Method for preparing copper chloride hydroxide by simultaneously treating waste etching solution and circuit board sludge

Abstract

The invention discloses a method for preparing copper chloride hydroxide by simultaneously treating a waste etching solution and circuit board sludge. The method comprises the following steps: (1) preparing the circuit board sludge into slurry, screening and activating; (2) performing aeration on the activated slurry to ensure that ferrous iron contained in the sludge is converted into iron hydroxide; (3) mixing a waste acid etching solution with hydrochloric acid, injecting into the aerated slurry, adjusting the pH value, and stirring to obtain acid leached slurry; (4) injecting the aerated slurry into the acid leached slurry to obtain acid liquor containing copper and a solid phase containing iron; (5) adding the solid phase containing iron into a waste alkaline etching solution to prepare alkali liquor containing copper; and (6) controlling the temperature to be 60-85 DEG C, injecting the acid liquor containing copper and the alkali liquor containing copper, controlling the pH value of the system to be 4.0-6.0, reacting for 2-5 hours, and filtering to obtain a copper chloride hydroxide solid and a copper chloride hydroxide production mother solution, wherein the flow ratio of the acid liquor containing copper to the alkali liquor containing copper is 2:(0.5-1.2). By adopting the method disclosed by the invention, the energy consumption of treatment with one of waste acid and alkaline etching solutions can be reduced, and the 'treatment of wastes with processes of wastes against one another' is truly implemented.

Description

technical field

[0001] The invention belongs to the field of waste liquid recovery and utilization, and in particular relates to a method for simultaneously treating etching waste liquid and circuit board sludge to prepare basic copper chloride. Background technique

[0002] Since the rapid development of the electronics industry, a large amount of acidic and alkaline etching waste liquids have been produced in the etching process of printed circuit boards; these waste liquids contain a large amount of copper ions, other heavy metal ions and organic pollutants, and direct discharge will cause environmental damage. Lots of pollution. People have done a lot of research to recycle the waste etching solution. Due to the difference in the composition of the waste acidic etching liquid and the waste alkaline etching liquid, different treatment methods are usually used for recycling, and there are few reports on the process of treating the waste acidic etching liquid and the waste...

Examples

Embodiment 1

[0037] S1. Add 1800mL of water to 1000g circuit board sludge containing 3% copper and 75% water to make a slurry with a water content above 90%, stir for 3 hours, pass through a 600-mesh sieve, and activate;

[0038] S2. Aerate the mud activated by S1 for 2 hours with a Venturi tube, and divide it into two parts, 2000mL of aeration mud A and 500mL of aeration mud B;

[0039] S3. Mix 1300mL of acidic etching waste liquid containing 8% copper and a density of 1.25g / ml with 65mL of 31% hydrochloric acid, then inject it into aeration mud A, adjust the pH to 0.5, and stir for 1 hour to obtain acid leaching mud C 3300mL;

[0040] S4. Slowly inject 340mL of aeration mud B into acid leaching mud C, adjust its pH to 2.5, stir for 1 hour, add 0.5mL of 0.1% polyacrylamide (cationic) solution, and suction filter to obtain the suction liquid phase and the solid phase; rinse the solid phase with tap water twice (550 mL each time), mix the rinse liquid with the suction filtrate, and absorb ...

Embodiment 2

[0045] S1. 1000g circuit board sludge containing 4.5% copper and 80% water content, add 2800mL water to make a slurry with a water content above 92.5%, stir for 2 hours, pass through a 500-mesh sieve, and activate;

[0046] S2. Use a Venturi tube to aerate the mud activated by S1 for 3.5 hours, and divide it into two parts, aeration mud A 3050mL, aeration mud B 650mL;

[0047] S3. Mix 1400mL of acidic etching waste liquid containing 9% copper and density of 1.3g / ml with 175mL of 31% hydrochloric acid, then inject it into the aeration mud A, adjust the pH to 1.5, and stir for 2 hours to obtain 4600mL of acid leaching mud C ;

[0048] S4. Slowly inject 640mL of aeration mud B into acid leaching mud C, adjust its pH to 2.8, stir for 2 hours, add 1mL of 0.08% polyacrylamide (anionic) solution, and suction filter to obtain the suction liquid phase and Solid phase; rinse the solid phase with tap water for 3 times (390mL each time), mix the rinse solution with the suction filtrate, ...

