Ultra-low dielectric constant microwave dielectric ceramic HoYV2O8 with high thermal stability and low loss

Abstract

The invention discloses temperature-stable ultra-low dielectric constant microwave dielectric ceramic HoYV2O8 which is of a tetragonalzirconia structure and can be sintered at low temperature and a preparation method thereof. The preparation method comprises the steps that 1, Ho2O3, Y2O3 and V2O5 original powder with the purity above 99.9 percent by weight is weighed and batched according to the composition of the HoYV2O8; 2, wetted ball grinding and mixing are performed on the raw materials in the step 1 for 12 hours, a ball milling medium adopts distilled water, and presintering is performed on the mixture in the air atmosphere at 800 DEG C for six hours after the mixture is dried; 3, a binding agent is added in powder prepared in the step 2, pelleting is performed, then compression moulding is performed, and lastly sintering is performed in the air atmosphere at 850-900 DEG C for four hours, wherein the binding agent adopts a polyving akohol solution with the mass concentration of 5 percent, and the additive amount of polyving akohol accounts for 3 percent of the total mass of the powder. The prepared ceramic can be well sintered below 900 DEG C, the dielectric constant reaches 10.9 to 11.5, the quality factor Qf value reaches up to 113000-142000 GHz, the temperature coefficient of resonance frequency is small, and the great application value is achieved in industry.

Description

technical field [0001] The invention relates to a dielectric ceramic material, in particular to a dielectric ceramic material for manufacturing microwave components such as ceramic substrates, resonators and filters used in microwave frequencies and a preparation method thereof. Background technique [0002] Microwave dielectric ceramics refer to ceramics that are used as dielectric materials in circuits in the microwave frequency band (mainly UHF and SHF bands) and perform one or more functions. They are widely used as resonators, filters, and dielectric substrates in modern communications. Components such as chips and dielectric waveguide circuits are the key basic materials of modern communication technology. They have been used in portable mobile phones, car phones, cordless phones, TV satellite receivers and military radars. They are used in modern communication tools. It is playing an increasingly important role in the process of miniaturization and integration. [00...

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Problems solved by technology

[0009] In the process of exploring and developing new low-firing microwave dielectric ceramic materials, material systems such as Li-based compounds, Bi-based compounds, tungstate compounds and tellurate-based compounds with inherently low sintering temperatures have received extensive attention and research. However, due to the three performance indicators of microwave dielectric ceramics (ε r with Q f and τ ? ) is a mutually restrictive relationship (see literature: The restrictive relationship between the dielectric properties of microwave dielectric ceramic materials, Zhu Jianhua, Liang Fei, Wang Xiaohong, Lu Wenzhong, Electronic Components and Materials, Issue 3, March 2005), satisfying three There are very few single-phase microwave dielectric ceramics that require high performance and can be sintered at low temperature, mainly because their resonant frequency temperature coefficient is usually too large or the quality factor is too low to meet the practical application requirements.

At present, most of the research on microwave dielectric ceramics is a summary of experience obtained through a large number of experiments, but there is no complete theory to explain the relationship between microstructure and dielectric properties. Predict the microwave dielectric properties such as its resonant frequency temperature coefficient and quality factor, which largely limits the development of low temperature co-firing technology and microwave multilayer devices

Exploring and developing microwave dielectric ceramics that can be sintered at low temperature and have near-zero resonant frequency temperature coefficient (-10ppm / ℃≤τ?≤+10ppm / ℃) and high quality factor is the technology in this field A difficult problem that people have always wanted to solve but have never been able to succeed in

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