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A lead-free thick film conductor paste for aluminum nitride substrate

A lead-free thick film, conductor paste technology, applied in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, electrical components, etc., can solve the problem of poor wettability of AIN ceramic substrates, conductor paste Material loss of adhesion and other problems

Active Publication Date: 2017-01-18
无锡海古德新技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The application of aluminum nitride materials in thick film paste technology has gradually replaced alumina ceramic substrates in some high-end fields, while the traditional thick film conductor pastes are mainly developed for the development of alumina substrates, all of which use boron Lead silicate system or lead-zinc borosilicate system, but these systems use highly toxic lead oxide (PbO) as the main component. PbO-based glass frit is used on AlN ceramic substrates, and reacts on the interface to generate a large number of bubbles. Even the surface of the AIN ceramic substrate is oxidized, the wettability of the AIN ceramic substrate becomes poor, and the conductive paste loses its adhesion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Preparation of glass powder by melting method

[0023] The glass powder is made by smelting method, and the SiO 2 20g, B 2 o 3 15g, ZnO55g, Bi 2 o 3 7g, ZrO 2 2.5g, MgO0.5g, fully mixed and put into a crucible, heated and melted at 1180°C, quenched in water, ball milled to obtain the required glass powder, the particle size of the glass powder is 2-8μm; at 60°C, prepare organic Solution, take by weighing 4.2g butyl carbitol, 4.2g xylene, 4.2g absolute ethanol, 0.55g polyvinyl butyral, 0.55g polyethylene glycol, 0.15g lecithin, 0.15g castor oil and fully stir instant;

[0024] Select 70g of Ag powder with a particle size of 4μm, 10g of Pd powder with a particle size of 0.8μm, and 6g of glass powder with a particle size of 2μm. After fully mixing, add 14g of organic carrier to fully mix and grind to obtain the required thick film conductor paste. The thick film conductor paste that is made is printed on the aluminum nitride ceramic substrate by screen printing tech...

Embodiment 2

[0026] Preparation of glass powder by melting method

[0027] The glass powder is made by smelting method, and the SiO 2 25g, B 2 o 3 15g, ZnO50g, Bi 2 o 3 6g, ZrO 2 3g and 1g of MgO meet the above weight percentages, fully mix them into the crucible, heat and melt at 1200°C, quench in water, and ball mill to get the required glass powder, the particle size of the glass powder is 2-8μm; at 70°C Next, prepare an organic carrier, weigh 3g butyl carbitol, 3g xylene, 3g absolute ethanol, 0.4g polyvinyl butyral, 0.4g polyethylene glycol, 0.1g lecithin, 0.1g castor oil Stir and serve;

[0028] Select 70g of Ag powder with a particle size of 8μm, 12g of Pd powder with a particle size of 2μm, and 8g of glass powder with a particle size of 4μm. The formed thick film conductor paste was printed on an aluminum nitride ceramic substrate by screen printing technology, and baked for 15 minutes (min) at 880°C in air to test its performance. The square resistance was 5.4mΩ / □(0.6 mm×60...

Embodiment 3

[0030] Preparation of glass powder by melting method

[0031] The glass powder is made by smelting method, and the SiO 2 30g, B 2 o 3 10g, ZnO50g, Bi 2 o 3 6g, ZrO 2 2g, MgO 2 g The components that meet the above weight percentages are fully mixed and put into a crucible, heated and melted at 1250°C, quenched in water, and ball milled to obtain the required glass powder. The particle size of the glass powder is 2-8 μm; at 80°C, Prepare organic carrier, weigh 3.52g butyl carbitol, 3.52g xylene, 3.52g absolute ethanol, 0.6g polyvinyl butyral, 0.6g polyethylene glycol, 0.12g lecithin, 0.12g castor oil Mix well;

[0032] Select 68g of Ag powder with a particle size of 6μm, 12g of Pd powder with a particle size of 2μm, and 8g of glass powder with a particle size of 3μm. The thick-film conductor paste was printed on the aluminum nitride ceramic substrate by screen printing technology, and baked for 10 minutes (min) at 880°C in air to test its performance. The square resistan...

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PUM

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Abstract

The invention discloses unleaded thick film conductive paste for an aluminium nitride substrate. The unleaded thick film conductive paste for the aluminium nitride substrate comprises, by weight, 75-85 parts of silver-palladium metal powder, 6-12 parts of glass powder, and 10-20 parts of organic carriers. The provided unleaded thick film conductive paste for the aluminium nitride substrate is developed mainly for the aluminium nitride (AlN) substrate, and is applicable to the manufacturing of an aluminium nitride (AlN) power load product of high power, high reliability, high frequency, small volume and stable performance; a glass system adopted does not include highly toxic lead oxide and has the advantages of low melting point, moderate expansion, good wettability and the like, and no reaction with the aluminium nitride (AlN) substrate occurs, the conductivity of a prepared thick film conductive layer is good, and adhesive force between the prepared thick film conductive layer and the aluminium nitride (AlN) substrate is strong.

Description

technical field [0001] The invention relates to the field of thick-film paste, in particular to a lead-free thick-film conductor paste for aluminum nitride substrates with good adsorption force and good electrical conductivity. Background technique [0002] At present, the commonly used substrate material in the thick film paste process is alumina with better performance, but with the requirements for the thermal conductivity of the substrate material (there are also requirements for the dielectric constant in radio frequency products), the industry The first thing I thought of was to develop beryllium oxide, because it has the best power characteristics; but in several years of development, when beryllium oxide was just in a semi-mature state of technology and technology, the European Union proposed that beryllium oxide was highly toxic and not environmentally friendly. It is harmful to the human body, so it is restricted in many products. The proposal of ROHS ("Restrictio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 彭海孙伟
Owner 无锡海古德新技术有限公司