaper of more than 2000 mesh; the hole wall of the high-frequency board is soaked with analytical pure sulfuric acid before drilling 5-10 minutes of processing, and then use a sandblastin...

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Abstract

The invention discloses a manufacturing method for improving the holing yield of a high-frequency circuit board. The method comprises a first step of manufacturing engineering and light painting materials, a second step of performing cutting, drilling and through hole plating, a third step of manufacturing a surface pattern, a fourth step of electroplating and etching, a fifth step of performing solder mask and surface solderability treatment, and a sixth step of forming. By adopting the method of the invention, a high-frequency circuit board product with high holing yield and high-precision lines can be manufactured, the product quality and working efficiency are effectively improved, and a high-frequency circuit board manufactured by the method has more stable performance.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a manufacturing method for improving the hole-making yield of high-frequency boards. Background technique [0002] With the development of electronic products in the direction of miniaturization, digitalization, high frequency and high reliability, the application of high frequency circuit boards is becoming more and more extensive. However, due to the particularity of the plate, high-frequency boards are extremely difficult to produce in-hole metallization. Traditional process production is prone to excessive PTH rework, resulting in uneven copper thickness, difficult etching, difficult product debugging and even scrapping. Contents of the invention [0003] The invention provides a method for improving the yield rate of high-frequency plate hole formation, which not only has high manufacturing precision, but also has a one-time yield rate of 99.99%, effectively improvi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K3/22H05K3/00
CPCH05K3/00H05K3/0044H05K3/06H05K3/22
Inventor 周海梅
Owner 周海梅
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