Special polishing liquid suitable for gallium oxide substrate polishing and preparation method thereof
A substrate substrate, gallium oxide technology, applied in the direction of polishing compositions containing abrasives, etc., can solve the problems of strong acid and alkali resistance, no cleavage properties, etc., and achieve the effect of convenient cleaning
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Embodiment 1
[0051] Dissolve 1 mass part of disodium edetate, 1.5 mass parts of sodium hydroxide and 1 mass part of triethanolamine in 47 mass parts of deionized water. After sodium oxide and triethanolamine are fully dissolved, then the octylphenol polyoxyethylene ether (10) of 0.5 mass parts and the defoamer of 0.1 mass parts are also dissolved in described deionized water, treat described surfactant and defoamer After the foaming agent was fully dissolved, the obtained mixed solution was slowly added dropwise to 50 parts by mass of the silica sol emulsion which was constantly being stirred, so as to prepare the polishing solution of the present invention.
[0052] The particle size of silicon dioxide in the silica sol emulsion is 15nm, and the mass concentration of silicon dioxide is 40%.
Embodiment 2
[0054] First, 1 mass part of tetrasodium edetate, 0.5 mass part of sodium hydroxide and 1 mass part of triethanolamine are dissolved in 47.5 mass parts of deionized water, and the disodium edetate, hydrogen After sodium oxide and triethanolamine are fully dissolved, then the octylphenol polyoxyethylene ether (10) of 0.5 mass parts and the defoamer of 0.1 mass parts are also dissolved in described deionized water, treat described surfactant and defoamer After the foaming agent was fully dissolved, the obtained mixed solution was slowly added dropwise to 50 parts by mass of the silica sol emulsion which was constantly being stirred, so as to prepare the polishing solution of the present invention.
[0055] The particle size of silicon dioxide in the silica sol emulsion is 15nm, and the mass concentration of silicon dioxide is 40%.
[0056] Using the polishing solution obtained in the above-mentioned preferred embodiment 1 and preferred embodiment 2 to carry out chemical mechanic...
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