Embodiment 3

[0053] S1. 1000g circuit board sludge containing 6% copper and 85% water, add 4600mL water to make a slurry with a water content above 95%, stir for 1 hour, pass through a 400-mesh sieve, and activate;

[0054] S2. Use a Venturi tube to aerate the mud activated by S1 for 5 hours, and divide it into two parts, aeration mud A 4750mL, aeration mud B 850mL;

[0055] S3. Mix 1000mL of acidic etching waste liquid containing 10% copper and density of 1.35g / ml with 250mL of 31% hydrochloric acid, then inject into aeration mud A, adjust the pH to 2, and stir for 3 hours to obtain 6000mL of acid leaching mud C ;

[0056] S4. Slowly inject 850mL of aeration mud B into acid leaching mud C, adjust its pH to 3.2, stir for 3 hours, add 1.5mL of 0.05% polyacrylamide (non-ionic) solution, and suction filter to obtain the suction filtrate phase and solid phase; rinse the solid phase with tap water twice (300 mL each time), mix the rinse liquid with the suction filtrate, and absorb the COD in t...

technical field

[0001] The invention belongs to the field of waste liquid recovery and utilization, and in particular relates to a method for simultaneously treating etching waste liquid and circuit board sludge to prepare basic copper chloride. Background technique

[0002] Since the rapid development of the electronics industry, a large amount of acidic and alkaline etching waste liquids have been produced in the etching process of printed circuit boards; these waste liquids contain a large amount of copper ions, other heavy metal ions and organic pollutants, and direct discharge will cause environmental damage. Lots of pollution. People have done a lot of research to recycle the waste etching solution. Due to the difference in the composition of the waste acidic etching liquid and the waste alkaline etching liquid, different treatment methods are usually used for recycling, and there are few reports on the process of treating the waste acidic etching liquid and the waste...

Examples

Embodiment 1

[0037] S1. Add 1800mL of water to 1000g circuit board sludge containing 3% copper and 75% water to make a slurry with a water content above 90%, stir for 3 hours, pass through a 600-mesh sieve, and activate;

[0038] S2. Aerate the mud activated by S1 for 2 hours with a Venturi tube, and divide it into two parts, 2000mL of aeration mud A and 500mL of aeration mud B;

[0039] S3. Mix 1300mL of acidic etching waste liquid containing 8% copper and a density of 1.25g / ml with 65mL of 31% hydrochloric acid, then inject it into aeration mud A, adjust the pH to 0.5, and stir for 1 hour to obtain acid leaching mud C 3300mL;

[0040] S4. Slowly inject 340mL of aeration mud B into acid leaching mud C, adjust its pH to 2.5, stir for 1 hour, add 0.5mL of 0.1% polyacrylamide (cationic) solution, and suction filter to obtain the suction liquid phase and the solid phase; rinse the solid phase with tap water twice (550 mL each time), mix the rinse liquid with the suction filtrate, and absorb ...

Embodiment 2

[0045] S1. 1000g circuit board sludge containing 4.5% copper and 80% water content, add 2800mL water to make a slurry with a water content above 92.5%, stir for 2 hours, pass through a 500-mesh sieve, and activate;

[0046] S2. Use a Venturi tube to aerate the mud activated by S1 for 3.5 hours, and divide it into two parts, aeration mud A 3050mL, aeration mud B 650mL;

[0047] S3. Mix 1400mL of acidic etching waste liquid containing 9% copper and density of 1.3g / ml with 175mL of 31% hydrochloric acid, then inject it into the aeration mud A, adjust the pH to 1.5, and stir for 2 hours to obtain 4600mL of acid leaching mud C ;

[0048] S4. Slowly inject 640mL of aeration mud B into acid leaching mud C, adjust its pH to 2.8, stir for 2 hours, add 1mL of 0.08% polyacrylamide (anionic) solution, and suction filter to obtain the suction liquid phase and Solid phase; rinse the solid phase with tap water for 3 times (390mL each time), mix the rinse solution with the suction filtrate, ...

Embodiment 3

[0053] S1. 1000g circuit board sludge containing 6% copper and 85% water, add 4600mL water to make a slurry with a water content above 95%, stir for 1 hour, pass through a 400-mesh sieve, and activate;

[0054] S2. Use a Venturi tube to aerate the mud activated by S1 for 5 hours, and divide it into two parts, aeration mud A 4750mL, aeration mud B 850mL;

[0055] S3. Mix 1000mL of acidic etching waste liquid containing 10% copper and density of 1.35g / ml with 250mL of 31% hydrochloric acid, then inject into aeration mud A, adjust the pH to 2, and stir for 3 hours to obtain 6000mL of acid leaching mud C ;

[0056] S4. Slowly inject 850mL of aeration mud B into acid leaching mud C, adjust its pH to 3.2, stir for 3 hours, add 1.5mL of 0.05% polyacrylamide (non-ionic) solution, and suction filter to obtain the suction filtrate phase and solid phase; rinse the solid phase with tap water twice (300 mL each time), mix the rinse liquid with the suction filtrate, and absorb the COD in t...

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