Low-temperature lead-free tin paste and production technique for paste flux thereof

A technology of lead-free solder paste and flux paste, applied in the direction of soldering media, manufacturing tools, welding equipment, etc., can solve the problems of low-temperature lead-free solder paste activity, non-wetting, and no way to remove the surface oxide layer. Achieve excellent welding effect, complete reaction, and reduce welding defects

Active Publication Date: 2015-09-09
深圳海诚锡元科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the activity of the existing low-temperature lead-free solder paste is not high, which makes it impossible to remove the surface oxide layer for nickel-plated and copper-plated pads, resulting in soldering defects, such as virtual soldering, tombstoning, solder balls, non-wetting and other undesirable phenom...

Method used

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  • Low-temperature lead-free tin paste and production technique for paste flux thereof
  • Low-temperature lead-free tin paste and production technique for paste flux thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A low-temperature lead-free solder paste comprises the following materials in weight percentage: 90% of tin powder and 10% of solder paste. Wherein, the tin powder is Sn42Bi58 alloy. Described flux paste is mainly made up of following weight percentage material:

[0026] Rosin: 36%

[0027] Solvents: Macrogol 400 10%, Ethylene Glycol 5%, 2-Methyl-2,4 Pentanediol 25%

[0028] Thickener: 12%

[0029] Thixotropic agent: modified hydrogenated castor oil 1.5%, modified polyamide wax 3%

[0030] Active agent: 2% tetracosanoic acid, 2% suberic acid, 2% dihydroxymethylpropionic acid, 0.5% dibromoethylbenzene, 1% diethylamine;

[0031] The production process of the above-mentioned low-temperature lead-free solder paste flux paste comprises the following steps:

[0032] 1), take the following materials by weight percentage: rosin 36%, solvent: polyethylene glycol 400 10%, ethylene glycol 5%, 2-methyl-2,4-pentanediol 25%, thickener 12%; Add it into the container and stir it ...

Embodiment 2

[0038] A low-temperature lead-free solder paste comprises the following materials in weight percentage: 87% of tin powder and 13% of solder paste. Wherein, the tin powder is Sn42Bi58 alloy. Described flux paste is mainly made up of following weight percentage material:

[0039] Rosin: 45%

[0040] Solvents: Macrogol 400 10.5%, Tetrahydrofurfuryl Alcohol 5%, 2-Methyl-2,4 Pentanediol 25%

[0041] Thickener: 5%

[0042] Thixotropic agent: modified hydrogenated castor oil 1.5%, modified polyamide wax 3%

[0043] Active agent: 1% dihydroxymethyl butyric acid, 1% maleic acid, 1% anhydrous oxalic acid, 1% dibromobutenediol, 1% triethanolamine;

[0044] The production process of the above-mentioned low-temperature lead-free solder paste flux paste comprises the following steps:

[0045] 1), take the following materials by weight percentage: rosin 45%, solvent: polyethylene glycol 400 10.5%, tetrahydrofurfuryl alcohol 5%, 2-methyl-2,4-pentanediol 25%, thickener 5%; Add it into th...

Embodiment 3

[0051] A low-temperature lead-free solder paste comprises the following materials in weight percentage: 90% of tin powder and 10% of solder paste. Wherein, the tin powder is Sn64.6Bi35Ag0.4 alloy. Described flux paste is mainly made up of following weight percentage material:

[0052] Rosin: 35%

[0053] Solvent: Macrogol 400 12%, Ethylene Glycol 6%, Hydrogenated Rosin Propyl Ether 30%

[0054] Thickener: 5%

[0055] Thixotropic agent: modified hydrogenated castor oil 1.5%, modified polyamide wax 3%

[0056] Active agents: maleic acid 2.5%, phenylsuccinic acid 1.5%, dibromobutenediol 1.5%, triisopropanolamine 2%;

[0057]The production process of the above-mentioned low-temperature lead-free solder paste flux paste comprises the following steps:

[0058] 1), get the material of following percentage by weight: Rosin 35%, solvent: macrogol 400 12%, ethylene glycol 6%, hydrogenated rosin propyl ether 30%, thickener 5%; Add in the container, at 90 At -130°C, stir with a stir...

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Abstract

The invention relates to the technical field of electronic welding, in particular to low-temperature lead-free tin paste and a production technique for paste flux thereof. The low-temperature lead-free tin paste includes 87-90% of tin powder and 10-13% of paste flux by weight; the tin powder is tin bismuth base, tin bismuth copper base and tin bismuth silver base alloy, and the paste flux is composed of 35-45% of rosin, 40-48% of solvent, 5-12% of thickening agent, 4.5% of thixotropic agent and 5-8% of active agent by weight; the solvent is low-boiling point solvent; the thixotropic agent is composed of modified hydrogenated castor oil and modified polyamide wax, and the best weight ratio is 1: 2; the active agent is mainly composed of 3-6% of organic acid, 0.5-1.5% of surface active agent and 1-2% of organic amine; the paste flux is prepared according to a special technique. The low-temperature lead-free tin paste is excellent in activity, suitable for welding bonding pads with different kinds of clad layers, excellent in viscosity stability and excellent in printing property, and the welding spot corrosion is avoided.

Description

【Technical field】 [0001] The invention relates to the technical field of electronic soldering, in particular to a production process of low-temperature lead-free solder paste and solder flux paste. 【Background technique】 [0002] Solder paste is a new type of soldering material that emerged with SMT, and is mainly used for soldering electronic components such as PCB surface resistance, capacitors, and ICs in the SMT industry. Now with the development of the industry, the demand for solder paste is also increasing, and the scope of use is becoming wider and wider. For radiator module soldering, LED soldering, and high-frequency soldering that have emerged in recent years, components cannot withstand temperatures of 200°C and above, but low-temperature lead-free solder paste meets this soldering temperature, and its soldering peak temperature is 170-200°C , to protect components and PCBs that cannot withstand high temperatures. However, the activity of the existing low-tempe...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/362
CPCB23K35/262B23K35/3612B23K35/362
Inventor 谢英健吴秋霞
Owner 深圳海诚锡元科技有限公司
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