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Adhesive film, adhesive film integrated with dicing sheet, adhesive film integrated with back grind tape, adhesive film integrated with back grind tape cum dicing sheet, laminate, cured product of laminate, semiconductor device, and process for producing semiconductor device

A technology of adhesive film and laminate, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as difficult filling, and achieve the effect of improving reliability and increasing yield

Active Publication Date: 2015-11-04
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as semiconductor devices become thinner and miniaturized, the soldering portion becomes narrower in pitch / gap, so even if a liquid sealing resin (underfill material) is supplied after soldering, the liquid sealing resin (underfill material) will not Will not spread over the gaps, causing problems that are difficult to fill completely

Method used

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  • Adhesive film, adhesive film integrated with dicing sheet, adhesive film integrated with back grind tape, adhesive film integrated with back grind tape cum dicing sheet, laminate, cured product of laminate, semiconductor device, and process for producing semiconductor device
  • Adhesive film, adhesive film integrated with dicing sheet, adhesive film integrated with back grind tape, adhesive film integrated with back grind tape cum dicing sheet, laminate, cured product of laminate, semiconductor device, and process for producing semiconductor device
  • Adhesive film, adhesive film integrated with dicing sheet, adhesive film integrated with back grind tape, adhesive film integrated with back grind tape cum dicing sheet, laminate, cured product of laminate, semiconductor device, and process for producing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0261]

[0262] 14.26 parts by weight of cresol novolak resin (manufactured by DIC Corporation, KA-1160), 39.73 parts by weight of bisphenol F-type epoxy resin (manufactured by DIC Corporation, EXA-830LVP), trimellitic acid ( 10.50 parts by weight of Tokyo Chemical Industry Co., Ltd., 5.07 parts by weight of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, YX-6954) as a film-forming resin, 2-phenyl-4-methylimidazole as a curing accelerator (Shikoku Chemical Industry Co., Ltd., 2P4MZ) 0.09 parts by weight, 3-glycidoxypropyltrimethoxysilane (Shikoku Chemical Industry Co., Ltd., KBM-403) 0.35 parts by weight as a silane coupling agent, and two 30.00 parts by weight of silica filler (manufactured by Admatechs, SC1050, average particle diameter: 0.25 μm) was dissolved and dispersed in methyl ethyl ketone to prepare a resin varnish having a resin concentration of 50%.

[0263] The obtained adhesive film varnish was coated on a substrate polyester film (base film, ma...

Embodiment 2

[0265]

[0266] 25.15 parts by weight of biphenyl aralkyl-type phenolic resin (Meiwa Kasei Co., Ltd., MEH-7851), 32.10 parts by weight of bisphenol F-type epoxy resin (manufactured by DIC Corporation, EXA-830LVP), and a compound having flux activity 8.60 parts by weight of trimellitic acid (manufactured by Tokyo Chemical Industry Co., Ltd.), 3.90 parts by weight of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, YX-6954) as a film-forming resin, 2-phenyl- 0.05 parts by weight of 4-methylimidazole (manufactured by Shikoku Chemical Industry Co., Ltd., 2P4MZ), 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403) as a silane coupling agent 0.20 parts by weight, 5.00 parts by weight of silica filler (AEROSIL 200, manufactured by Nippon Aerosil Co., Ltd.) and 25.00 parts by weight of silica filler (manufactured by Admatechs, YA050C with an average particle size of 0.05 μm) were dissolved and dispersed in methyl ethyl ketone , a ...

Embodiment 3

[0269]

[0270] 10.20 parts by weight of phenol aralkyl resin (XLC-4L manufactured by Mitsui Chemicals Co., Ltd.), 22.00 parts by weight of bisphenol A type epoxy resin (manufactured by DIC Corporation, EPICLON 840-S), and phenolphthalein ( Tokyo Chemical Industry Co., Ltd.) 8.20 parts by weight, 9.30 parts by weight of an epoxy group-containing acrylate copolymer (manufactured by Nagase ChemteX Corporation, SG-P3) as a film-forming resin, 2-methylimidazole as a curing accelerator (Shikoku Chemical Industry Co., Ltd., 2MZ-H) 0.05 parts by weight, 3-methacryloxypropyltriethoxysilane (Shikoku Chemical Industry Co., Ltd., KBE-503) 0.25 parts by weight as a silane coupling agent 50.00 parts by weight of silica filler (manufactured by Admatechs, SC1050 with an average particle diameter of 0.25 μm) was dissolved and dispersed in methyl ethyl ketone to prepare a resin varnish having a resin concentration of 50%.

[0271] The obtained adhesive film varnish was coated on a substrate ...

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Abstract

The purpose of the present invention is to provide an adhesive film (10) which exhibits sufficient transparency and ensures high reliability of solder joints. The present invention is an adhesive film (10) which is for use in inter-terminal connection and which is to be interposed between an electronic component (20) having multiple first terminals (21) on the surface and a circuit component (30) having multiple second terminals (31) corresponding to the first terminals (21), the first terminals (21) being to be electrically connected to the second terminals (31), wherein: each first terminal (21) has a width of 3 to 100μm, and bears a low-melting metal composition part that covers at least a part of the surface thereof so as to satisfy the requirements 0.6<A / B<1.4 and 2μm≤B≤170μm [wherein A is the width of the first terminal (21) and B is the width of the metal composition part]; and the distance between the metal composition parts on adjacent first terminals (21) is 3 to 60μm. The adhesive film (10) comprises a resin composition containing 10 to 70wt% of a filler and has a surface roughness (Ra) of 0.03 to 1.0μm.

Description

technical field [0001] The present invention relates to an adhesive film, an adhesive film integrated with a dicing sheet, an adhesive film integrated with a back grinding tape, an adhesive film integrated with a back grinding tape and a dicing sheet, and a laminate A body, a cured product of a laminate, a semiconductor device, and a method for manufacturing the semiconductor device. [0002] This application claims priority based on Japanese Patent Application No. 2013-045020 for which it applied in Japan on March 7, 2013, and uses the content here. Background technique [0003] In recent years, with the demand for higher functionality and thinner and shorter electronic equipment, the number of semiconductor devices used in these electronic equipment has also increased compared to the past, and miniaturization and multi-pins have gradually progressed. Soldering is widely used in order to obtain electrical connections between electronic components in these semiconductor dev...

Claims

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Application Information

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IPC IPC(8): H01L21/60C09J7/00C09J11/04C09J163/00H01L21/301H01L23/29H01L23/31C09J7/35
CPCC09J7/00C09J11/04C09J163/00H01L21/563H01L21/6836H01L23/293H01L23/295H01L24/13H01L24/16H01L24/29H01L24/32H01L24/81H01L24/83H01L24/91H01L2221/68377H01L2224/13005H01L2224/13017H01L2224/13076H01L2224/13082H01L2224/16058H01L2224/16237H01L2224/26175H01L2224/27436H01L2224/2929H01L2224/29298H01L2224/73104H01L2224/73204H01L2224/81191H01L2224/81903H01L2224/83191H01L2224/8385H01L2224/9211C08G59/621C09J2203/326C09J7/35H01L2924/207H01L2224/81H01L2224/83
Inventor 前岛研三
Owner SUMITOMO BAKELITE CO LTD
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