A kind of polyphenylene ether copper clad laminate composition

Abstract

The invention discloses a polyphenyl ether copper-clad laminate composition comprising the following components in parts by weight: 30-60 parts of polyphenyl ether, 20-40 parts of poly-perfluoro-ethylene emulsion, 10-30 parts of organic silicon resin and 10-40 parts of inorganic filler. A copper-clad laminate prepared from the composition is low in dielectric constant and dielectric loss.

Description

technical field [0001] The invention relates to a polyphenylene ether copper clad laminate composition. Background technique [0002] At present, the electronics industry is developing rapidly, and the requirements for the performance of copper clad laminates are getting higher and higher, especially the three major portable electronic products, satellite transmission and communication electronic products. The factors that can directly affect the performance of the above products are basically attributed to the dielectric constant (Dk) and dielectric loss tangent (Df) of the substrate. In order to increase the signal transmission speed to the level required to accelerate information processing, effective The method is to reduce the dielectric constant of the material used. In order to reduce the transmission loss, the effective method is to use a material with a lower dielectric loss factor. [0003] Therefore, polyphenylene ether resin is suitable for circuit board materia...

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Problems solved by technology

[0003] Therefore, polyphenylene ether resin is suitable for circuit board materials in high-frequency electronic equipment, because polyphenylene ether resin has good high-frequency characteristics, such as low dielectric constant, low dielectric loss, etc., but one of polyphenylene ether resin The disadvantage is that it has high melting property, which causes processing defects such as pores during the processing of circuit boards, resulting in unreliable quality of circuit boards

PTFE has the best dielectric constant and dielectric loss factor, but the molding lamination temperature required to make copper clad laminates needs to be above 350°C, which requires high equipment requirements, and due to the repellency of PTFE materials Water-based and its low polarity, the hole metallization of printed boards is different from conventional printed boards, and it is very difficult to metallize and plate holes on it

For the hole metallization of PTFE high-frequency printed circuit boards, it is necessary to use highly oxidizing and corrosive solutions such as tetrahydrofuran, strong acid and strong alkali, etc. for pre-activation treatment before electroless copper deposition. There are complex processes, Unfavorable factors such as bad smell and serious environmental pollution

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