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Phenol-formaldehyde resin adhesive

A phenolic resin glue and phenolic resin technology, applied in the field of polymer chemistry, can solve the problems of high technical requirements for equipment and personnel, high vacuum degree requirements, harsh reaction conditions, etc., to reduce equipment investment, reduce energy consumption, and simple operation. Effect

Active Publication Date: 2015-06-10
浙江永金生物科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The following problems exist in the above-mentioned route: the reaction conditions are harsh, a high temperature of 300°C is required, the vacuum degree is very high, and the technical requirements for equipment and personnel are also very high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The phenolic resin adhesive of the present invention is made according to the following steps:

[0029] The first step is to add vinyltrimethoxysilane and boric acid to diethylene glycol dimethyl ether, and in the presence of stannous chloride, gradually raise the temperature from 90°C to 140°C within 3 hours under a nitrogen atmosphere, and continue React for 4 hours; then add catechol, react for 6 hours, and react for 2 hours under reduced pressure of the water pump to obtain polyborosiloxane; the molar ratio of vinyltrimethoxysilane: boric acid: catechol is 1:1:0.5, The amount of stannous chloride is 1‰ of the total mass of the monomer.

[0030] The second step is to add rosin to the reaction kettle, heat to dissolve and stir, and heat up to 95°C; add dodecylphenol, stir until it is completely dissolved and mixed evenly, and then add formaldehyde, simethicone, oxalic acid and toluenesulfonic acid Reactor, heat up to 150°C, increase the pressure to 0.7Mpa, and react ...

Embodiment 2

[0033] The first step is to add vinyltrimethoxysilane and boric acid to diethylene glycol dimethyl ether, and in the presence of titanium tetrachloride, gradually increase the temperature from 90°C to 140°C within 3 hours under a nitrogen atmosphere, and continue React for 4 hours; then add catechol, react for 6 hours, and react for 2 hours under reduced pressure of the water pump to obtain polyborosiloxane; the molar ratio of vinyltrimethoxysilane: boric acid: catechol is 1:1:0.5, The dosage of titanium tetrachloride is 1‰ of the total mass of the monomer.

[0034] The second step is to add rosin to the reaction kettle, heat to dissolve and stir, and heat up to 95°C; add dodecylphenol, stir until it is completely dissolved and mixed evenly, and then add formaldehyde, simethicone, oxalic acid and toluenesulfonic acid Reactor, heat up to 150°C, increase the pressure to 0.7Mpa, and react at constant temperature and pressure for 2 hours to obtain the rosin condensation intermedia...

Embodiment 3

[0037] The first step is to add vinyltrimethoxysilane and boric acid to diethylene glycol dimethyl ether, in the presence of iron oxide, gradually increase the temperature from 90°C to 140°C within 3 hours under nitrogen atmosphere, and continue the reaction 4h; then add catechol, react for 6h, and after the water pump decompression reaction for 2h, polyborosiloxane is obtained; the molar ratio of vinyl trimethoxysilane: boric acid: catechol is 1:1:0.5, three The amount of iron oxide is 1‰ of the total mass of the monomer.

[0038] The second step is to add rosin to the reaction kettle, heat to dissolve and stir, and heat up to 95°C; add dodecylphenol, stir until it is completely dissolved and mixed evenly, and then add formaldehyde, simethicone, oxalic acid and toluenesulfonic acid Reactor, heat up to 150°C, increase the pressure to 0.7Mpa, and react at constant temperature and pressure for 2 hours to obtain the rosin condensation intermediate; then add pentaerythritol, triet...

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PUM

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Abstract

The invention relates to a phenol-formaldehyde resin adhesive. The phenol-formaldehyde resin adhesive is characterized by being prepared from the following steps: (1) synthesizing polyborosiloxane; (2) synthesizing rosin modified phenol-formaldehyde resin; and (3) preparing the adhesive. According to the phenol-formaldehyde resin adhesive disclosed by the invention, a method for preparing the polyborosiloxane is relatively mild in conditions and simple in operation, is free from the generation of harmful gases and is environment-friendly, and the prepared polyborosiloxane has excellent high-temperature resistance; and meanwhile, the rosin modified phenol-formaldehyde resin and the polyborosiloxane are combined so as to provide the adhesive with a better adhesive property, and thus, the application prospect is good.

Description

technical field [0001] The application date of this invention is August 27, 2013, the application number is: 201310377814.2, and the divisional application of the invention patent application named "a phenolic resin adhesive". The invention belongs to the field of polymer chemistry, in particular to a phenolic resin adhesive. Background technique [0002] Polyborosiloxane has excellent heat resistance. Some studies have used boric acid and silicone prepolymers to prepare polyborosiloxane and used it to modify phenolic resins. The carbon residue rate of the modified resins has been greatly improved, but the modified phenolic resin adhesives The cohesive force was not significantly improved (Zhang Bin et al., Polymer Materials Science and Engineering, 2008, 152). There are studies on introducing hydroquinone structure into polyborosiloxane to obtain polyborosiloxane. At present, the following technical route is mainly used for preparation: applying melt polycondensation meth...

Claims

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Application Information

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IPC IPC(8): C09J161/14C09J183/14C08G77/56C08G8/34
Inventor 俞国宏
Owner 浙江永金生物科技有限公司
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